A kind of silane grafted poe adhesive film for photovoltaic encapsulation and preparation method
A silane grafting and adhesive film technology, applied in the directions of grafted polymer adhesives, adhesives, films/sheets without carriers, etc., can solve the problems of poor thermal creep resistance and inability to use traditional crystalline silicon photovoltaic modules, etc. Achieve the effect of preventing delamination, shortening component lamination time, and increasing melting temperature
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Embodiment 1
[0030] (1) 95 parts of POE resin (melt flow rate is 16g / 10min, light transmittance>91%, volume resistivity>1.0×10 15 , melting temperature is 76°C), 0.3 parts of vinyltrimethoxysilane, 0.05 parts of dicumyl peroxide, 10 parts of polyurethane elastomer resin (light transmittance > 90%, volume resistivity > 1.0×10 15 , the melting temperature is 145°C), 0.1 part of tripropenyl isocyanurate, 0.5 part of POE grafted maleic anhydride, mixed evenly, poured into a twin-screw extruder, and prepared graft masterbatch at 160-220°C, Standby; (2) Mix 5 parts of POE resin (melt flow rate is 16g / 10min, light transmittance>91%, volume resistivity>1.0×10 15 , melting temperature is 76°C), 0.1 part of 3,5-di-tert-butyl-4-hydroxy-hexadecyl benzoate, 0.1 part of 2-benzotriazol-2-yl-4,6-di-tert Butylphenol, 0.1 part of β-(3,5-di-tert-butyl-4-hydroxyphenyl) n-octadecyl propionate are mixed evenly, poured into a twin-screw extruder, and prepared at 160-220°C Auxiliary masterbatch, spare; (3) Mix ...
Embodiment 2
[0033] (1) 95 parts of POE resin (melt flow rate is 16g / 10min, light transmittance>91%, volume resistivity>1.0×10 15 , melting temperature is 76°C), 0.5 parts of γ-methacryloxypropyltrimethoxysilane, 0.5 parts of vinyltrimethoxysilane, 0.1 part of tert-butyl peroxy-2-ethylhexyl carbonate, 20 Parts of styrene-ethylene-butylene-styrene block copolymer elastomer resin (light transmittance>90%, volume resistivity>1.0×10 15, melting temperature is 155°C), 0.1 part of tripropenyl isocyanurate, 0.1 part of divinylbenzene, 1.5 parts of POE grafted maleic anhydride, mix well, pour into twin-screw extruder, 160-220°C Prepare grafted masterbatches for later use; (2) Mix 5 parts of POE resin (melt flow rate is 16g / 10min, light transmittance>91%, volume resistivity>1.0×10 15 , melting temperature is 76°C), 0.05 part of bis(2,2,6,6-tetramethylpiperidinyl) sebacate, 0.05 part of 2-hydroxy-4-n-octyloxybenzophenone, 0.6 Parts of tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pent...
Embodiment 3
[0036] (1) 95 parts of POE resin (melt flow rate is 3g / 10min, light transmittance> 85%, volume resistivity> 1.0×10 14 , melting temperature is 97°C), 3 parts of vinyltriethoxysilane, 0.25 parts of dicumyl peroxide, 5 parts of polyurethane elastomer resin (light transmittance > 90%, volume resistivity > 1.0×10 15 , melting temperature is 145°C), 5 parts of styrene-ethylene-butylene-styrene block copolymer elastomer resin (light transmittance>90%, volume resistivity>1.0×10 15 , the melting temperature is 155°C), 0.2 parts of trimethylolpropane triacrylate, 2.5 parts of POE grafted maleic anhydride, 1.5 parts of POE grafted glycidyl methacrylate, mixed evenly, and poured into the twin-screw extruder , 160-220°C to prepare grafted masterbatches for later use; (2) Mix 5 parts of POE resin (melt flow rate is 3g / 10min, light transmittance>85%, volume resistivity>1.0×10 14 , melting temperature is 97°C), 0.3 parts of bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidinyl) sebacate, 0.3 pa...
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