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Core/shell structure Ti3C2 ene/Cu powder and preparation method thereof

A technology of shell structure and powder, which is applied in metal processing equipment, liquid chemical plating, coating, etc., to achieve the effect of improving wettability, uniform coating and good performance

Active Publication Date: 2018-08-10
BEIJING JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are no related patents and literature reports on this kind of core / shell structure MXene / Cu powder at home and abroad.

Method used

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  • Core/shell structure Ti3C2 ene/Cu powder and preparation method thereof
  • Core/shell structure Ti3C2 ene/Cu powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0023] 1. The composition of the electroless plating solution is: 10g / L copper sulfate pentahydrate, 10g / L disodium ethylenediamine tetraacetate, 20mg / L 2,2'-bipyridyl, adjust the pH of the plating solution to 9-10 with NaOH solution . The reducing agent is: 10ml / L 80% hydrazine hydrate.

[0024] 2. Electroless plating:

[0025] (1) Add 0.25g Ti 3 C 2 Add it to 400ml plating solution, control the temperature of the mixed solution at 45-50°C, and use magnetic stirring for continuous stirring;

[0026] (2) Use a separating funnel to add 100ml of hydrazine hydrate dropwise to the mixed solution, control the titration rate, and finish the titration in 15 minutes, and add NaOH solution in time during the process to ensure that the pH value is maintained at the specified value;

[0027] (3) After the titration, the mixed solution is centrifugally cleaned with deionized water until the pH value is about 7, and finally the sample is washed with absolute ethanol, and the red powder...

Embodiment approach 2

[0030] 1. The composition of the electroless plating solution is: 20g / L copper sulfate pentahydrate, 30g / L disodium ethylenediamine tetraacetate, 10mg / L 2,2'-bipyridyl, adjust the pH of the plating solution to 10-11 with NaOH solution . The reducing agent is: 20ml / L 80% hydrazine hydrate.

[0031] 2. Electroless plating:

[0032] (1) Add 0.25g Ti 3 C 2 Add it to 400ml plating solution, control the temperature of the mixed solution at 60-65°C, and use magnetic stirring for continuous stirring;

[0033] (2) Use a separating funnel to add 100ml of hydrazine hydrate dropwise to the mixed solution, control the titration rate, and finish the titration in 30 minutes, and add NaOH solution in time during the process to ensure that the pH value is maintained at the specified value;

[0034] (3) After the titration, the mixed solution is centrifugally cleaned with deionized water until the pH value is about 7, and finally the sample is washed with absolute ethanol, and the red powde...

Embodiment approach 3

[0037] 1. The composition of the electroless plating solution is: 20g / L copper sulfate pentahydrate, 20g / L disodium ethylenediamine tetraacetate, 30mg / L 2,2'-bipyridyl, adjust the pH of the plating solution to 11-12 with NaOH solution . The reducing agent is: 30ml / L 80% hydrazine hydrate.

[0038] 2. Electroless plating:

[0039] (1) Add 0.25g Ti 3 C 2 Add it to 400ml plating solution, control the temperature of the mixed solution at 75-80°C, and use magnetic stirring for continuous stirring;

[0040] (2) Use a separating funnel to add 100ml of hydrazine hydrate dropwise to the mixed solution, control the titration rate, and finish the titration in 60 minutes, and add NaOH solution in time during the process to ensure that the pH value is maintained at the specified value;

[0041] (3) After the titration, the mixed solution is centrifugally cleaned with deionized water until the pH value is about 7, and finally the sample is washed with absolute ethanol, and the red powde...

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Abstract

The invention discloses a core / shell structure Ti3C2 ene / Cu powder and a preparation method thereof. By using the chemical plating technology, Ti3C2 ene is used as a carrier, and the surface of the Ti3C2 ene is wrapped by one layer of shell film composed of copper particles. A plating solution is mainly composed of copper sulfate pentahydrate, ethylenediamine tetraacetic acid disodium and 2,2'-bipyridine, a reducing agent is hydrazine hydrate, the reaction temperature is 45-95 DEG C, and pH is controlled at 9-13. The process is simple, cost is low, the core / shell structure Ti3C2 / Cu powder canbe stably acquired within short time, it is not needed to perform roughening, sensitization, activation and other pre-treatment on a substrate, the thickness of a plated film and the particle size canboth be adjustable, and thus, a core / shell nanocomposite in different properties can be prepared. The core / shell powder has broad application prospects in the aspects of catalysis, optics, electromagnetics and the like. The method is also applicable to MXene / metal powder in other core / shell structures, and (MXene comprises M2Xene, M3X2ene, M4X3ene and the like; and shell layer metal comprises Cu,Ni, Sn, Co and the like).

Description

technical field [0001] The invention belongs to the field of preparation of nanocomposite materials, in particular to a Ti with core / shell structure 3 C 2 / Cu powder and its preparation method. Background technique [0002] MXene is a new two-dimensional nanomaterial composed of ternary carbides or nitrides (general formula M n+1 AX n , abbreviated as MAX, M is a transition metal element, A is the third and fourth main group elements, X is C or N, n=1,2,3) M n+1 x n . In order to emphasize that they are etched from the MAX phase and have a two-dimensional structure similar to graphene (Graphene), they are called MXene. Usually there are dozens of types of MXene. The unique two-dimensional morphology and chemical composition of MXene endow them with many novel properties such as good electrical conductivity, light transmission, magnetism, and energy storage. However, the surface of MXene two-dimensional platelets etched by acid solution has functional groups such as -...

Claims

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Application Information

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IPC IPC(8): C23C18/40B22F1/02
CPCC23C18/1658C23C18/40B22F1/17
Inventor 李世波胡树郡姚伯祥周洋李翠伟黄振莺翟洪祥
Owner BEIJING JIAOTONG UNIV
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