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Preparation method of high-bending-strength dielectric composite material

A composite material and flexural strength technology, which is applied in the field of high flexural strength dielectric composite material preparation, can solve problems that cannot meet the needs of the development of the microelectronics industry, and achieve good application prospects, improved performance, and high flexural strength.

Inactive Publication Date: 2018-11-13
吴江市聚盈电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional dielectric materials such as epoxy resin and high-temperature ceramics have corresponding congenital defects, which can no longer meet the needs of the development of the microelectronics industry. Therefore, the development of new dielectric materials has become a hot research topic at present.

Method used

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  • Preparation method of high-bending-strength dielectric composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] (1) Add 8 parts of lithium chloride, 7 parts of barium titanate, and 16 parts of bisimidazolidinyl urea to 25 times the weight of H with a mass concentration of 30% 2 O 2 In the solution, ultrasonic treatment is carried out in an ultrasonic processor. The ultrasonic treatment power is 800W and the treatment time is 10 minutes. Then the ultrasonic treatment mixture is sent into an oil bath at 130°C, kept warm and stirred for 60 minutes, and then centrifuged. The separated precipitated product was vacuum dried at 80°C for 6 hours, and then the dried product was placed in a planetary ball mill for ball milling. The ball-to-material ratio of the ball milling process was 20:1, the speed of the ball mill was 500 rpm, and the milling time 2 hours to obtain modified powder of ultrasonic oxidation;

[0020] (2) Change 55 parts of polystyrene resin, 50 parts of polybutylene terephthalate, 45 parts of diisopropylamine dichloroacetate, 1 part of dicumyl peroxide and the ultrasonic oxid...

Embodiment 2

[0025] (1) Add 9 parts of lithium chloride, 8 parts of barium titanate, and 18 parts of bisimidazolidinyl urea to 25 times the weight of H with a mass concentration of 30% 2 O 2 In the solution, ultrasonic treatment is carried out in an ultrasonic processor. The ultrasonic treatment power is 900W and the treatment time is 15 minutes. Then the ultrasonic treatment mixture is sent into an oil bath at 135°C, kept warm and stirred for 70 minutes, and then centrifuged. The separated precipitated product was vacuum dried at 80°C for 7 hours, and then the dried product was placed in a planetary ball mill for ball milling. The ball-to-material ratio of the ball milling process was 20:1, the speed of the ball mill was 500 rpm, and the milling time For 3 hours, the ultrasonic oxidation modified powder is obtained;

[0026] (2) 60 parts of polystyrene resin, 55 parts of polybutylene terephthalate, 50 parts of diisopropylamine dichloroacetate, 2 parts of tert-butyl hydrogen peroxide and the u...

Embodiment 3

[0031] (1) Add 10 parts of lithium chloride, 9 parts of barium titanate, and 20 parts of bisimidazolidinyl urea to 25 times the weight of H with a mass concentration of 30% 2 O 2 In the solution, ultrasonic treatment is carried out in an ultrasonic processor, the ultrasonic treatment power is 1000W, the treatment time is 20 minutes, and then the ultrasonic treatment mixture is sent into an oil bath at 140°C, kept warm and stirred for 80 minutes, and then centrifuged. The separated precipitated product was vacuum dried at 80°C for 8 hours, and then the dried product was placed in a planetary ball mill for ball milling. The ball-to-material ratio of the ball milling process was 20:1, the ball mill speed was 500 rpm, and the milling time 4 hours to obtain modified ultrasonic oxidation powder;

[0032] (2) Combine 65 parts of polystyrene resin, 60 parts of polybutylene terephthalate, 55 parts of diisopropylamine dichloroacetate, 3 parts of 2,4-dichlorobenzoyl peroxide and step (1) Th...

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Abstract

The invention discloses a preparation method of a high-bending-strength dielectric composite material, the method includes the steps of subjecting raw materials such as lithium chloride to ultrasonicoxidization treatment, obtaining ultrasonic oxidization modified powder through processes such as oil-bath heat insulation, performing heat treatment on the ultrasonic oxidization modified powder andraw materials such as polystyrene resin, preparing a heat treatment reaction mixture into a sulfonated modified mixture, adding the sulfonated modified mixture, sulfo-acetic acid and the like into a ethyl acetate solution for ultrasonic treatment, adding linear phenolic resin for oil-bath heat insulation reaction, mixing a reactant with raw materials such as benzyltriethylammonium chloride after centrifugal drying, performing constant-temperature magnetic stirring and condensation backflow after temperature rise, performing rotary steaming and drying to obtain an intermediate composite, preparing the intermediate composite into a blank, adding the blank into an N,N-dimethylformamide solution, and performing technological treatment such as heating and stirring to obtain the finished dielectric composite material, the prepared high-bending-strength dielectric composite material has high bending strength, and has a promising application prospect in manufacture of capacitors.

Description

Technical field [0001] The invention relates to the technical field of new electronic materials, in particular to a method for preparing a high bending strength dielectric composite material. Background technique [0002] Electronic materials are the material basis for the development of modern electronics industry and science and technology. They mainly refer to materials used in electronic technology and microelectronics technology, including dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and their alloy materials , Magnetic materials, optoelectronic materials and other related materials. Electronic materials cover a wide range, and their main function is that they are optically functional materials that may affect the electrical properties of products. At present, electronic materials are mainly used in industries such as IC manufacturing, flat panel displays, packaging, printed circuit boards, and solar cells. Die...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/06C08L67/02C08L77/02C08L61/06C08K13/06C08K9/00C08K9/02C08K3/16C08K3/24C08K5/3445C08K5/17C08K5/526
CPCC08L25/06C08L2203/20C08L2205/035C08L67/02C08L77/02C08L61/06C08K13/06C08K9/00C08K9/02C08K3/16C08K3/24C08K5/3445C08K5/17C08K5/526
Inventor 吴付荣
Owner 吴江市聚盈电子材料科技有限公司