Low temperature co-fired ceramic (LTCC) soft magnetic ZnNiCu ferrite material and preparation method thereof

A ferrite material, low-temperature co-firing technology, applied in magnetic materials, inductor/transformer/magnet manufacturing, magnetic core manufacturing, etc., can solve the problems of not meeting product insulation performance requirements, low volume resistivity, high sintering temperature, etc. Achieve the effects of low-cost industrial production, high volume resistivity, and easy availability of raw materials

Active Publication Date: 2019-03-12
HENGDIAN GRP DMEGC MAGNETICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing ferrite materials for laminated power inductors and magnetic beads have the problems of high sintering temperature, high energy consumption, and high cost. They cannot be co-fired with soft magnetic nickel-zinc ferrite materials and silver, and the volume resistance The rate is low and cannot meet the insulation performance requirements of the product

Method used

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  • Low temperature co-fired ceramic (LTCC) soft magnetic ZnNiCu ferrite material and preparation method thereof
  • Low temperature co-fired ceramic (LTCC) soft magnetic ZnNiCu ferrite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) according to the formula ingredients in Table 1, the Fe in the main component 2 O 3 48.5mol% of ZnO, 27mol% of ZnO, 14.5mol% of NiO, 10mol% of CuO are mixed, vibrated and milled, and then pre-sintered at 780°C for 120min in an air kiln to obtain pre-sintered powder;

[0028] (2) The moisture content of the pre-burned powder is controlled to be less than 0.35 wt %, and after coarsely pulverizing to a particle size of 0.8 μm, 0.4 wt % of Bi as an accessory component is added. 2 O 3 and 0.05wt% Mo 2 O 3 , add 0.8wt% polyvinyl alcohol after sanding for 60min, dry and granulate to obtain ferrite powder;

[0029] (3) Press the ferrite powder into a standard annular blank The laminated chip inductor device was prepared by the casting process, and sintered at a high temperature of 880 °C for 120 min in an air kiln to obtain a low-temperature co-fired LTCC soft magnetic ZnNiCu ferrite material.

Embodiment 2

[0031] (1) according to the formula ingredients in Table 1, the Fe in the main component 2 O 3 49mol% of ZnO, 28mol% of ZnO, 13.5mol% of NiO, 9.5mol% of CuO are mixed, vibrated and milled, and then pre-sintered in an air kiln at 750°C for 120 min to obtain pre-sintered powder;

[0032] (2) The moisture content of the pre-burned powder is controlled to be less than 0.35 wt %, and after coarsely pulverizing to a particle size of 1.0 μm, 0.4 wt % of Bi as an accessory component is added. 2 O 3 and 0.05wt% Mo 2 O 3 , adding 0.5wt% polyvinyl alcohol after sanding, drying and granulating to obtain ferrite powder;

[0033] (3) The ferrite powder is prepared by a casting process to prepare a laminated chip inductor device, and sintered at a high temperature of 900 ° C for 120 min in an air kiln to obtain a low-temperature co-fired LTCC soft magnetic ZnNiCu ferrite material.

Embodiment 3

[0035] (1) according to the formula ingredients in Table 1, the Fe in the main component 2 O 3 47mol%, ZnO 26.5mol%, NiO 16.5mol%, CuO 10mol% are mixed, vibrated and milled, and then pre-fired in an air kiln at 880°C for 60min to obtain pre-fired powder;

[0036] (2) The moisture content of the pre-burned powder is controlled to be less than 0.35 wt %, and after coarsely pulverizing to a particle size of 1.2 μm, 0.4 wt % of Bi as an accessory component is added. 2 O 3 and 0.05wt% Mo 2 O 3 , adding 0.5-0.8wt% polyvinyl alcohol after sanding, drying and granulating to obtain ferrite powder;

[0037] (3) The ferrite powder is prepared by a casting process to prepare a laminated chip inductor device, and sintered at a high temperature of 850°C for 180min in an air kiln to obtain a low-temperature co-fired LTCC soft magnetic ZnNiCu ferrite material.

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Abstract

The invention relates to the technical field of soft magnetic ferrite materials, in particular to a low temperature co-fired ceramic (LTCC) soft magnetic ZnNiCu ferrite material and a preparation method thereof. The LTCC soft magnetic ZnNiCu ferrite material is formed by a main ingredient and an auxiliary ingredient which are sintered, and the main ingredient is prepared from the following components in percentage by mole: 47.0-49.5 mol% of Fe2O3, 18.0-28.0 mol% of ZnO, 12.5-16.5 mol% of NiO and 7.0-10.0 mol% of CuO, wherein the sum of the content of all the components is 100%. Co-firing of the LTCC soft magnetic ZnNiCu ferrite material, a soft magnetic nickel zinc ferrite material and Ag can be achieved, metal silver is not prone to spreading during co-firing, it can be guaranteed that amultilayer chip inductor (MLCI) device obtains excellent magnetic characteristics, and the product consistency is good; the volume resistivity is large, and the insulation performance requirements ofthe LTCC soft magnetic ZnNiCu ferrite material are met; and the process steps are simple, raw materials are easy to obtain, energy consumption is low, special requirements for equipment are avoided, and low-cost industrial production is easy to achieve.

Description

technical field [0001] The invention relates to the technical field of soft ferrite materials, in particular to a low-temperature co-fired LTCC soft magnetic ZnNiCu ferrite material mainly used for preparing laminated power inductors and magnetic beads and a preparation method thereof. Background technique [0002] With the increasing progress of notebook computers in terms of high speed, high storage density, thinness, etc., as well as the continuous upgrading of mobile communication technology centered on mobile phones and wired and wireless digital communication networks, electronic products have become smaller and smaller in the past 20 years. The direction of portability and portability is developing rapidly. This has led to the change from analog circuits to high-speed digital circuits, and the rise of surface mount technology (SMT). [0003] SMC chip components can not only miniaturize electronic products, but also realize high-speed automation of the whole machine a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/26C04B35/622C04B35/626H01F1/34H01F41/02
CPCC04B35/2666C04B35/622C04B35/62605C04B35/62645C04B2235/3256C04B2235/3284C04B2235/3294C04B2235/6567H01F1/342H01F41/0206H01F41/0233
Inventor 肖时勇赵旭陈军林
Owner HENGDIAN GRP DMEGC MAGNETICS CO LTD
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