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PCB inner layer circuit making device and making method

An inner layer circuit and inner layer technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of copper foil scratches on the surface of semi-finished circuit boards, many process steps, and high labor intensity. Achieve the effect of reducing manual operation and waiting time, improving product yield, and reducing the number of sheet material transfers

Inactive Publication Date: 2018-07-27
江西景旺精密电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The production process of the above-mentioned inner layer circuit graphics has complicated process, difficult to control, many process operation steps and long waiting time, and low processing efficiency. In addition, there are multiple transfer steps in the production process, which requires manual handling of materials for many times, and the labor intensity is high. The labor cost is high, and it is easy to scratch the copper foil on the surface of the semi-finished circuit board during the sheet material handling process, reducing the product yield

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] This embodiment provides a PCB inner layer circuit manufacturing equipment, which includes the first temporary storage rack for feeding, the roughening line for the inner layer pre-treatment grinding plate, the second temporary storage rack for feeding, and the ink coating for the inner layer. And baking line, third feeding temporary storage rack, code reading mechanism, exposure mechanism, fourth feeding temporary storage rack, developing and etching film stripping line, optical detection mechanism.

[0030] Wherein, the first temporary storage rack, the second temporary storage rack, the third temporary storage rack and the fourth temporary storage rack are used for storing semi-finished PCB boards to be processed in subsequent processes.

[0031] The inner layer pretreatment grinding plate roughening line includes a grinding plate device, a first overflow water washing device, a micro-etching device, a second overflow water washing device, a third overflow water washi...

Embodiment 2

[0045] This embodiment also provides a method for making an inner layer circuit using the PCB inner layer circuit manufacturing device described in Embodiment 1, which includes the following steps:

[0046] S1. The transfer vehicle transports the sheet material to be made into the inner layer circuit pattern to the first temporary storage rack, and uses the first manipulator to transport the sheet material on the first temporary storage rack to the inner layer pre-processing grinding plate for roughening Wire.

[0047] S2. Pre-treatment of the inner layer, roughen the copper surface of the semi-finished PCB board through mechanical grinding and chemical micro-etching treatment: firstly use a grinding machine to grind the semi-finished PCB board, and then perform micro-etching treatment after overflow washing , and then carry out two overflow washings and one ultrasonic immersion washing, and then carry out two overflow washings. After the copper surface is cleaned, it is dried...

Embodiment 3

[0053] This embodiment also provides a method for making an inner layer circuit using the PCB inner layer circuit manufacturing device described in Embodiment 1, which includes the following steps:

[0054] S1. The transfer vehicle transports the sheet material to be made into the inner layer circuit pattern to the first temporary storage rack, and uses the first manipulator to transport the sheet material on the first temporary storage rack to the inner layer pre-processing grinding plate for roughening Wire.

[0055] S2. Pre-treatment of the inner layer, roughen the copper surface of the semi-finished PCB board through mechanical grinding and chemical micro-etching treatment: firstly use a grinding machine to grind the semi-finished PCB board, and then perform micro-etching treatment after overflow washing , and then carry out two overflow washings and one ultrasonic immersion washing, and then carry out two overflow washings. After the copper surface is cleaned, it is dried...

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Abstract

The invention discloses a PCB inner layer circuit making device comprising a first feeding temporary storage frame, an inner layer pre-processing grinding plate roughening line, a second feeding temporary storage frame, an inner layer printing ink coating and baking line, a third feeding temporary storage frame, a reading mechanism, an exposure mechanism, a fourth feeding temporary storage frame,a developing, etching and unwinding line and an optical detecting mechanism, which are arranged in sequence, wherein each feeding temporary storage frame is connected with a mechanical arm for grabbing material, and the devices are sequentially connected by a conveyor belt along a material processing sequence. The device improves the processing efficiency and prevents the problem of scratching andscrapping the surface of the board by manual material handling, thereby improving the product yield and reducing the production cost. The invention further discloses a PCB inner layer circuit makingmethod for reducing the manual operation steps and the production time, eliminating the manual loading and unloading, and reducing the handling operations, thereby saving manpower, reducing the laborcosts, and being suitable for industrial batch processing of PCBs.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and relates to a PCB inner-layer circuit pattern manufacturing technology, in particular to a PCB inner-layer circuit pattern manufacturing device and an inner-layer circuit manufacturing method. Background technique [0002] Printed circuit boards (PCBs) have gradually developed from single-layer boards to double-sided, multi-layer and flexible boards in recent years, and still maintain their own development trends, and continue to develop in the direction of high precision, high density and high reliability. With the continuous popularization of high-end electronic products, multi-layer boards have been widely used. Multi-layer boards have multiple wiring layers, and every two layers are connected by a dielectric layer. This is due to the constraints of product space design factors. In addition to the surface wiring, multi-layer circuits are added inside the circuit boa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K2201/09927H05K2203/163
Inventor 管术春段绍华王海洋
Owner 江西景旺精密电路有限公司
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