Organosilicon modified high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof

An acrylate and silicone technology, used in adhesives, ester copolymer adhesives, graft polymer adhesives, etc., can solve the problem of lack of temperature resistance, and achieve strong adhesion and adhesion. , use a wide range of effects

Active Publication Date: 2018-08-17
KUNSHAN ZLAN ELECTRONIC MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although acrylic resin itself has the characteristics of strong adhesion, toughness, and corrosion resistance, it does not have excellent temperature resistance due to its linear structure, which limits its further application.

Method used

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  • Organosilicon modified high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof
  • Organosilicon modified high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof
  • Organosilicon modified high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0037] The preparation scheme of organosilicon modified body is as follows:

[0038] 1) Octaphenylcyclotetrasiloxane 37 parts, D4 57 parts, V4 5.7 parts, MM 0.3 parts, CF 3 SO 3 0.15 parts of H were mixed and added to a three-neck flask equipped with a stirring magnet, a thermometer and a condenser.

[0039] 2) Start nitrogen protection, set the temperature at 75°C, and react for 5 hours.

[0040] 3) Finally, the temperature is lowered to stop the reaction.

[0041] Performance Testing:

[0042] Pressure-sensitive adhesive tape 180 ° peel strength test method GB / T2792-1998

[0043] Pressure-sensitive adhesive tape stickiness test method GB / T4851—1998 (where the temperature is set to the highest temperature for self-exploration)

[0044] Pressure-sensitive adhesive heat resistance test method: the sample preparation method is the same as the pressure-sensitive adhesive tape 180° peel strength test method GB / T2792-1998, and then put it in an oven at 150°C, take it out after...

Embodiment 1

[0048] 1) After mixing butyl acrylate 51g, isooctyl acrylate 30g, vinyl acetate 5g, acrylic acid 2g, and hydroxyethyl acrylate 2g, get 60% of it and add 75g of solvent (ethyl acetate:toluene:cyclohexane = 3:1:4), and 0.12g of initiator AIBN was heated to 80°C for reflux reaction, and when the viscosity of the reaction started to increase, start timing for 1h.

[0049] 2) After 1 hour, the remaining monomer, 50 g of solvent and 0.03 g of AIBN were uniformly added dropwise into the reaction system within 2 hours using a constant liquid funnel, and then kept for 0.5 hours of reaction.

[0050] 3) Add 0.15g of initiator, 25g of solvent and 10g of modified silicone into the reaction system dropwise within 1h, and then keep warm for 1.5h.

[0051] 4) Finally cooling and discharging, the solid content is 40%.

[0052] Take a part of the prepared glue and weigh it and add 1.5% L75 of the glue amount and stir it fully, then apply it on the PET release paper with a glass rod with a dia...

Embodiment 2

[0054] 1) After mixing 51g of butyl acrylate, 32.5g of isooctyl acrylate, 5g of vinyl acetate, 2g of acrylic acid, and 2g of hydroxyethyl acrylate, get 60% of it and add 75g of solvent (ethyl acetate: toluene: cyclohexane =3:1:4), and 0.12g of initiator AIBN was heated to 80°C for reflux reaction, and when the reaction viscosity increased, start timing for 1h.

[0055] 2) After 1 hour, the remaining monomer, 50 g of solvent and 0.03 g of AIBN were uniformly added dropwise into the reaction system within 2 hours using a constant liquid funnel, and then kept for 0.5 hours of reaction.

[0056] 3) Add 0.15g of initiator, 25g of solvent and 7.5g of modified organic silicon into the reaction system dropwise within 1h, and keep warm for 1.5h.

[0057] 4) Finally cooling and discharging, the solid content is 40%.

[0058] Take a part of the prepared glue and weigh it and add 1.5% L75 of the glue amount and stir it fully, then apply it on the PET release paper with a glass rod with a d...

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PUM

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Abstract

The invention discloses an organosilicon modified high-temperature-resistant acrylate pressure-sensitive adhesive and a preparation method thereof. The pressure-sensitive adhesive is prepared from, byweight, 2-8 parts of hard monomer, 70-90 parts of soft monomer, 2-8 parts of functional monomer, 5-10 parts of organosilicon modifying body, 0.1-0.8 part of initiator, 1-3 parts of curing agent and 100-150 parts of solvent. The pressure-sensitive adhesive is resistant to high temperature, high in adhesiveness, large in bonding power and free of residue when in use.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a silicone-modified high-temperature-resistant acrylate pressure-sensitive adhesive and a preparation method thereof. Background technique [0002] Adhesive refers to the technology of connecting the surfaces of homogeneous or heterogeneous objects with adhesive, which has the characteristics of continuous stress distribution, high viscosity, no glue residue, light weight, and convenient use. Gluing is especially suitable for the connection of different materials, different thicknesses, ultra-thin specifications and complex components, such as steel, wood, plastic and objects used in special environments. Nowadays, adhesives are developing rapidly and have a wide range of applications. [0003] Adhesives can be divided into thermosetting type, hot melt type, room temperature curing type, pressure sensitive type and so on according to the application method. [0004] Pressure-sensitive a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J151/08C08F220/18C08F218/08C08F220/06C08F220/20C08F283/12
CPCC08F220/18C08F220/1804C08F283/124C08L2201/08C09J133/08C08L51/08C08F220/1808C08F218/08C08F220/06C08F220/20
Inventor 贺金梅张晓勇白永平岳利培邓庆瑞
Owner KUNSHAN ZLAN ELECTRONIC MATERIALS CO LTD
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