Production and use method of heatproof wire beam electrode

Abstract

The invention belongs to the field of high-throughput electrochemical characterization, and concretely relates to a production and use method of a heatproof wire beam electrode. The production methodis characterized in that a packaging material is poured on parts of the surfaces of a plurality of electrodes, and is solidified to obtain the heatproof wire beam electrode, wherein the packaging material is an alumina powder and cement mixed slurry. The heatproof wire beam electrode adopts low-temperature solidifying packaging, and the packaging material resists a high temperature, so the wire beam electrode can work in a high-temperature (1500 DEG C or below) and an ultrahigh-vacuum environment, coating and a subsequent heat treatment process of a film are realized, and high-throughput electrochemical detection of a combined material chip is completed.

Description

technical field [0001] The invention belongs to the field of high-throughput electrochemical characterization, and in particular relates to a method for preparing and using a heat-resistant filament bundle electrode. Background technique [0002] With the development of high-throughput preparation and testing experiments, wire beam electrodes, as an important measurement tool for micro-electrochemistry, have the characteristics of multi-probes and have unique advantages in high-throughput electrochemical characterization. Wire Beam Electrode (WBE) is mainly composed of a series of mutually coupled, tiny, independent microelectrodes arranged according to certain rules, which can be used to simulate a single large-area metal electrode, or each tiny electrode can be used independently , which can provide a series of important information such as surface distribution and difference size that cannot be provided by a single electrode. [0003] The unique characteristics of the wi...

AI Technical Summary

Problems solved by technology

The glass electrode has the advantages of high chemical inertness, good solvent resistance, and a wide potential application area, but it is easily broken and has poor temperature resistance.

[0006] Since the currently used packaging materials are generally not resistant to high temperatures, if you want to use wire beam electrodes in high temperature environments, you generally need to seek high melting point materials, and high temperature melting casting is required, but these materials often have a large expansion coefficient and are not easy to mix with metal materials. In combination, if the thermal expansion coefficient of the packaging material and the electrode material differ greatly, the device will shrink after returning to normal temperature, and there will be a certain internal stress between the two, which may cause cracks or even breakage of the electrode, resulting in package failure and low success rate.

Images