Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film

A technology of black resin and polyimide, which is applied in chemical instruments and methods, printed circuits, printed circuits, etc., can solve the problems that light is difficult to penetrate to the bottom, and cannot fully guarantee the light curing property, so as to achieve superior flame retardancy , high concealment effect

Active Publication Date: 2018-07-31
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Of course, in the case of using a black photosensitive resin composition with excellent concealment, because the added colorant absorbs or reflects light, sometimes it is more difficult for light to penetrate to the bottom, so that the photocurability cannot be fully guaranteed.

Method used

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  • Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film
  • Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film
  • Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0325] (Synthesis example 1: (a) Synthesis 1 of carboxyl group-containing photosensitive resin)

[0326] Add triethylene glycol dimethyl ether (=1,2-bis(2-methoxyethoxy)ethane) as a polymerization solvent to a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, and a nitrogen gas introduction tube 100.0 g, and heated up to 80°C while stirring under a nitrogen stream. In the state of maintaining 80 ℃, spend 3 hours from the dropping funnel to drop the following ingredients mixed in advance at room temperature: 12.0 g (0.14 moles) of methacrylic acid, 28.0 g (0.16 moles) of benzyl methacrylate, 60.0 g (0.42 mol) of butyl methacrylate and 0.5 g of azobisisobutyronitrile as a radical polymerization initiator. After completion of the dropwise addition, the temperature of the reaction solution was raised to 90° C. while stirring, and the temperature of the reaction solution was kept at 90° C. and stirring was continued for 2 hours to cause a reaction. Throug...

Synthetic example 2

[0342] (Synthesis example 2: (a) Synthesis 2 of carboxyl group-containing photosensitive resin)

[0343] To a reaction vessel equipped with a stirrer, a thermometer, and a nitrogen gas introduction tube, 40.00 g of triethylene glycol dimethyl ether (=1,2-bis(2-methoxyethoxy)ethane) was added as a polymerization solvent, and then 20.62 g (0.100 mol) of norbornene diisocyanate was added there, and it heated to 80 degreeC, stirring under nitrogen flow, and dissolved it. To this solution, 50.00 g (0.025 mol) of polycarbonate diol (product name PCDL T5652 manufactured by Asahi Kasei Co., Ltd., weight average molecular weight 2000), 3.70 g of 2,2-bis(hydroxymethyl)butanoic acid were added to the solution over 1 hour. (0.025 mol) and 13.02 g (0.100 mol) of 2-hydroxyethyl methacrylate dissolved in 40.00 g of triethylene glycol dimethyl ether. The solution was heated and stirred at 80° C. for 5 hours to cause a reaction. Through the above reaction, a carboxyl-containing photosensitiv...

Synthetic example 3

[0344] (Synthesis example 3: Synthesis 1 of base binder other than (a) carboxyl group-containing photosensitive resin)

[0345] Into a reaction container equipped with a stirrer, a thermometer, and a nitrogen gas introduction tube, 30.00 g of triethylene glycol dimethyl ether (=1,2-bis(2-methoxyethoxy)ethane) was added as a polymerization solvent, and then 10.31 g (0.050 mol) of norbornene diisocyanate was added there, and it heated to 80 degreeC, stirring under nitrogen flow, and was made to melt|dissolve. To this solution, 50.00 g (0.025 mol) of polycarbonate diol (product name PCDL T5652 manufactured by Asahi Kasei Co., Ltd., weight average molecular weight 2000) and 6.51 g (0.050 mol) of 2-hydroxyethyl methacrylate were added to the solution over 1 hour. A solution dissolved in 30.00 g of triethylene glycol dimethyl ether. The solution was heated and stirred at 80° C. for 5 hours to cause a reaction. Through the above reaction, a base binder solution (R-1) was obtained. ...

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Abstract

Provided is a production method for a polyimide with a black resin cured film, the method comprising a step for obtaining a black resin cured film by curing a black resin composition on a polyimide, wherein: the step for obtaining a black resin cured film includes a step for processing the black resin composition with a predetermined spray impact; and the distance to an end of a top portion of theblack resin from a point where a line that is perpendicular with respect to the surface of the polyimide and that passes through a substrate-adhered end part between the black resin cured film and the polyimide intersects the top portion of the black resin cured film, is not more than 25 mu m.

Description

technical field [0001] The present invention relates to a black resin composition, a polyimide with a black resin cured film, a method for producing the same, and a flexible printed wiring board using the black resin cured film. Background technique [0002] Film-like printed wiring boards (hereinafter, abbreviated as flexible printed wiring boards) that are usually mounted on small devices such as mobile phones and digital cameras can be formed by (1) copper-clad laminated board circuit formation Process, (2) Process of protecting the circuit board with a cover and a cover layer, (3) Process of surface treatment such as gold plating on exposed copper foil and component mounting parts, (4) Process of adhering a reinforcement plate , (5) Stamping and other shape processing processes to manufacture. Then, (6) According to the application, select various surface treatments for the copper foil exposed part and the component mounting part, and for a flexible printed wiring board...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04B05D3/10B05D7/04B32B27/20B32B27/34H05K3/28C08J7/043C08J7/046C08J7/05
CPCB05D3/10B05D7/04C08G18/758C08G18/44C08L75/04B05D1/02C08J2377/00C08J2433/10C08J2475/04C09D133/10C09D175/04H05K3/287H05K1/0274H05K2203/161H05K2201/012C08J7/0427B32B2307/306B32B2255/10B32B2307/706B32B2307/536B32B2307/7145B32B2307/714B32B2307/732B32B2457/08B32B2255/28B32B27/281B32B2307/41B32B2255/24B32B2255/06B32B15/08B32B2255/20B32B7/12B32B2307/546B32B2255/26B32B2250/02B32B27/38B32B2307/3065C08J7/05C08J7/043C08J7/046B32B17/06C08J7/04C08K5/3417C08K5/5313H05K3/28C08J2379/08C08J2400/00B32B27/20B32B27/34B05D3/007B05D7/24C08K5/0041C08K5/18C08L79/08C09D4/00C09D7/63H05K1/036H05K1/0393H05K3/285H05K2201/0154H05K2201/0195
Inventor 小木曽哲哉好田友洋木户雅善
Owner KANEKA CORP
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