A kind of manufacturing method of multi-layer printed circuit board

Abstract

The invention discloses a manufacturing method of a multilayered printed circuit board. The method comprises the following steps: setting calibrating points in equivalent positions of a multilayered soft substrate, carrying out multilayered positioning before drilling according to the calibrating points, and drilling the soft substrate to form via holes according to five-pointed star distribution;exposing a pattern on an original image to a light-sensitive bottom plate for development, etching the surface of a single sided board and setting a signal line unit; arranging multi-port connectingends at two ends, separately, bending a circuit board at a thermoplastic temperature and cooling and setting the circuit board quickly; arranging connecting pins in positions, corresponding to the viaholes, of the printed circuit board, electrically connecting the circuit board to the connecting pins through enamelled wires in corresponding via holes, and connecting the signal line units in different layers through via holes too. The multilayered printed circuit board is very good in spatial stability and convenient to form a three-dimensional multilayered circuit board structure, is directlywrinkled, rotated and set, can adopt batch production with same templates for many times, and the process is simplified, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a multilayer printed circuit board. Background technique [0002] The flexible printed circuit board has the characteristics of thin thickness, light weight, dense wiring, bendable and flexible, and is widely used in the field of electronic devices. Flexible printed circuit boards have been widely used to provide wiring for movable parts of electronic devices. In addition, as electronic devices are reduced in size and functions of electronic devices are improved, flexible printed circuit boards by connecting several flexible printed circuit boards have been used. Flexible printed circuit board In some specific applications, it is even possible to solder at least two flexible printed circuit boards into an integrated flexible printed circuit board. [0003] Obviously, the thickness of the soldering position of the integrated flexible printed cir...

AI Technical Summary

Problems solved by technology

In this way, the solder bumps used for soldering are obviously protruded relative to the surface of the integrated flexible printed circuit board, which is easy to cause the integrated flexible printed circuit board to break at the welding position, resulting in the failure of the integrated flexible printed circuit board

[0004] Combining the above technical solutions and existing problems in reality, as well as combining the currently widely used technical solutions, the main defects are mainly reflected in the following aspects: poor thermal conductivity and heat dissipation, and difficult to control the transformation of the spatial structure and the specific size , which directly leads to its difficulty in improving its reliability; furthermore, because of the extremely poor dimensional stability and low wiring density, it is not convenient to make multilayer boards, and in the prior art, mechanical punching is used in the manufacture of multilayer flexible circuit boards. When the hole and mechanical cutting are used, it is easy to produce slag particles of various particle sizes, which will affect the performance of the circuit board

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