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A low-temperature brazing diamond containing Cr and its solder alloy

A technology of diamond and diamond particles, which is applied in metal processing equipment, grinding devices, manufacturing tools, etc., can solve the problems of diamond abrasive particles and tool substrate heat damage brazing material costs, etc., achieve low vacuum requirements and avoid graphitization , The effect of reducing the cost of brazing

Active Publication Date: 2020-08-07
厦门石之锐材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the weak point of prior art, provide a kind of Cr-containing low-temperature brazing diamond and its brazing material alloy, solve the heat of the brazing process in the above-mentioned background technology to diamond abrasive grain and its tool matrix Damage and the cost of solder, etc.

Method used

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  • A low-temperature brazing diamond containing Cr and its solder alloy
  • A low-temperature brazing diamond containing Cr and its solder alloy
  • A low-temperature brazing diamond containing Cr and its solder alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Please check figure 1 , a kind of solder alloy of the present embodiment is the mixed powder of Sn-48Cu-2Cr (wt.%); Carry out the low-temperature brazing diamond operation containing Cr with it as follows:

[0023] Take by weighing 21.33 grams of pure Sn, 72 grams of Cu-40wt.% Sn pre-alloyed powder, and 6.667 grams of Cu-30wt.% Cr pre-alloyed powder, and mix uniformly in a mixer so that the element ratio is Sn-48Cu-2Cr( wt.%) mixed powder. The brazing filler metal alloy powder that makes with this is respectively in vacuum tube type furnace (less than 5.0 * 10 -3 Pa) at 700 and 750 °C for 60 minutes to weld diamond particles with a particle size of 30 / 35, and the solder alloy and diamond particles form a good connection. figure 1 It corresponds to the macroscopic morphology and interface microscopic morphology of diamond solder joints. The solder climbed up on the diamond surface to form a crater morphology, and a Cr-C reaction layer was formed at the interface, indi...

Embodiment 2

[0025] Please check figure 2 , a kind of solder alloy of the present embodiment is the mixed powder of Sn-60.7Cu-2Cr (wt.%); Carry out the low-temperature brazing diamond operation containing Cr with it as follows:

[0026] Weigh 93.333 grams of Cu-40wt.% Sn pre-alloyed powder and 6.667 grams of Cu-30wt.% Cr pre-alloyed powder respectively, and mix them uniformly in a mixer to be Sn-60.7Cu-2Cr (wt.%) Mix powder. The brazing filler metal alloy powder that makes with this is in vacuum tube type furnace (less than 5.0 * 10 -3 Weld diamond particles with a particle size of 30 / 35 in Pa) at 750°C for 60 minutes, and the solder alloy and diamond particles form a good connection. figure 2 It corresponds to the macroscopic morphology and interface microscopic morphology of diamond solder joints. The Cr-C reaction layer is formed at the interface, indicating that the brazing filler metal and diamond have chemical metallurgical connection.

Embodiment 3

[0028] Please check image 3 , a kind of solder alloy of the present embodiment is the mixed powder of Sn-50Cu-2Cr (wt.%); Carry out the low-temperature brazing diamond operation containing Cr with it as follows:

[0029] Weigh 17.778 grams of pure Sn powder, 75.555 grams of Cu-40wt.% Sn pre-alloyed powder, and 6.667 grams of Cu-30wt.% Cr pre-alloyed powder, and mix them uniformly in a mixer so that the element ratio is Sn-60.7Cu-2Cr (wt.%) mixed powder. The brazing filler metal alloy powder that makes with this is in vacuum tube type furnace (less than 5.0 * 10 -3 Weld diamond particles with a particle size of 30 / 35 in Pa) at 750°C for 30 minutes, and the solder alloy and diamond particles form a good connection. image 3 It corresponds to the macroscopic morphology and interface microscopic morphology of diamond solder joints. The Cr-C reaction layer is formed at the interface, indicating that the brazing filler metal and diamond have chemical metallurgical connection.

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Abstract

The invention discloses Cr-containing low-temperature braze welding diamond and a brazing alloy thereof. The diamond is prepared by welding diamond particles to brazing an alloy for 30-70 minutes at atemperature lower than 800 DEG C in a vacuum tubular furnace with vacuum degree smaller than 5.5*10<-3> Pa; the brazing alloy comprises 20-65wt% of Cu, 1-10wt% of Cr and the balance tin and inevitable impurities; and a melting point of the brazing alloy is 530-740 DEG C. Low-temperature welding of the diamond can be realized, and graphitization of the diamond is mechanically avoided, so that thermal damages in a welding process are greatly reduced.

Description

technical field [0001] The invention relates to a Cr-containing low-temperature brazing diamond and its brazing material alloy. Background technique [0002] Diamond has high strength and hardness, and is the hardest substance found in nature. Due to these superior physical and chemical properties, synthetic diamonds are usually used as abrasive grains for grinding tools, which play an important role in the processing of hard and brittle materials. At present, electroplating, sintering, and brazing are the main means to realize the connection between diamond and tool substrate. For the electroplating technique, the diamond is mechanically embedded in the metal coating, which results in a relatively weak bond between the tool substrate and the diamond abrasive grains. For sintering technology, the low exposure of diamond grit is a problem, and the chip removal ability is poor. The brazing method can increase the exposure of diamond abrasive grains to 70%-80%, greatly impro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D18/00C22C9/02C22C13/00
CPCB24D18/0009C22C9/02C22C13/00
Inventor 穆德魁陈金昶廖信江黄辉徐西鹏
Owner 厦门石之锐材料科技有限公司
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