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A kind of flame retardant resin composition and prepreg and laminate prepared using the same

A flame-retardant resin and composition technology, applied in the direction of synthetic resin layered products, lamination, lamination equipment, etc., can solve the problem of reducing the resin glass transition temperature, heat resistance modulus retention rate, and affecting the heat resistance of the board Non-toxic, affecting the bonding force between the plate and copper foil, etc., to achieve the effects of excellent halogen-free flame retardancy, improved adhesion, and high glass transition temperature

Active Publication Date: 2020-05-26
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] For example, the patent CN102276837A discloses the technical scheme of adding phosphorus-containing compounds (phosphazenes) to the double-horse resin system. Although it is possible to obtain cured products that do not contain halogens and have good flame-retardant properties, these flame-retardants do not have It forms a better cross-linked network structure with the bismaleimide resin system. Under the high temperature curing conditions (often higher than 200°C) of the bismaleimide resin, the unreacted phosphazenes are similar to "sweating". The way of floating on the surface of the substrate not only affects the heat resistance of the sheet, but also affects the bonding force between the sheet and the copper foil
[0007] For example, the patent JP2012153896 discloses the technical solution of adding phosphorus-containing epoxy resin to the double-horse resin system. This technical solution can also meet the requirements of halogen-free flame retardancy, but due to the existence of epoxy resin, the vitrification of the resin is greatly reduced. Transition temperature, heat resistance and modulus retention at high temperature

Method used

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  • A kind of flame retardant resin composition and prepreg and laminate prepared using the same
  • A kind of flame retardant resin composition and prepreg and laminate prepared using the same
  • A kind of flame retardant resin composition and prepreg and laminate prepared using the same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0101] Add 100g solvent N,N-dimethylformamide into a 500mL three-necked flask, and 4,4'-diphenylmethane bismaleimide, DOPO-containing diamine compound A-1 (straight-chain base type) and diaminodiphenylmethane, according to the mass parts 100g:20g:20g were put into a three-necked flask in sequence, and kept stirring under the condition of an oil bath at 90°C. After the solid in the flask was completely dissolved, the timing was started, and after continuous stirring for 2.5hr, the The resulting product was distilled to obtain a modified bismaleimide prepolymer 1 with a solid content of 75%.

Synthetic example 2

[0103] Add 100g of solvent N,N-dimethylformamide into a 500mL three-necked flask to mix 4,4'-diphenylmethane bismaleimide, DOPO-containing diamine compound A-2 (aromatic group type) and diaminodiphenylmethane, according to the mass parts 100g: 20g: 15g were put into a three-necked flask in turn, and kept stirring under the condition of an oil bath at 90°C. After the solid in the flask was completely dissolved, the timing was started, and after 2.5 hours of continuous stirring, the The resulting product was distilled to obtain a modified bismaleimide prepolymer 2 with a solid content of 75%.

Synthetic example 3

[0105] Add 100g solvent N,N-dimethylformamide into a 500mL three-necked flask, and 4,4'-diphenylmethane bismaleimide, DPPO-containing diamine compound A-3 (straight-chain base type) and diaminodiphenyl sulfone, according to the mass parts 100g:30g:20g, put them into a three-necked flask in turn, and continue to stir under the condition of an oil bath at 90°C. After the solid in the flask is completely dissolved, start timing, and after continuing to stir for 2.5hr, put The resulting product was distilled to obtain a modified bismaleimide prepolymer 3 with a solid content of 75%.

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Abstract

Disclosed are a flame-retardant resin composition, and a prepreg and a laminate which are prepared therefrom. The flame-retardant resin composition, based on the solid weight, comprises: 100 parts of a modified bismaleimide prepolymer, 5-30 parts of an epoxy resin, 0-20 parts of a curing agent, 0-150 parts of a filler, and 0.001-5 parts of a curing accelerator, wherein the modified bismaleimide prepolymer is at least formed by prepolymerizing a bismaleimide resin and an amine compound.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a flame-retardant resin composition and a prepreg and a laminate prepared by using the same. Background technique [0002] In recent years, with the continuous development of mobile Internet technology, multi-functionality, portability, and thinness have continuously become the pursuit goals of electronic products, which means that more components are loaded in electronic products, and more printed circuits use high-density interconnection. Technology (HDI) and the thickness of the printed circuit board is thinner. Therefore, higher requirements are put forward for the base material of the printed circuit board-copper clad laminate, and it is required to have the performance similar to the package substrate, which is the rising trend in the industry. Class packaging materials require copper clad laminates to have high heat resistance, high glass transition temperatur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08L63/00C08J5/24C08G73/12B32B7/06B32B15/092B32B27/06B32B27/08B32B27/18B32B27/20B32B27/26B32B27/34B32B27/36B32B27/38B32B37/06B32B37/10
CPCB32B7/06B32B15/092B32B27/06B32B27/08B32B27/18B32B27/20B32B27/26B32B27/34B32B27/36B32B27/38B32B37/06B32B37/10B32B2307/30B32B2307/306B32B2307/3065B32B2307/558B32B2457/08C08G73/12C08J5/24C08J2379/08C08J2463/00
Inventor 戴善凯崔春梅黄荣辉谌香秀
Owner SHENGYI TECH SUZHOU
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