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Thermosetting resin compound

A resin composition and thermosetting technology, which is applied in the field of thermosetting resin composition and its composite material, can solve the problems of poor line glue filling effect and poor fluidity, and achieve the effects of not being easy to cut, improving the processability of the substrate, and increasing the cost

Active Publication Date: 2019-03-22
NANYA PLASTICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its disadvantage is that when it is hardened by heat, its fluidity is poor
Especially when it is applied to the lamination process of thick copper (above 2OZ) multi-layer boards, it often leads to poor line glue filling effect due to poor fluidity

Method used

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  • Thermosetting resin compound
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～11

[0109] [Examples 1-11, Comparative Examples 1-3]

[0110] The resin composition shown in Table 1 was mixed with toluene to form the varnish (Varnish) of the thermosetting resin composition, and the above-mentioned varnish was impregnated with Nanya glass fiber cloth (Nanya Plastic Company, cloth type 7628) at room temperature, and then heated at 110 ℃ (impregnation machine) after drying for a few minutes, a prepreg with a resin content of 43wt% was obtained. Finally, four prepregs were stacked layer by layer between two 35μm thick copper foils, at 25kg / cm 2 At a pressure and temperature of 85°C, keep the constant temperature for 20 minutes, then heat up to 185°C at a heating rate of 3°C / min, then keep the constant temperature for 120 minutes, and then slowly cool to 130°C to obtain 0.8mm thick copper foil substrate.

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Abstract

The invention relates to a thermosetting resin compound. The thermosetting resin compound is characterized in that a thermosetting polyphenyl ether resin with styrene groups and acryl reaction functional groups (at ratio of 0.5-1.5) on terminals, a thermosetting polybutadiene resin and at least one thermoplastic resin are used for adjusting heat resistance, fluidity and rubber-filling property; various peroxides with different half-life period temperatures are used for compounding a combined type crosslinking initiator, so that the crosslinking density can be effectively promoted during heat curing process; other components, such as crosslinking agent, are combined for forming the compound, so that the compound after hardening has the characteristics of low dielectric constant, low dielectric loss, high Tg, high rigidity, excellent cutting property of Prepreg, and the like.

Description

technical field [0001] The invention relates to a thermosetting resin composition and its use as a composite material. Background technique [0002] The insulating material used in conventional printed circuit boards is mainly epoxy resin, which has good insulation and chemical resistance after curing, and has a cost advantage. Therefore, epoxy resin has been widely used as the main material for the insulating layer of circuit boards. . However, in recent years, high-frequency and broadband communication devices and equipment have developed rapidly, signal transmission speed and data processing capacity have doubled, and electronic equipment and electronic assembly tend to be high-density, and the development of printed circuit boards is also moving towards thinner line width lines. The development trend of pitch, high layer counts, thinner board thickness, and halogen-free development, the electrical properties, water absorption, flame resistance, and dimensional stability...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L9/00C08L53/02C08K3/36
CPCC08L71/12C08L2201/02C08L2201/08C08L2205/025C08L2205/035C08L9/00C08L53/025C08K3/36
Inventor 廖德超黄英德陈豪升张宏毅刘家霖
Owner NANYA PLASTICS CORP
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