Resin compound, prepreg and laminated board prepared from resin compound

Abstract

The invention discloses a resin compound which comprises the following components in parts by solid weight: 100 parts of modified bismaleimide prepolymer, 5-30 parts of epoxy resin, 0-20 parts of curing agent, 0-150 parts of filler and 0.001-5 parts of curing accelerator, wherein the modified bismaleimide prepolymer is prepared by pre-polymerizing at least bismaleimide resin with allyl compounds.Compared with the prior art, the resin compound disclosed by the invention has the advantages of high peel strength, halogen-free fire resistance, high heat resistance, high temperature modulus retention rate, excellent toughness, coefficient of thermal expansion and high modulus retention rate. Especially, the resin compound can meet the requirement for halogen-free fire resistance UL94V-0 whilehas excellent high temperature modulus retention rate and low coefficient of thermal expansion, so that the resin compound can be applied to high-performance circuit materials, such as HDI high multilayer substrates.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a high heat-resistant resin composition and a prepreg and a laminate prepared using it. Background technique [0002] In recent years, with the continuous development of mobile Internet technology, multi-functionality, portability, and thinness have continuously become the pursuit goals of electronic products, which means that more components are loaded in electronic products, and more printed circuits use high-density interconnection. Technology (HDI) and the thickness of the printed circuit board is thinner. Therefore, higher requirements are put forward for the base material of the printed circuit board-copper clad laminate, and it is required to have the performance similar to the package substrate, which is the rising trend in the industry. Class packaging materials require copper clad laminates to have high heat resistance, high glass transition temperature, ex...

AI Technical Summary

Problems solved by technology

[0006] For example, the patent CN102276837A discloses the technical scheme of adding phosphorus-containing compounds (phosphazenes) to the double-horse resin system. Although it is possible to obtain cured products that do not contain halogens and have good flame-retardant properties, these flame-retardants do not have It forms a better cross-linked network structure with the bismaleimide resin system. Under the high temperature curing conditions (often higher than 200°C) of the bismaleimide resin, the unreacted phosphazenes are similar to "sweating". The way of floating on the surface of the substrate not only affects the heat resistance of the sheet, but also affects the bonding force between the sheet and the copper foil

[0007] As disclosed in the patent CN103665864, an allyl-modified bismaleimide resin is added, and an organic phosphorus flame retardant or an organic nitrogen compound is added to the glue solution. Although this technical solution can solve the problem of bismaleimide resin The solubility problem of the halogen-free high flame-retardant board can be obtained, but the additionally added flame retardant component affects the heat resistance, heat and humidity resistance and water absorption of the final cured product, so it is difficult to obtain a high-quality board with excellent comprehensive performance. performance sheet

[0008] For example, the patent JP2012153896 discloses the technical solution of adding phosphorus-containing epoxy resin to the double-horse resin system. This technical solution can also meet the requirements of halogen-free flame retardancy, but due to the existence of epoxy resin, the vitrification of the resin is greatly reduced. Transition temperature, heat resistance and modulus retention at high temperature

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