High-speed stable chemical copper plating liquid and preparation method thereof

Abstract

The invention discloses a high-speed stable chemical copper plating liquid and a preparation method thereof. The high-speed stable chemical copper plating liquid comprises following components in volume concentration: copper sulfate pentahydrate with concentration being 8 g / L-25 g / L, potassium sodium tartrate with concentration being 15 g / L-40 g / L, formaldehyde with concentration being 5-20 ml / L,sodium hydroxide with concentration being 5-20 g / L, a stabilizer with concentration being 10-500 mg / L and the balance of water. The high-speed stable chemical copper plating liquid further comprises acombined additive, and the combined additive is prepared from a thiourea derivative and aminocarboxylate containing hydroxyalkyl. Copper sulfate pentahydrate and water are mutually soluble and sufficiently stirred until a solution is clarified, then potassium sodium tartrate, the stabilizer, the combined additive, sodium hydroxide and formaldehyde are added in sequence and sufficiently stirred until the solution is clarified, volume of the solution is enabled to be constant by water, and the high-speed stable chemical copper plating liquid can be obtained. The deposition rate of the high-speed stable chemical copper plating liquid is 10 mu m / h or higher, the plating solution is stable, the copper plating layer is flat and even, and the functional chemical copper plating requirement is met.

Description

technical field [0001] The invention relates to the technical field of electroless plating on non-metal surfaces, in particular to a high-speed and stable electroless copper plating solution and a preparation method thereof. Background technique [0002] Electroless plating, also known as self-catalytic plating, refers to the self-catalytic oxidation-reduction reaction of metal ions and reducing agents in the solution on the surface of a catalytically active substrate under the condition of no external current, and chemical deposition on the surface of the substrate to form a metal or alloy coating A surface treatment technology. Electroless copper plating is one of the important electroless plating technologies. Due to its good ductility, thermal conductivity and electrical conductivity, the electroless copper plating layer has been widely used in printed circuit board through-hole conduction, electronic packaging connection, electromagnetic wave shielding, decoration Elec...

AI Technical Summary

Problems solved by technology

For electroless copper plating, the higher the plating speed, the more difficult it is to control the stability of the plating solution; the better the stability of the plating solution, the harder it is to increase the plating speed