A semiconductor chip production process

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor chip production process. The process comprises the following steps that a waferis placed on a grinding machine to be grinded into a mirror surface; the wafer is sent into a high-temperature diffusion furnace to be subjected to oxidation treatment; the wafer is sent to a glue mixing device to be coated with photoresist; the wafer is sent into a rotary photoetching machine to be subjected to exposure and developing; and the wafer is sent into an etching machine to be subjected to plasma etching; and the wafer is sent into a high-temperature furnace for doping. By virtue of the process, a dynamic balance device is arranged in a rotary hollow cavity, so that vibration generated in the rotating process of a rotating table is reduced; a damping device is arranged between a main frame and a foundation frame, so that vibration generated by the main frame is reduced; annularspherical magnets are embedded into the outlet of a number four air blowing hole, so that the air blowing hole is opened under the action of magnetic force, the size of the air blowing hole area is dynamically adjusted, and the use amount of compressed air is saved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a semiconductor chip production process. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafers are the most commonly used semiconductor materials. In the production process of integrated circuit chips, the exposure and transfer of chip design patterns on the photoresist on the surface of silicon wafers is one of the most important processes. The equipment used in this process is called a photolithography machine. Lithography machine is the most critical equipment in the process of integrated circuit processing. Foreign countries have proposed the concept of next-generation lithography many years ago, and have conducted a lot of research on technologie...

AI Technical Summary

Problems solved by technology

However, the elimination of the vibration of the silicon wafer table in this scheme does not give an exact solution; and the damping effect of the shock absorber between the main frame and the base frame cannot reach the expected effect

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