Method for preparing resistance heating element

A resistance heating element and resistance heating technology, applied in the direction of ohmic resistance heating, electrical components, additive manufacturing, etc., can solve the problems of high porosity and oxide content in the resistance heating layer, difficulty in obtaining materials, and limited application range, etc., to achieve Excellent environmental protection benefits, convenient heating temperature and heating power, and the effect of precise control of heating temperature and heating power

Inactive Publication Date: 2018-08-17
上海楚越机械设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to obtain the material, the cost is high, the substrate is limited to austenitic stainless steel, the application range is limited, and the formed resistance heating layer has high porosity and oxide content

Method used

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  • Method for preparing resistance heating element
  • Method for preparing resistance heating element
  • Method for preparing resistance heating element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as Figure 3a As shown, a resistive heating layer is fabricated on a ceramic substrate:

[0032] (1) Cleaning is performed on an alumina ceramic sheet with a size of 200x100 mm and a thickness of 2 mm, followed by sandblasting and roughening with corundum, so that the surface of the area to be deposited by spraying has become rough.

[0033] (2) The material is NiCr alloy (Ni80%, Cr20%), the material is made into powder by argon atomization method, sieved and dried, the particle size is 10-50 microns, and then SLM is used, laser beam power: 400W, scanning Speed: 1700mm / s, 3D printing deposits to form a serpentine pattern, and obtains a ceramic sheet with a resistance heating layer.

[0034] (3) Then use silver-copper brazing material to weld the copper leads to the two terminals of the resistance layer to form a usable ceramic-based heating chip.

[0035] If the heating plate needs to be insulated, a 100-200 micron thick aluminum oxide coating can be deposited on...

Embodiment 2

[0037] Such as Figure 3b As shown, the resistive heating layer is fabricated on the epoxy resin substrate:

[0038] (1) Clean the epoxy resin sheet with a size of 200x100 mm and a thickness of 4 mm, and then use white corundum to sandblast and roughen it, so that the surface of the area that needs to be sprayed and deposited has become rough.

[0039] (2) Since the plastic substrate is easily deformed, melted or carbonized during the high-temperature spraying process, first use cold spraying or arc spraying to deposit a 5-10 micron thick zinc layer on the surface (the first layer can also be deposited directly on the plastic Turn down the power a bit, and the plastic will melt slightly, which can improve the bonding force between the plastic and the resistance layer). Then the material is NiCr alloy (Ni80%, Cr20%), the material is made into powder by argon atomization method, sieved and dried, the particle size is 10-50 microns, and then SLM is used, laser beam power: 400W, ...

Embodiment 3

[0043] Such as Figure 3c As shown, make a resistive heating layer on the copper sheet:

[0044] (1) Clean the copper sheet with a size of 200x100mm and a thickness of 4mm, and then use corundum to blast and roughen it, so that the surface of the area that needs to be sprayed and deposited has become rough.

[0045] (2) First adopt the plasma spraying method to deposit a 5-10 micron thick aluminum oxide insulating layer on the surface. The material is NiCr alloy (Ni80%, Cr20%), the material is made into powder by argon atomization method, sieved and dried, the particle size is 50-150 microns, and then laser cladding is carried out. Laser beam power: 3kW, laser beam spot diameter : Scanning speed: 10mm / min, powder flow range: 10g / min, high-purity argon as a protective atmosphere, forming a serpentine pattern, and obtaining a copper sheet with a resistance heating layer.

[0046] (3) Then use silver-copper brazing material to weld the copper leads to the two terminals of the...

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Abstract

The invention relates to a method for preparing a resistance heating element. The method includes the steps that (1) a substrate material is prepared and cleaned, and then sand-blasting texturing is conducted; (2) a resistance heating layer material is prepared into powder through a gas atomization method to be screened and dried, and then laser cladding and/or 3D printing deposition are/is carried out to form an S-shaped pattern; and (3) and finally a conductive lead is welded and accordingly the resistance heating element can be obtained. Compared with a PTC heater, the resistance of the resistance heating element obtained through the method cannot be affected by temperatures basically, and thus the heating temperature and heating power can be accurately controlled conveniently. The method is wide in applied range, a resistance heating layer can be manufactured on a metal, ceramic, glass and plastic substrate, and the application prospects are good.

Description

technical field [0001] The invention belongs to the technical field of resistance heating, in particular to a preparation method of a resistance heating element. Background technique [0002] Resistance heating is a technology that generates heat when current passes through a resistance, and the heat is transferred to the object to be heated by heat conduction for heating. It is widely used in semiconductors, automobiles, agriculture, national defense, household appliances and other industries. [0003] PTC heaters have the incomparable advantages of traditional heating elements such as constant temperature heating, no open flame, high heat conversion rate, little influence on power supply voltage, and long natural life. The application in electric heating appliances is more and more favored by R&D engineers. According to the conduction mode, PTC heaters are divided into: (1) PTC ceramic heaters mainly based on heat conduction. It is characterized by a multi-layer heat tran...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/10B22F3/105H05B3/20B33Y10/00
CPCH05B3/20C23C4/11C23C4/134C23C24/106B33Y10/00H05B2203/017B22F10/00B22F10/25B22F10/34B22F10/28B22F10/36B22F10/32Y02P10/25
Inventor 谢刘玥谢国宏
Owner 上海楚越机械设备有限公司
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