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Method for preparing paper-based copper clad laminate

A copper clad laminate and paper-based technology, applied in chemical instruments and methods, electronic equipment, lamination, etc., can solve the problems of environmental pollution, high production cost, poor heat dissipation, etc., and achieve small free volume, low production cost, and solder resistance. good effect

Inactive Publication Date: 2019-01-18
招远春鹏电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention aims at the problems of poor heat dissipation, high production cost and environmental pollution of paper-based copper-clad laminates in the existing market, and provides a preparation method of paper-based copper-clad laminates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for preparing a paper-based copper-clad laminate, comprising the steps of:

[0026] 1) Raw material preparation: uniformly mix the film-forming raw material, alumina and flame retardant, wherein the film-forming raw material is a mixture of PBAT and PBS at a mass ratio of 3:1, and the number-average molecular weight of the PBAT raw material is 80-100 10,000, the number average molecular weight of the PBS raw material is 600,000 to 800,000, and the mass ratio of the film-forming raw material, alumina, and flame retardant is 65:25:10, and the flame retardant is composed of tetrabromobisphenol A and triphenyl phosphate The esters are mixed according to the mass ratio of 1:3, and the mixture is transported to the storage bin of the laminating machine;

[0027] 2) Single-sided coating: the mixture in the storage bin enters the screw of the coating machine and is heated and propelled. The coating machine is divided into 6 heating sections along the direction of the s...

Embodiment 2

[0031] A method for preparing a paper-based copper-clad laminate, comprising the steps of:

[0032] 1) Raw material preparation: uniformly mix the film-forming raw material, alumina and flame retardant, wherein the film-forming raw material is a mixture of PBAT and PBS at a mass ratio of 5:1, and the number-average molecular weight of the PBAT raw material is 50-80 10,000, the number average molecular weight of the PBS raw material is 800,000 to 1,000,000, and the mass ratio of the film-forming raw material, alumina, and flame retardant is 70:25:5, and the flame retardant is composed of tetrabromobisphenol A and triphenyl phosphate The esters are mixed according to the mass ratio of 1:4, and the mixture is transported to the storage bin of the laminating machine;

[0033] 2) Single-sided coating: the mixture in the storage bin enters the screw of the coating machine and is heated and propelled. The coating machine is divided into 6 heating sections along the direction of the s...

Embodiment 3

[0037]A method for preparing a paper-based copper-clad laminate, comprising the steps of:

[0038] 1) Raw material preparation: uniformly mix the film-forming raw material, alumina and flame retardant, wherein the film-forming raw material is a mixture of PBAT and PBS at a mass ratio of 4:1, and the number-average molecular weight of the PBAT raw material is 30-50 10,000, the number average molecular weight of the PBS raw material is 600,000 to 800,000, and the mass ratio of the film-forming raw material, alumina, and flame retardant is 75:20:5, and the flame retardant is composed of tetrabromobisphenol A and triphenyl phosphate The esters are mixed according to the mass ratio of 1:5, and the mixture is transported to the storage bin of the laminating machine;

[0039] 2) Single-sided coating: the mixture in the storage bin enters the screw of the coating machine and is heated and propelled. The coating machine is divided into 6 heating sections along the direction of the scre...

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PUM

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Abstract

The invention relates to a method for preparing a paper-based copper clad laminate. The method comprises the following steps: 1) uniformly mixing a film forming raw material, an inorganic heat conductive filler and a flame retardant to obtain a mixture, and conveying the mixture to a material storage bin of a laminating machine; 2) carrying out single-sided lamination: placing the mixture in the laminating machine, carrying out lamination on a single side of bleached wood pulp paper, and cooling to obtain single-sided laminated bleached wood pulp paper; 3) carrying out double-sided lamination:controlling the laminating machine to laminated and cladding the mixture onto the other side of the bleached wood pulp paper, and cooling to obtain double-sided laminated bleached wood pulp paper, namely insulating material sheets; and 4) taking and superimposing a plurality of insulating material sheets, cladding a copper foil on a single side or double sides after superimposing, and carrying out vacuum thermocompression to obtain the paper-based copper clad laminate. The method provided by the invention adopts a laminating way to replace a glue coating way to obtain the insulating sheets ofthe paper-based copper clad laminate, thereby saving a large number of process steps and organic reagents, and being environmentally-friendly and low in production cost. The prepared paper-based copper clad laminate has the advantages of flame retardance of Fv0 grade, low water absorption rate, good punching property and solderability resistance, and the like.

Description

technical field [0001] The invention relates to a method for preparing a copper-clad laminate, in particular to a method for preparing a paper-based copper-clad laminate, and belongs to the technical field of copper-clad laminate production. Background technique [0002] Paper-based copper-clad laminate is an important material in the printed circuit board industry. It has excellent punching and processability and low price, so it is widely used in printed circuit boards for civilian electronic devices. Now, with the high-density, multi-functional and "light, thin and small" electronic devices, the performance requirements for paper-based copper clad laminates are getting higher and higher. The assembly density and integration of components on the circuit board are getting higher and higher, and the heat dissipated per unit area of ​​the circuit board is increasing during operation. If the heat dissipation of the substrate is not good, the temperature of the components on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/12B32B15/20B32B33/00B32B37/06B32B37/10B32B38/00
CPCB32B38/00B32B15/12B32B15/20B32B33/00B32B37/06B32B37/1018B32B2255/12B32B2255/26B32B2307/206B32B2307/302B32B2307/3065B32B2307/73B32B2457/08
Inventor 李孟哲
Owner 招远春鹏电子科技有限公司