Ultra-light high-resilience low-thermal-conductivity composite foam material and preparation method thereof
A low thermal conductivity and composite foaming technology, which is applied in the field of ultra-light, high resilience and low thermal conductivity composite foam materials and its preparation, can solve the problems of flame retardancy, low thermal conductivity, poor mechanical properties, and low resilience. Achieve the effects of flame retardancy, low thermal conductivity, high resilience and low density
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Embodiment 1
[0043] The physical and chemical properties of the raw material TPU particles described in Example 1 and Comparative Examples 1-9 are: hardness 75-90A, melt index 40-90g / 10min (test condition 205°C / 5kg), density 1.0-1.2g / cm 3 , tensile strength at break > 15.3MPa, elongation at break > 550%, tear strength > 40KN / m, yellowing resistance level > 4.
Embodiment 2
[0044] The raw material TPO particles described in Example 2 come from Dongguan Jiejia Plastic Technology Co., Ltd., TPO-62D.
Embodiment 3
[0045] The raw material TPEE particle described in embodiment 3 comes from American DuPont, 7246.
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