Copper-silicon alloy material, electroslag remelting preparation method thereof and copper-silicon alloy wire material

A technology of copper-silicon alloy and electroslag remelting, which is applied in the field of preparation of copper-silicon alloy wire, copper-silicon alloy material and its electroslag remelting, can solve the problem of affecting the quality and application field of heating cables, unstable resistivity, resistance Poor foldability and other problems, to achieve the effect of less brittle fracture, stable resistivity, and good stretchability

Inactive Publication Date: 2018-11-13
沈阳赛美特新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, copper-nickel alloy wires currently on the market generally have problems such as poor folding resistance and unstable resistivity, which seriously affect the quality and application fields of heating cables.

Method used

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  • Copper-silicon alloy material, electroslag remelting preparation method thereof and copper-silicon alloy wire material
  • Copper-silicon alloy material, electroslag remelting preparation method thereof and copper-silicon alloy wire material
  • Copper-silicon alloy material, electroslag remelting preparation method thereof and copper-silicon alloy wire material

Examples

Experimental program
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Effect test

Embodiment 1

[0057] In this embodiment, the process of preparing a high-performance copper-silicon alloy material by electroslag remelting is as follows:

[0058] (1) The chemical composition is (wt%): Si=2.1%, Mn=0.82%, Ni=0.23%, Ag=0.1%; Mg=0.1%, Al=0.1%, and the balance is copper-silicon mother of Cu Alloy ingots are used as raw materials; the ratio of slag system is: the mass percentage of high-purity NaF is 26%, and the balance is fluorite. The NaF content in high-purity NaF is greater than 98%, and the SiO2 content is less than 0.5%. The mass percentage of CaF2 in the fluorite is not less than 98.5% and the mass percentage of silicon dioxide is less than 1%. The prepared copper-iron alloy electroslag remelted ingot has a smooth surface after removing the surface slag crust.

[0059] (2) After the alloy ingot prepared by electroslag remelting is turned, it is rolled and drawn to make a Φ1.5mm wire.

[0060] (3) The wire material of Φ1.5mm is annealed at 620~650℃, and can be drawn in...

Embodiment 2

[0067] In this embodiment, the process of preparing a high-performance copper-silicon alloy material by electroslag remelting is as follows:

[0068] (1) Adopt chemical composition as (wt%): Si=2.42%, Mn=0.90%, Ni=0.25%%, Ag=0.1%; Mg=0.1%; Al=0.1%; Surplus is the silicon bronze of Cu The master alloy ingot is used as the raw material; the ratio of the slag system is: the mass percentage of high-purity NaF is 27%, and the balance is fluorite. The NaF content in high-purity NaF is greater than 98%, and the SiO2 content is less than 0.5%. The mass percentage of CaF2 in the fluorite is not less than 98.5% and the mass percentage of silicon dioxide is less than 1%. The prepared copper-iron alloy electroslag remelted ingot has a smooth surface after removing the surface slag crust.

[0069] (2) After the alloy ingot prepared by electroslag remelting is turned, it is made into a Φ1.5mm wire through a specific rolling and wire drawing process.

[0070] (3) The wire material of Φ1.5m...

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Abstract

The invention discloses a copper-silicon alloy material, an electroslag remelting preparation method thereof and a copper-silicon alloy wire material, and belongs to the technical field of non-ferrousalloys. The copper-silicon alloy material is prepared by an electroslag remelting process. The copper-silicon alloy material comprises the chemical compositions of 1.85-2.65% of Si, 0.6-1.0% of Mn, 0.2-0.3% of Ni, 0.08-0.2% of Ag, and the balance Cu. In the preparation process, a CaF2-NaF binary slag system with a high purity NaF is used, wherein the content of the high purity NaF is 25.5-28wt. %. A copper-silicon alloy ingot is rolled and wiredrawn to obtain the copper-silicon alloy wire material with excellent tensile properties. The wire material has good folding resistance, good fusing property and stable resistivity.

Description

technical field [0001] The invention relates to the technical field of non-ferrous alloys, in particular to a copper-silicon alloy material, an electroslag remelting preparation method thereof, and a copper-silicon alloy wire. Background technique [0002] The heating cable is made of cable structure, uses electricity as the energy source, and uses alloy resistance wire to conduct electricity and generate heat to achieve the effect of heating or heat preservation. After the heating cable is energized, the alloy resistance wire generates heat and runs at a temperature of 40-60°C. The heating cable buried in the filling layer transmits heat energy through heat conduction (convection) and emits 8-13um far-infrared radiation. passed to the heating body. Heating cables are widely used because of their safety, high efficiency, easy control, easy installation (can be installed in any shape), long life, and low investment. [0003] At present, copper, nickel, and chromium alloys a...

Claims

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Application Information

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IPC IPC(8): C22C9/10C22C1/02C22B9/18B21C37/04C22F1/08
Inventor 杨帆姜骁箐张新法吴彬董君伟
Owner 沈阳赛美特新材料科技有限公司
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