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combination

A composition and compound technology, applied in the direction of non-polymer organic compound adhesives, adhesive types, adhesive additives, etc.

Active Publication Date: 2021-12-10
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, Patent Document 8 has no description about the peeling force after heating.

Method used

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Embodiment

[0121] Hereinafter, the present invention will be described in more detail with reference to experimental examples, but the present invention is not limited to these experimental examples.

experiment example

[0123] Unless otherwise specified, the experiment was performed at 23° C. and a humidity of 50%. Curable resin compositions of the compositions shown in Tables 1 to 4 were prepared and evaluated.

[0124] As each component in the curable resin composition described in the experimental example, the following compounds were selected.

[0125] As (A) monofunctional (meth)acrylate having a number average molecular weight of less than 1,000, the following compounds are selected.

[0126] (A-1) Nonylphenol ethylene oxide modified acrylate ("M-111" manufactured by Toagosei Co., Ltd., the structure is in formula (1), R 1 is a hydrogen atom, R 2 is ethylene, R 3 is nonyl, n is 1)

[0127] (A-2) Isostearyl acrylate ("ISTA" manufactured by Osaka Organic Co., Ltd.)

[0128] (A-3) 1-adamantyl methacrylate ("ADMA" manufactured by Osaka Organic Co., Ltd.)

[0129] As the polyfunctional (meth)acrylate (B) whose number average molecular weight is less than 1,000, the following compounds ...

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Abstract

To provide a composition having heat resistance, adhesiveness, and peelability. A composition containing the following (A) to (E) components. (A) component, monofunctional (meth)acrylate with number average molecular weight less than 1000; (B) component, multifunctional (meth)acrylate with number average molecular weight less than 1000; (C) component, free radical polymerization initiator ; (D) component, compound for imparting mold release; (E) component, polyfunctional urethane (meth)acrylate. A temporary fixing adhesive for semiconductor manufacturing comprising the composition.

Description

technical field [0001] The present invention relates to compositions. Background technique [0002] Three-dimensional semiconductor mounting becomes indispensable to achieve further higher density and larger capacity. The so-called three-dimensional mounting technology is a semiconductor manufacturing technology that thins a semiconductor chip and then stacks the semiconductor chip in multiple layers. In order to realize this technology, it is necessary to reduce the thickness of the substrate on which the semiconductor circuit is formed by grinding the non-circuit-formed surface (also referred to as the "back surface"), and then perform electrode formation on the back surface. Conventionally, in the backside grinding process of silicon substrates, a backside protective tape is attached to the opposite side of the ground surface to prevent damage to the wafer during grinding. However, this adhesive tape uses an organic resin film as a base material and has flexibility, but...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F290/06C09J4/02C09J11/06C09J11/08H01L21/304
CPCC09J11/06C09J11/08H01L21/304C09J175/16C08F290/067H01L21/6835H01L2221/68327H01L2221/6834C08G18/755C08G18/673C08G18/672C08G18/4825C08G18/4854C08G18/44C08G18/4238C08G18/7621C08G18/753C08F220/306C08F220/1818C08F222/104C08F222/1065C08F222/102C08G18/48C08G18/42
Inventor 关谷瑠璃子山下幸彦渡边淳
Owner DENKA CO LTD
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