Halogen-containing and antimony-free resin composition, prepreg applying same, laminated board and printed circuit board
A technology of resin composition and prepreg, which is applied in the fields of laminated boards, printed circuit boards, prepregs, halogen-free and antimony-free resin compositions, and can solve the problems of not using copper-clad laminates and achieve good durability Heat resistance, resistance to dipping, low water absorption, and the effect of reducing water absorption
Active Publication Date: 2019-02-19
SHAANXI SHENGYI TECH
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
The epoxy resin composition of the invention can not only meet the UL-94V-0 flame retardant standard, it is a halogen-free and antimony-fre...
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment 1～6
[0057] Examples 1-6 and Comparative Examples 1-13
[0058] The specific components and component contents (in parts by weight) of the resin compositions of Examples 1-6 and Comparative Examples 1-13 are shown in Table 1 and Table 2.
Embodiment 1～8
[0059] The specific components and component content of the resin composition of table 1 embodiment 1~8
[0060]
[0061]
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Abstract
The invention provides a halogen-containing and antimony-free resin composition, a prepreg applying the same, a laminated board and a printed circuit board. The halogen-containing and antimony-free resin composition is composed of, by weight part, 20-50 parts of phosphorous-containing epoxy resin, 20-50 parts of non-frame-retardant epoxy resin, 20-60 parts of compound curing agent, 0.05-1.0 partsof curing promoter and 10-50 parts of compound filler, wherein the compound filler is the combination of phosphorous flame-retardant materials and nitrogen flame-retardant materials, and the compoundcuring agent is halogen-containing compound curing agent. The halogen-containing and antimony-free resin composition achieve phosphorous-bromine-nitrogen synergistic fire-retardant effects through thecompound filler and the compound curing agent, meet the requirements of restriction of International Environment Law on antimony compounds, and meanwhile can endow cured materials with the advantagesof good thermal resistance and dip soldering resistance, low water absorbency and the like.
Description
technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a halogen-containing antimony-free resin composition, a prepreg using the same, a laminated board and a printed circuit board. Background technique [0002] CEM-1 copper-clad laminate is made of electronic grade glass fiber cloth and bleached wood pulp paper, which are respectively impregnated with resin composition for copper-clad laminate to make fabric and core material, and covered with copper foil. Made by hot pressing. Flame retardancy is the primary performance that CEM-1 copper-clad laminates must achieve. However, CEM-1 copper-clad laminates use wood pulp paper as the core material. The wood pulp paper itself is combustible. It is necessary to ensure that CEM- 1. Under the premise of other properties of copper clad laminates, especially heat resistance, toughness, moisture resistance and other properties, it is very difficult to improve the flame retardancy of CE...
Claims
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Patent Timeline
Login to view more IPC IPC(8): C08L63/00C08K5/3492C08K5/5313C08G59/68C08G59/62B32B15/20B32B15/14B32B29/02B32B33/00B32B37/06B32B37/10B32B27/04
CPCB32B15/14B32B15/20B32B29/02B32B33/00B32B37/06B32B37/10B32B2260/021B32B2260/028B32B2260/046B32B2307/306B32B2307/3065B32B2307/7265B32B2457/08C08G59/62C08G59/686C08L63/00C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08L2205/025C08K5/34928C08K5/5313
Inventor 张龙霍国洋李莎
Owner SHAANXI SHENGYI TECH
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