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Super insulation silicon-titanium thermal insulation board and manufacturing method thereof

A manufacturing method and technology for thermal insulation boards, which are applied in the field of thermal insulation materials, can solve the problems of increased thermal conductivity of vacuum thermal insulation boards, increased difficulty and cost of use, and increased internal pressure, and achieve the effect of increasing wear resistance and maximum surface hardness value.

Inactive Publication Date: 2018-07-03
中亨新型材料科技有限公司
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  • Abstract
  • Description
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Problems solved by technology

[0005] In the existing literature reports related to it, the barrier layer material of the vacuum insulation panel is mainly composed of plastic film and aluminum film. The vacuum insulation panel cannot withstand large external forces and is very easy to be damaged. Requires additional protection measures, thus increasing difficulty and cost of use
In addition, during use, the film barrier layer is also prone to aging, and the gas gradually penetrates into the vacuum insulation panel, increasing the internal pressure, resulting in an increase in the thermal conductivity of the vacuum insulation panel, which cannot be used for a long time

Method used

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  • Super insulation silicon-titanium thermal insulation board and manufacturing method thereof
  • Super insulation silicon-titanium thermal insulation board and manufacturing method thereof
  • Super insulation silicon-titanium thermal insulation board and manufacturing method thereof

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Embodiment Construction

[0039] While the invention may readily manifest in different forms of embodiments, only a few specific embodiments have been shown in the drawings and will be described in detail in this specification, with the understanding that the specification should be considered as the These are exemplary illustrations of the principles of the invention and are not intended to limit the invention to what is described herein.

[0040] Therefore, a feature indicated in this specification will be used to describe one feature of an embodiment of the present invention, rather than implying that every embodiment of the present invention must have the described feature. Furthermore, it should be noted that this specification describes a number of features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly described. Thus, the illustrated combinations are not intended to be limiting unless otherw...

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Abstract

The invention relates to the technical field of thermal insulation materials, and provides a super insulation silicon-titanium thermal insulation board and a manufacturing method thereof. The super insulation silicon-titanium thermal insulation board is formed by casting, sintering or pressing, and comprises 15-35wt% of titanium metal parent metal which is composited on 65-85wt% of nano siliciousthermal insulating material; the nano silicious thermal insulating material is synthesized by 10-30wt% of inorganic fiber material and 70-90wt% of nano silicon dioxide powder; the nano silicon dioxidepowder is a parent material, and the grain diameter is less than 60 nanometers; under the pressure effect, the void ratio composited by particles is greater than 70%; and the inorganic fiber materialis composited in the nano silicon dioxide powder to improve the strength of the nano silicious thermal insulating material. By virtue of the compositing of the various materials, the technical effects of wearing resistance, high thermal conductivity and improved material rigidity are achieved, and the effects of super insulation and easiness in manufacturing are achieved.

Description

technical field [0001] The invention relates to the technical field of thermal insulation materials, in particular to providing a super thermal insulation silicon-titanium thermal insulation board and a manufacturing method thereof. Background technique [0002] The existing super heat insulation board mainly adopts two kinds of materials, one is a vacuum heat insulation material, and the other is a nanoporous heat insulation material. [0003] The structure of the nano silicon thermal insulation material has a large number of nano pores, and more than 85% of the pores have a diameter less than 50nm. The mean free path of oxygen molecules and nitrogen molecules in the air is about 70nm. When the pore diameter is smaller than the mean free path of the gas, the air molecules can be regarded as "stationary", and the convective heat transfer of the gas is effectively contained. The high rate also limits the solid-phase heat transfer of nano-silica thermal insulation materials, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C49/11C22C49/14C22C47/08C22C47/14C22C101/02C22C101/04C22C101/06
CPCC22C49/11C22C47/08C22C47/14C22C49/14
Inventor 高军
Owner 中亨新型材料科技有限公司
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