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Alkaline copper plating solution with HEDP as main complexing agent and preparing method and electroplating technology of alkaline copper plating solution

A main complexing agent and complexing agent technology, applied in the field of electro-copper plating solution and its preparation, can solve problems such as poor performance and restricting process, and achieve the effect of good binding force, low consumption and stable plating solution

Inactive Publication Date: 2019-02-19
东莞市同欣新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing cyanide-free copper plating, especially in the copper plating process based on iron, aluminum and zinc, there are generally some defects and poor performance in the plating solution, which seriously restricts the replacement of cyanide copper plating. the process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] For every 1000L of plating solution produced:

[0038] 1) First pour pure water into the stirring container, then weigh 84kg of the main complexing agent HEDP, add it into the stirring container, and stir until completely dissolved;

[0039] 2) Weigh the copper raw material, calculate the required amount of copper ions at 8g / L according to the molecular weight, add it to the stirring container, and stir until it is completely dissolved;

[0040] 3) Weigh potassium hydroxide and slowly add it into the stirring container, control the temperature in the container to avoid boiling, until the pH of the plating solution is 8, stir until completely dissolved;

[0041] 4) Weigh 16kg of potassium carbonate and add it into the stirring container, stir until completely dissolved;

[0042] 5) Weigh 13kg of potassium sodium citrate and add it into the stirring container, and stir until completely dissolved;

[0043] 6) Weigh 0.4kg of ammonium carbonate and add it into the stirring...

Embodiment 2

[0047] For every 1000L of plating solution produced:

[0048] 1) First pour pure water into the stirring container, then weigh 110kg of the main complexing agent HEDP, add it into the stirring container, and stir until completely dissolved;

[0049] 2) Weigh the copper raw material, calculate the required amount of copper ions at 10g / L according to the molecular weight, add it to the stirring container, and stir until it is completely dissolved;

[0050] 3) Weigh potassium hydroxide and slowly add it into the stirring container, control the temperature in the container to avoid boiling, until the pH of the plating solution is 8, stir until completely dissolved;

[0051] 4) Weigh 28kg of potassium carbonate and add it into the stirring container, stir until completely dissolved;

[0052] 5) Weigh 22 kg of potassium sodium tartrate and ethylenediamine compound (ratio: 1:1) into the stirring container, and stir until completely dissolved;

[0053] 6) Weigh 2.5kg of ammonium cit...

Embodiment 3

[0057] For every 1000L of plating solution produced:

[0058] 1) First pour pure water into the stirring container, then weigh 140kg of the main complexing agent HEDP, add it into the stirring container, and stir until completely dissolved;

[0059] 2) Weigh the copper raw material, calculate the required amount of copper ions at 12g / L according to the molecular weight, add it to the stirring container, and stir until it is completely dissolved;

[0060]3) Weigh potassium hydroxide and slowly add it into the stirring container, control the temperature in the container to avoid boiling, until the pH of the plating solution is 8, stir until completely dissolved;

[0061] 4) Weigh 40kg of potassium carbonate and add it into the stirring container, stir until completely dissolved;

[0062] 5) Weigh 30kg of biuret and triethanolamine compound (ratio: 2:1) into a stirring container, and stir until completely dissolved;

[0063] 6) Weigh 4 kg of ammonium citrate and ammonium nitrat...

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Abstract

The invention discloses an alkaline copper plating solution with HEDP as a main complexing agent and a preparing method and an electroplating technology of the alkaline copper plating solution. The plating solution comprises components including 5-12 g / L of copper ions, 84-140 g / L of HEDP, 13-30 g / L of an auxiliary complexing agent, 16-40 g / L of potassium carbonate, 0.4-4 g / L of ammonium salt typescattering agent and 0.5-2 g / L of anode dissolving promoter. The plating solution has good plating homogenizing capability and deep plating capability, the binding force is good, and under cold and hot impacts and a crossed grid cutting way, performance is excellent; the current density range is wide, and 1-4A / dm<2> can be reached; the plating solution is stable, and various components are kept balanced in the electroplating process; the chemical performance of the components is stable, in the continuous electroplating process, the oxidation resistance and electrolysis resistance are high, and energy consumption is low; the current efficiency is high and can reach up to 90% to the maximum degree, and 60% or above can be basically kept; and technology control is simple, and the fault rateis low.

Description

technical field [0001] The invention relates to the technical field of electroplating technology, in particular to an electro-copper plating solution, a preparation method thereof and an electroplating technology. Background technique [0002] The standard electrode potential of copper is relatively positive (compared to the electrode potential of iron, aluminum, and zinc), and the copper coating on the iron-based or zinc substrate is a cathodic coating. Therefore, only when the coating is dense and non-porous, it has mechanical effects on the substrate. Protective effects. Practice has proved that some metals are easy to deposit on copper and have good adhesion, so copper plating can be used as a pre-plating layer or the bottom layer of multi-layer electroplating. At present, the commonly used copper plating processes in production include cyanide copper plating, acid copper plating, pyrophosphate copper plating, and cyanide-free alkaline copper plating in line with clean ...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/34
CPCC25D3/38C25D5/34
Inventor 罗如海樊雄陈志敏王庆浩
Owner 东莞市同欣新材料有限公司
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