Processing method and device for ultrafast green laser transparent material

A technology of transparent materials and processing methods, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as processing limitations, and achieve the effect of improving removal efficiency

Pending Publication Date: 2018-12-25
杭州银湖激光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The purpose of the present invention is to provide a processing method for ultra-fast green laser transparent materials, to overcome the problem of limited processing in the prior art, and to improve the processing accuracy and speed of laser transparent materials

Method used

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  • Processing method and device for ultrafast green laser transparent material
  • Processing method and device for ultrafast green laser transparent material
  • Processing method and device for ultrafast green laser transparent material

Examples

Experimental program
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Embodiment 1

[0040] Embodiment one: see figure 2 As shown, a transparent material processing device is composed of an ultrafast pulse train laser, a scanning galvanometer, and a focusing lens. See figure 1 , the ultrafast burst laser is mainly composed of a burst seed laser with an output wavelength between 1020 nm and 1090 nm, a multi-stage or single-stage fiber amplifier, a collimator and a frequency doubling device, and the output light of the burst seed laser After being amplified by the fiber amplifier, the laser pulse train is output after being collimated by the collimator; optical frequency doubling is performed to obtain green light output with a wavelength of 510nm-545nm, and the green laser pulse train is output. The laser pulse train is focused on the position of the transparent material to be processed by the focusing lens after passing through the scanning galvanometer. Below the transparent material, corresponding to the position to be processed, there is a dust suction de...

Embodiment 2

[0042] Embodiment two: see attached image 3 As shown, a transparent material processing device is composed of an ultrafast pulse train laser and a focusing lens, see figure 1 , the ultrafast burst laser is mainly composed of an ultrafast burst seed laser with an output wavelength between 1020 nm and 1090 nm, a multi-stage or single-stage fiber amplifier, a collimator, and a frequency doubling device. The burst seed laser After the output light is amplified by the fiber amplifier, it is collimated by the collimator to output the laser pulse train; after optical frequency doubling, the green light output with a wavelength of 510nm-545nm is obtained, and the green laser pulse train is output. The laser pulse train is focused by the focusing lens on the position of the transparent material to be processed. Below the transparent material, corresponding to the position to be processed, there is a dust suction device for recycling the removed material.

[0043] In this embodiment,...

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Abstract

The invention discloses a processing method and device for an ultrafast green laser transparent material and provides an optical fiber laser, the wave length of which is ranged between 1020 nm and 1090 nm. By adopting the optical fiber laser for amplifying energy, the processing method is characterized by comprising the following steps: then carrying out optical frequency doubling to obtain a green laser pulse string, wherein each pulse string comprises at least two laser pulses, the pulse width is smaller than 200ps, the peak power of the pulse is greater than 100 kW, the time of adjacent laser pulses in the pulse string is shorter than 90 ns, the interval time among the pulse strings is greater than 240 ns, and the total pulse number per second is greater than 50,000; carrying out energyamplification on the ultrafast laser string output by the laser only with the optical amplifier; and focusing the green laser string to the lower surface of a to-be-processed transparent material, and processing the material according to a set track and raising the focus point gradually so as to process the transparent material from bottom to top. According to the processing method, the removal efficiency of the material can be improved greatly without a follow-up step of heating or acid invasion and generation of an oblique angle.

Description

technical field [0001] The invention relates to a transparent material processing method, in particular to an ultrafast laser processing method for transparent materials. Background technique [0002] Glass and sapphire transparent materials have become an indispensable part of people's daily life. With the development of economy, the demand for glass products is increasing day by day. In the glass and sapphire production industry, glass and sapphire processing is a very important link. [0003] Generally speaking, glass and sapphire processing (cold processing) mainly includes polishing, cutting, drilling, engraving, edging, etc. In order to industrialize the above-mentioned glass and sapphire processing purposes, the processing methods used in the prior art mainly include mechanical processing methods, chemical processing methods (mainly used for polishing and etching), high-pressure water jet processing methods (mainly used for cutting and drilling) holes) and laser pro...

Claims

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Application Information

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IPC IPC(8): B23K26/402B23K26/06B23K26/064B23K26/082B23K26/04
CPCB23K26/04B23K26/064B23K26/0648B23K26/082B23K26/402
Inventor 蒋仕彬
Owner 杭州银湖激光科技有限公司
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