Water-proof high-strength heat-proof adhesive for photovoltaic backboard and preparation method thereof

A photovoltaic backplane and adhesive technology, applied in adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of poor service life, weather resistance, and poor waterproof performance, and achieve good hydrolysis resistance, Improve compactness and waterproof and impervious properties, reduce the effect of bacterial growth problems

Inactive Publication Date: 2018-08-14
合肥博之泰电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the service life and weather resistance of existing adhesives are poor, and the waterproof performance is not good, so it is urgent to improve

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A waterproof high-strength heat-resistant adhesive for photovoltaic backplanes in this embodiment includes the following raw materials in parts by weight:

[0036] 20 parts of environmentally friendly tackifier, 80 parts of compound resin, 10 parts of water-resistant additive, 8 parts of tackifier, 2 parts of coupling agent, 1 part of curing agent, 7 parts of nano-additive, 1 part of dispersant, graphene 3 parts, 0.4 parts of antioxidant, 1 part of stabilizer, 0.8 parts of early strength agent, 20 parts of isopropanol.

[0037] The preparation method of the environmentally friendly tackifier in this example is: add oxidized starch, ethylene-vinyl acetate copolymer resin, and nano-silicon dioxide into the reaction kettle at a weight ratio of 4:2:1, and stir at a temperature of 80°C. React for 20 minutes.

[0038] The composite resin in this embodiment is a mixture of polyurethane resin, water-based epoxy resin, and alkyd resin in a weight ratio of 5:3:1.

[0039] The w...

Embodiment 2

[0049] A waterproof high-strength heat-resistant adhesive for photovoltaic backplanes in this embodiment includes the following raw materials in parts by weight:

[0050] 30 parts of environmentally friendly tackifiers, 100 parts of compound resins, 20 parts of water-resistant additives, 14 parts of tackifiers, 4 parts of coupling agents, 2 parts of curing agents, 9 parts of nano additives, 2 parts of dispersants, graphene 5 parts, 0.8 parts of antioxidant, 2 parts of stabilizer, 1 part of early strength agent, 30 parts of isopropanol.

[0051] The preparation method of the environmentally friendly tackifier in this example is: add oxidized starch, ethylene-vinyl acetate copolymer resin, and nano-silicon dioxide into the reaction kettle at a weight ratio of 4:2:1, and stir at a temperature of 100°C React for 30 minutes.

[0052] The composite resin in this embodiment is a mixture of polyurethane resin, water-based epoxy resin, and alkyd resin in a weight ratio of 5:3:1.

[0...

Embodiment 3

[0063] A waterproof high-strength heat-resistant adhesive for photovoltaic backplanes in this embodiment includes the following raw materials in parts by weight:

[0064] 25 parts of environmentally friendly tackifiers, 90 parts of compound resins, 15 parts of water-resistant additives, 11 parts of tackifiers, 3 parts of coupling agents, 1.5 parts of curing agents, 8 parts of nano additives, 1.5 parts of dispersants, graphene 4 parts, 0.6 parts of antioxidant, 1.5 parts of stabilizer, 0.9 parts of early strength agent, 25 parts of isopropanol.

[0065] The preparation method of the environmentally friendly tackifier in this example is: add oxidized starch, ethylene-vinyl acetate copolymer resin, and nano-silicon dioxide into the reaction kettle at a weight ratio of 4:2:1, and stir at a temperature of 90°C. The reaction is 25 minutes.

[0066] The composite resin in this embodiment is a mixture of polyurethane resin, water-based epoxy resin, and alkyd resin in a weight ratio o...

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PUM

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Abstract

The invention discloses a water-proof high-strength heat-proof adhesive for a photovoltaic backboard and a preparation method thereof. The water-proof high-strength heat-proof adhesive is prepared from the following raw materials in parts by weight: 20-30 parts of environmentally-friendly tackifying auxiliary agent, 80-100 parts of compounded resin, 10-20 parts of water-proof additive, 8-14 partsof a tackifier, 2-4 parts of a coupling agent, 1-2 parts of a curing agent, 7-9 parts of a nanometer additive, 1-2 parts ofa dispersant, 3-5 parts of graphene, 0.4-0.8 part of an antioxidant, 1-2 parts of a stabilizer, 0.8-1 part of an early strength agent and 20-30 parts of isopropyl alcohol. The water-proof high-strength heat-proof adhesive is used for binding the photovoltaic backboard and hasthe advantages of good water-proof heat-proof performance, good mechanical property, high binding performance and excellent antioxidation performance and weather fastness, and the cured water-proof high-strength heat-proof adhesive has relatively good adhesive force and flexibility. Meanwhile, the preparation method disclosed by the invention has the advantages of lower material cost, abundant rawmaterial, simple technology, easiness in operation and industrial production, higher practical value and good application prospect.

Description

technical field [0001] The invention relates to the technical field of photovoltaic materials, in particular to a waterproof high-strength heat-resistant adhesive for photovoltaic backplanes and a preparation method thereof. Background technique [0002] In recent years, with the improvement of global mechanization and modernization, the demand for energy continues to increase. As an important part of renewable energy, the photovoltaic industry will become the main method to solve the global energy crisis. The practical use of solar cells as a useful energy source has progressed. Solar cells include various types, and silicon-based solar cells, compound-based solar cells, organic solar cells, and the like are called typical solar cells. [0003] The special use environment of photovoltaic products puts forward higher requirements for its corresponding components, such as strict standards in terms of aging resistance, high and low temperature resistance, hydrolysis resistan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J163/00C09J167/08C09J103/10C09J123/08C09J11/04C09J11/06C09J11/08
CPCC09J175/04C08K2003/2241C08K2003/2296C08K2201/011C08L2201/08C08L2203/204C08L2205/035C09J11/04C09J11/06C09J11/08C08L63/00C08L67/08C08L3/10C08L23/0853C08L67/00C08L25/08C08L1/284C08L5/04C08K13/02C08K5/524C08K5/098C08K3/36C08K3/22C08K3/34
Inventor 王飞
Owner 合肥博之泰电子科技有限公司
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