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Method for magnetron sputtering deposition of nickel films and oxidation of nickel films

A magnetron sputtering and nickel oxide film technology, which is applied in the field of sputtering coating to achieve the effects of good uniformity, firm film-layer bonding and simple operation

Inactive Publication Date: 2018-09-14
SHAANXI NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But for the target material of nickel, it is difficult to deposit nickel film and nickel oxide film by conventional magnetron sputtering method. This is because nickel has high magnetic permeability, most of the magnetic field passes through the inside of the nickel target, and severe magnetic shielding If the magnetic field on the surface of the nickel target is too small, the nickel film and nickel oxide film cannot be deposited by magnetron sputtering.

Method used

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  • Method for magnetron sputtering deposition of nickel films and oxidation of nickel films

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Wipe the glass substrate with a dust-free paper dipped in ethanol, then ultrasonically clean the glass substrate in acetone and ethanol for 30 minutes, dry it with nitrogen, and install it on the sample holder of the magnetron sputtering equipment. Put a 3mm thick aluminum disc on top of the target gun, and then place the nickel target on the aluminum disc, which is the same size as the nickel target. Close the vacuum chamber cover of the magnetron sputtering equipment, and use a mechanical pump and a molecular pump to vacuum the deposition chamber to 5.0×10 -4 Pa, then open the argon ventilation valve, and open the mass flow meter, control the argon gas flow rate to 30.0sccm, first adjust the deposition chamber pressure to 2.0Pa, sputtering power is 30W start, then adjust the deposition chamber pressure to 0.6Pa, sputter Radiation power to 100W, pre-sputtering for 1 minute to remove contamination on the surface of the nickel target, then open the baffle to start deposi...

Embodiment 2

[0015] In this embodiment, open the argon ventilation valve and the oxygen ventilation valve, and turn on the mass flow meter, control the flow rate of oxygen to 10.0 sccm, and the flow rate of argon to 20.0 sccm, and the other steps are the same as in Example 1, and the thickness is 380-390nm. Nickel oxide film.

Embodiment 3

[0017] In this example, the aluminum disc in Example 1 was replaced with a copper disc with a thickness of 3 mm, and other steps were the same as in Example 1 to obtain a nickel oxide film with a thickness of 380-390 nm.

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Abstract

The invention discloses a method for magnetron sputtering deposition of nickel films and oxidation of the nickel films. A nonmagnetic metal round piece, such as a copper round piece or an aluminum round piece, with a certain thickness is inserted between a target gun and a nickel target to reduce the magnetic shielding effect of the nickel target, so that magnetron sputtering deposition and oxidation of the nickel films are successful. The method is simple in operation; prepared nickel films and nickel oxide films are compact and excellent in uniformity; and film layers are firmer in combination.

Description

technical field [0001] The invention belongs to the technical field of sputtering coating, in particular to a method for preparing a nickel film and a nickel oxide film by magnetron sputtering. Background technique [0002] Magnetron sputtering technology can prepare decorative films, hard films, corrosion-resistant friction films, superconducting films, magnetic films, optical films, and various films with special functions. It is a very effective film deposition method. It is widely used in industrial fields. The films obtained by magnetron sputtering have strong adhesion. The basic principle of magnetron sputtering is to use a magnetic field to change the direction of electron movement, confine and prolong the trajectory of electrons, improve the ionization rate of electrons to the working gas and effectively use the energy of electrons, so that positive ions bombard the target. Target sputtering is more efficient. But for the target material of nickel, it is difficult...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/18C23C14/08
CPCC23C14/35C23C14/08C23C14/185
Inventor 高斐高蓉蓉武鑫王昊旭雷婕
Owner SHAANXI NORMAL UNIV