Metal bonding agent, metal bonding agent diamond grinding wheel and preparing method of metal bonding agent diamond grinding wheel
A technology of metal bond and diamond grinding wheel, which is applied in the field of abrasives and abrasive tools, can solve the problems of high sintering temperature and high production cost of abrasive tools, and achieve the effects of low sintering temperature, improved wear resistance and reduced production cost
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Embodiment 1
[0034] The metal bonding agent of this embodiment is composed of the following components in mass percentage: 16% copper powder, 4% tin powder, 4% titanium hydride powder, and the balance is copper-tin alloy powder. Wherein the copper-tin alloy powder is composed of the following components in mass percentage: 20% tin, and the balance is copper.
[0035] The preparation method of the metal bond in this embodiment is as follows: put the copper powder, tin powder, titanium hydride, and copper-tin alloy powder that have passed through a 400-mesh sieve respectively into a vacuum ball mill for 20 hours according to the above-mentioned percentages, and then pass through a 325-mesh sieve , to obtain metal binders.
Embodiment 2
[0037] The metal bond diamond grinding wheel of this embodiment includes metal bond and diamond. The mass percentage of metal bond in the metal bond diamond grinding wheel is 83.7%, and the mass percentage of diamond is 16.3%. Wherein the metal bond is the metal bond in Example 1, and the diamond is titanium-plated diamond.
[0038] The preparation method of the metal bond diamond grinding wheel of the present embodiment comprises the following steps:
[0039] (1) Get the titanium-coated diamond of formula quantity and moisten with liquid paraffin, then add the metal bonding agent of formula quantity, mix 24h with high-energy mixer, obtain molding material;
[0040] (2) Vacuum hot pressing sintering was performed on the obtained molding material, the sintering temperature was 630° C., the pressure was 29 MPa, and the holding time was 8 minutes.
Embodiment 3
[0042] The metal bonding agent of this embodiment is composed of the following components in mass percentage: 16% copper powder, 4% tin powder, 4% titanium hydride powder, and the balance is copper-tin alloy powder. Wherein the copper-tin alloy powder is composed of the following components in mass percentage: 15% tin, and the balance is copper.
[0043] The preparation method of the metal bond in this embodiment is as follows: Put the copper powder, tin powder, titanium hydride, and copper-tin alloy powder that have passed through a 325 mesh sieve respectively into a vacuum ball mill for 20 hours according to the above percentages, and then pass through a 325 mesh sieve , to obtain metal binders.
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