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Fast curing EMI heat-conducting and conductive material and preparation method thereof

A conductive material and rapid curing technology, applied in the field of shielding materials, can solve the problems of poor shielding effect, difficult manufacturing process, and low reproducibility, and achieve good electrical and thermal conductivity, excellent curing performance, and high reproducibility Effect

Active Publication Date: 2018-07-31
宁波安工电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcomings of poor shielding effect, difficult manufacturing process and low reproducibility in the prior art, and propose a fast-curing EMI heat-conducting and electrically-conducting material and its preparation method

Method used

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  • Fast curing EMI heat-conducting and conductive material and preparation method thereof
  • Fast curing EMI heat-conducting and conductive material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0025] The present invention proposes a fast-curing EMI thermally and electrically conductive material, comprising the following raw materials in parts by weight: 70 parts of bisphenol A epoxy resin, 15 parts of butadiene-styrene copolymer, 0.4 part of trimethylolpropane, 4, 1.2 parts of 4′-diphenylmethane diisocyanate, 1.2 parts of xylene diisocyanate, 1 part of dibutyltin dilaurate, 1 part of azobisisobutyronitrile, 4 parts of composite alloy powder, bisphenol A epoxy resin diluted 50 doses;

[0026] Its preparation method comprises the following steps:

[0027] S1. Preparation of composite alloy powder: Add copper powder and iron-based alloy powder into the ball mill according to the mass ratio of 1:3, and add 2 times the mass of grinding body and 1 times the mass of ethanol for ball milling for 6 hours, and then Dried to obtain composite alloy powder for subsequent use;

[0028] S2. According to 70 parts of bisphenol A epoxy resin, 15 parts of butadiene-styrene copolymer...

Embodiment 2

[0032] The present invention proposes a fast-curing EMI thermally and electrically conductive material, comprising the following raw materials in parts by weight: 80 parts of bisphenol A epoxy resin, 20 parts of butadiene-styrene copolymer, 0.6 part of trimethylolpropane, 4, 1.5 parts of 4′-diphenylmethane diisocyanate, 1.5 parts of xylene diisocyanate, 0.5 parts of dibutyltin dilaurate, 0.5 parts of azobisisobutyronitrile, 6 parts of composite alloy powder, diluted with bisphenol A epoxy resin 40 doses;

[0033] Its preparation method comprises the following steps:

[0034] S1. Preparation of composite alloy powder: Add copper powder and iron-based alloy powder into the ball mill according to the mass ratio of 1:4, and add 3 times the mass of grinding body and 0.5 times the mass of ethanol for ball milling for 5 hours, and then Dried to obtain composite alloy powder for subsequent use;

[0035] S2. According to 80 parts of bisphenol A epoxy resin, 20 parts of butadiene-styren...

Embodiment 3

[0039] The present invention proposes a fast-curing EMI thermally and electrically conductive material, comprising the following raw materials in parts by weight: 60 parts of bisphenol A epoxy resin, 10 parts of butadiene-styrene copolymer, 0.2 part of trimethylolpropane, 4, 1 part of 4'-diphenylmethane diisocyanate, 1 part of xylene diisocyanate, 1.5 parts of dibutyltin dilaurate, 1.5 parts of azobisisobutyronitrile, 3 parts of composite alloy powder, diluted with bisphenol A epoxy resin 60 doses;

[0040] Its preparation method comprises the following steps:

[0041] S1. Preparation of composite alloy powder: Add copper powder and iron-based alloy powder into the ball mill according to the mass ratio of 1:2, and add 2 times the mass of grinding body and 1 times the mass of ethanol for ball milling for 8 hours, and then Dried to obtain composite alloy powder for subsequent use;

[0042] S2. According to 60 parts of bisphenol A epoxy resin, 10 parts of butadiene-styrene copo...

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Abstract

The invention belongs to the technical field of shielding materials, particularly relates to a fast curing EMI heat-conducting and conductive material and a preparation method thereof, and solves theproblems in the prior art that the shielding effect is poor, the difficulty of the production process is large, and the repetition rate is low. The fast curing EMI heat-conducting and conductive material is prepared from bisphenol A epoxy resin, butadiene-styrol copolymer, trimethylolpropane, 4,4'-diphenyl-methane-diisocyanate, xylene diisocyanate, di-n-butyltin dilaurate, azodiisobutyronitrile, composite alloyed powder and bisphenol A epoxy resin diluent; the preparation method comprises the following steps of S1, the preparation of the composite alloyed powder; S2, the preparation of the rawmaterials of the EMI heat-conducting and conductive material; and S3, the mixture of various raw materials. The provided EMI heat-conducting and conductive material has the advantages that the preparation method is simple, the use is convenient, the curing time is short, the shielding effect is good, the heat-conducting and conductive properties are excellent, and the repetition rate is good.

Description

technical field [0001] The invention relates to the technical field of shielding materials, in particular to a fast-curing EMI heat-conducting and electrically-conducting material and a preparation method thereof. Background technique [0002] EMI is electromagnetic interference. Its principle is to use the shielding material to reflect, absorb and guide the electromagnetic energy flow, block or attenuate the electromagnetic energy transmission between the shielded area and the outside world, and combine the harmonic voltage formed between the harmonic and the shielding material. Harmonic currents are introduced into the earth to achieve the purpose of shielding harmonics. Common EMI electromagnetic shielding materials are mainly divided into four types: conductive rubber, conductive foam lining, metal EMI lining, conductive compound and wave-absorbing material. The advantages of high strength, small thermal expansion coefficient, and good thermal and electrical conductivit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L47/00C08L75/04C08K9/00C08K3/08
CPCC08K2003/085C08K2003/0856C08L63/00C08L2205/03C08L47/00C08L75/04C08K9/00C08K3/08
Inventor 朱旭彤张敏吴飞张洪胜何华军
Owner 宁波安工电子有限公司
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