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Spectrum selective emission material that can be used for infrared stealth and its preparation method

An emission material and selective technology, applied in chemical instruments and methods, metal material coating technology, optics, etc., can solve the problems of inconvenient large-area preparation, material layer falling off, low-emissivity infrared stealth film, etc., to achieve convenient Large-area preparation and application, low emissivity and radiation heat dissipation, simple and feasible preparation process

Active Publication Date: 2020-05-01
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the research and application of materials with spectrally selective emission characteristics in the field of infrared stealth technology is still immature
Chinese patent CN104865617A discloses an infrared stealth film with spectral selectivity and low emissivity and its preparation method. The infrared stealth film includes a silicon substrate and layers of high refractive index materials (Ge) alternately coated on the surface of the silicon substrate and Low refractive index material layer (MgF 2 ), the structure of this infrared stealth film is complex, the thickness is relatively thick, it is not convenient for large-scale preparation, and the use of high temperature environment will easily cause the material layer to fall off, which affects the use of infrared stealth materials

Method used

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  • Spectrum selective emission material that can be used for infrared stealth and its preparation method
  • Spectrum selective emission material that can be used for infrared stealth and its preparation method
  • Spectrum selective emission material that can be used for infrared stealth and its preparation method

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Embodiment 1

[0030] a kind of like figure 1 The spectrally selective emission material that can be used for infrared stealth is shown. The spectrally selective emission material is a layered structure that can regulate the emission characteristics of the infrared spectrum. The layered structure uses glass as a substrate, and the glass surface is alternately coated There are metal layers and infrared transparent dielectric layers.

[0031] In the spectrally selective emission material of this embodiment, the metal layer is an Al layer, and the infrared transparent medium layer is Si. The material in this embodiment is composed of metal layers and infrared transparent medium layers alternately stacked and compounded, and there are four layers in total. Starting from the substrate layer, there are 90nm Al layer, 720nm Si layer, 20nm Al layer, and 420nm Si layer in sequence, and the total thickness of the entire layered structure is 1250.0nm.

[0032] In this embodiment, the infrared transmi...

Embodiment 2

[0037] A spectrally selective emission material that can be used for infrared stealth. The spectrally selective emission material is a layered structure that can regulate the emission radiation characteristics of the infrared spectrum. The layered structure uses a silicon wafer as a substrate, and the surface of the silicon wafer is coated with Covered with a metal layer and an infrared transparent medium layer.

[0038] In the spectrally selective emission material of this embodiment, the metal layer is W, and the infrared transparent medium layer is ZnSe. The layered structure of this embodiment is composed of W metal layers and ZnSe dielectric layers alternately stacked and compounded. From the silicon wafer substrate, they are 50.0nm W, 800.0nm ZnSe, 18nm W, and 500.0nm ZnSe. The total thickness of the entire layered structure is 1368.0nm.

[0039] In this embodiment, the infrared transmittance of the 500nm and 800nm ​​infrared transparent medium layer ZnSe is higher than...

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Abstract

The present invention discloses a spectral selective emissive material that can be used for infrared stealth. The spectral selective emissive material is a layered structure comprising a substrate, and metal layers and infrared transparent dielectric layers which alternately coat the surface of the substrate. The present invention also provides a method for preparing the spectral selective emissive material. By means of the design and optimization of the metal layers and the infrared transparent dielectric layers, it can be known based on theoretical analysis and calculation that the spectral selective emissive material can achieve emissivity of less than 0.20 and less than 0.25 in infrared window wavebands of 3.0 [mu]m to 5.0 [mu]m and 8.0 [mu]m to 14.0 [mu]m respectively, and an emissivity of greater than 0.80 in a non-window waveband of 5.0 [mu]m to 8.0 [mu]m. The spectral selective emissive material realizes infrared selective emission, takes account of a low emissivity and radiation heat dissipation requirement, and has great significance for infrared stealth.

Description

technical field [0001] The invention belongs to the technical field of functional materials, and in particular relates to a spectrally selective emission material and a preparation method thereof. Background technique [0002] As one of the cutting-edge military technologies, stealth technology has received more and more attention, and it is extremely important for winning modern warfare. In various stealth technologies, infrared stealth occupies a very important position. The concept of infrared stealth refers to eliminating or reducing the difference in the radiation characteristics of the two atmospheric windows (3.0μm~5.0μm, 8.0μm~14.0μm) in the middle and far infrared bands between the target and the background. [0003] At present, reducing the infrared radiation output of the target is the most important way to achieve infrared stealth. According to the Stefan-Boltzmann law: M=εσT 4 , Infrared radiation emission is related to temperature T and emissivity ε. Theref...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B1/10B32B19/00C23C14/35
CPCB32B19/00C23C14/35G02B1/10
Inventor 刘东青彭亮程海峰
Owner NAT UNIV OF DEFENSE TECH
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