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A kind of preparation method of alkylphenol-modified phenolic resin for electronic materials

A technology for phenolic resins and electronic materials, which is applied in the field of preparation of alkylphenol-modified phenolic resins for electronic materials, can solve the problems of increasing the environmental load of waste water, affecting the performance of electronic materials, and failing to meet environmental protection requirements, and achieves good drilling results. Processability, water absorption and dimensional stability improvement, effect of high heat resistance

Active Publication Date: 2020-06-02
SUZHOU XINGYE MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned traditional process will bring sulfate ions and chloride ions, which will seriously affect the performance of electronic materials. Although some sulfate ions and chloride ions can be removed through multiple washing processes, there are still many harmful ions in the resulting resin, which cannot meet the requirements. The requirements of high-end electronic materials, and the large amount of wastewater after washing increases the environmental load, which does not meet the environmental protection requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) 37% water formaldehyde of 135 parts by weight, 150 parts by weight of nonylphenol are dropped into reactor, stir and drop into 15 parts by weight of oxalic acid;

[0032] (2) Raise the temperature of the reaction system to 90°C, adjust the pressure in the kettle to 0.4MPa, and react for 1h;

[0033] (3) pressure in the kettle is adjusted back to normal pressure, drop into remaining 400 parts by weight of 37% water formaldehyde, 550 parts by weight of phenol;

[0034] (4) The temperature was raised to 110°C, the pressure in the kettle was adjusted to 0.2MPa, and the reaction was continued for 3h;

[0035] (5) Finish the reaction, dehydrate under negative pressure for 1 hour, and dehydrate at a temperature of 140-160°C;

[0036] (6) After the dehydration is completed, take out the resin and cool it down to obtain the alkylphenol-modified phenolic resin.

Embodiment 2

[0038] (1) 37% water formaldehyde of 200 parts by weight, 150 parts by weight of nonylphenol are dropped into reactor, stir and drop into 15 parts by weight of oxalic acid;

[0039] (2) Raise the temperature of the reaction system to 100°C, adjust the pressure in the kettle to 0.5MPa, and react for 1h;

[0040] (3) pressure in the kettle is adjusted back to normal pressure, drop into remaining 470 parts by weight of 37% water formaldehyde, 600 parts of phenol;

[0041] (4) The temperature was raised to 130°C, the pressure in the kettle was adjusted to 0.3MPa, and the reaction was continued for 3h;

[0042] (5) Finish the reaction, dehydrate under negative pressure for 1 hour, and dehydrate at a temperature of 130-140°C;

[0043] (6) After the dehydration is completed, take out the resin and cool it down to obtain the alkylphenol-modified phenolic resin.

Embodiment 3

[0045] (1) 240 parts by weight of 37% formaldehyde water, 100 parts by weight of nonylphenol, and 50 parts by weight of amylphenol are dropped into the reactor, and after stirring evenly, 10 parts by weight of oxalic acid and 5 parts by weight of citric acid are dropped into;

[0046] (2) Raise the temperature of the reaction system to 90°C, adjust the pressure in the kettle to 0.4MPa, and react for 1h;

[0047] (3) pressure in the kettle is adjusted back to normal pressure, drop into remaining 560 parts by weight of 37% water formaldehyde, 650 parts of phenol;

[0048] (4) Heat up to 125°C, adjust the pressure in the kettle to 0.2MPa, and continue the reaction for 3h;

[0049] (5) Finish the reaction, dehydrate under negative pressure for 1 hour, and dehydrate at a temperature of 130-140°C;

[0050] (6) After the dehydration is completed, take out the resin and cool it down to obtain the alkylphenol-modified phenolic resin.

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PUM

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Abstract

The invention relates to a preparation method of alkyl phenol modified phenolic resin for an electronic material. In a process of preparing the alkyl phenol modified phenolic resin for the electronicmaterial, an in-kettle pressure sub-step control technology is adopted and an organic catalyst is selected to produce the high-quality alkyl phenol modified phenolic resin. When the alkyl phenol modified phenolic resin is prepared, the in-kettle pressure sub-step control technology is adopted and the organic catalyst is selected to replace sulfuric acid, hydrochloric acid and the like, so that thereaction activity of alkyl phenol can be improved and reaction is carried out sufficiently; the introduction of harmful ions is avoided; the concentration of the harmful ions in the obtained resin can be controlled to be 1ppm or less and the requirements of the electronic material are met. Meanwhile, the prepared alkyl phenol modified phenolic resin does not need to be washed by a lot of water, so that the preparation method has positive significance on cost control and environment protection.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to resin materials used for copper-clad laminates and plastic sealing compounds for electronic packaging. Specifically, the invention relates to a preparation method of alkylphenol-modified phenolic resins for electronic materials. Background technique [0002] Phenolic resin has unique properties such as high temperature resistance, flame retardancy, and low smoke generation. The product cured with epoxy resin has the characteristics of good heat resistance, stable size, excellent electrical properties, and good machinability. It is used in copper clad laminates in the electronic field. And the application in molding compound is more and more extensive. [0003] After 2003, the EU officially required electronic products to be lead-free and halogen-free. However, the original amine-cured epoxy resin manufacturing process for copper clad laminates was difficult to meet the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/24
CPCC08G8/24
Inventor 高晓东马晓锋徐丽丽王文浩王锦程
Owner SUZHOU XINGYE MATERIALS TECH