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A breakdown-resistant led light panel

A technology of LED light board and LED aluminum substrate, which is applied in the direction of adhesive types, lighting and heating equipment, semiconductor devices of light-emitting elements, etc., can solve the problems of limiting the service life of LED light boards, and achieve excellent breakdown resistance, Good heat dissipation effect

Active Publication Date: 2020-03-31
安徽皇广实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the current breakdown voltage of a 75μm insulating layer usually does not exceed 5KV (AC), which limits the service life of LED light panels in high-power automotive electronics, home appliances, digital and other fields

Method used

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  • A breakdown-resistant led light panel
  • A breakdown-resistant led light panel
  • A breakdown-resistant led light panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Such as Figure 1~2 As shown, the breakdown-resistant LED lamp panel includes an LED aluminum substrate 10, the LED aluminum substrate 10 includes an aluminum layer 11 and a circuit layer 13, and a breakdown-resistant Type insulating layer 12.

[0020] Prepare epoxy resin adhesive in a closed stirring tank, mix and stir 100kg epoxy resin, 3.5kg tertiary amine curing agent, 1.2kg imidazole accelerator, 2.9kg silane coupling agent, 80kg thermal conductive filler, 40kg solvent to form a ring Oxygen resin adhesive. Then, ozone was introduced into the stirring tank to stir to form the first glue solution, and the mass ratio between the ozone and the epoxy resin adhesive was 0.75:1000. After introducing ozone into the stirred tank, the temperature inside the stirred tank was raised to 50° C. and stirred at this temperature for 60 minutes to prepare the first glue solution.

[0021] Such as image 3 As shown, the magnetic filter includes an annular electromagnet 31, and th...

Embodiment 2

[0025] The structure of the breakdown-resistant LED lamp panel in this embodiment is the same as that of the breakdown-resistant LED lamp panel in Embodiment 1. The structure of the magnetic filter in this embodiment is the same as that of the magnetic filter in Embodiment 1.

[0026] Prepare epoxy resin adhesive in a closed stirring tank, mix and stir 110kg epoxy resin, 4kg tertiary amine curing agent, 1.5kg imidazole accelerator, 3kg silane coupling agent, 90kg thermal conductive filler, and 50kg solvent to make epoxy resin adhesive. Then, ozone was introduced into the stirring tank to stir to form the first glue solution, and the mass ratio between the ozone and the epoxy resin adhesive was 0.9:1000. After introducing ozone into the stirred tank, the temperature inside the stirred tank was raised to 53° C. and stirred at this temperature for 66 minutes to prepare the first glue solution.

[0027] The first glue solution is filtered by a magnetic filter to obtain the secon...

Embodiment 3

[0030] The structure of the breakdown-resistant LED lamp panel in this embodiment is the same as that of the breakdown-resistant LED lamp panel in Embodiment 1. The structure of the magnetic filter in this embodiment is the same as that of the magnetic filter in Embodiment 1.

[0031] Prepare epoxy resin adhesive in a closed stirring tank, mix and stir 120kg epoxy resin, 4.3kg tertiary amine curing agent, 1.6kg imidazole accelerator, 3.6kg silane coupling agent, 95kg thermal conductive filler, and 55kg solvent to form a ring Oxygen resin adhesive. Then pass ozone into the stirring tank and stir to make the first glue solution, the mass ratio between the ozone and the epoxy resin adhesive is 1:1000. After introducing ozone into the stirred tank, the temperature inside the stirred tank was raised to 55° C. and stirred at this temperature for 60 minutes to prepare the first glue solution.

[0032] The first glue solution is filtered by a magnetic filter to obtain the second glu...

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Abstract

The invention relates to a breakdown resistant type LED lamp panel. The breakdown resistant type LED lamp panel comprises an LED aluminium base plate, wherein the LED aluminium base plate comprises analuminium plate layer and a circuit layer; and a breakdown resistant type insulating layer is arranged between the aluminium plate layer and the circuit layer. An epoxy resin adhesive is prepared ina sealed stirring kettle, ozone is introduced into the stirring kettle to prepare a first glue solution, the first glue solution is filtered by a magnetic filter to obtain a second glue solution, thesecond glue solution is coated on a rough surface of a copper foil to prepare a glued copper foil, the back surface of the glued copper foil is superposed with the aluminium plate, the superposed glued copper foil and aluminium plate are put into a vacuum press for being subjected to vacuum hot-pressing to obtain an aluminium based copper-clad plate; and the aluminium based copper-clad plate is processed according to a PCB process to obtain the breakdown resistant type LED lamp panel. The breakdown resistant type LED lamp panel is good in heat dissipation, has a breakdown voltage value which is increased to 70%, and has excellent breakdown resistance.

Description

technical field [0001] The invention relates to a breakdown-resistant LED lamp board, which belongs to the technical field of LED lamps. Background technique [0002] LED lamps have the advantages of small size, low power consumption, long service life, high brightness, low heat, durability, and variety, and have gradually replaced incandescent lamps in the lighting market. [0003] Aluminum substrate is the most important substrate in LED lamps. Aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, a single panel consists of three layers, which are circuit layer (copper foil), insulating layer and metal grassroots. Commonly found in LED lighting products. There are two sides, the white side is for soldering the LED pins, and the other side shows the natural color of aluminum, which is usually coated with heat-conducting gel and then in contact with the heat-conducting part. The breakdown voltage of the LED lamp mainly de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/20F21V23/00C09J163/00C09J11/04F21Y115/10
CPCC08K2003/2227C08K2003/282C09J11/04C09J163/00F21K9/20F21V23/004F21Y2115/10C08K5/54C08K3/28C08K3/22C08K3/34
Inventor 张彩霞
Owner 安徽皇广实业有限公司
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