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High-strength organic silicon heat-conducting sealant and preparation method

A sealant and silicone technology, applied in chemical instruments and methods, adhesives, heat exchange materials, etc., can solve problems such as poor adhesion and poor strength, reduce residues, improve adhesion performance, and be convenient and quick to use. Effect

Active Publication Date: 2019-03-22
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, addition-type silicone also has its own shortcomings. Compared with condensation-type silicone, it has slightly poorer adhesion, and compared with other types of sealants, such as epoxy and acrylic sealants, it has the problem of poor strength.

Method used

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  • High-strength organic silicon heat-conducting sealant and preparation method
  • High-strength organic silicon heat-conducting sealant and preparation method
  • High-strength organic silicon heat-conducting sealant and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] (1) Base material preparation: at room temperature, 35 parts of vinyl-terminated silicone oil with a viscosity of 100000mPa.s, 15 parts of vinyl-terminated silicone oil with a viscosity of 60000mPa.s, 6 parts of fumed silica R974, and a structural control agent Add 1 part of dimethyldichlorosilane to the kneader one by one at a speed of 50-200rpm, mix at 150°C for 1-4 hours, and vacuumize to obtain the base material;

[0037] (2) Preparation of heat-conducting sealant: at room temperature, add 60 parts of base material to a double planetary mixer, and the structure of methyl hydrogen-containing polysiloxane is as in formula (1), wherein R=-CH 3 , M=3, N=4, 15 parts, 0.2 parts of inhibitor 2-methyl-3-butyn-2-ol, after mixing evenly, add vinyl-terminated silicone oil with reactive diluent viscosity of 100000mPa.s, 40.6 Parts, adhesive such as structural formula (2), wherein m=2, n=2, 6 parts, toughening agent such as structural formula (3), wherein x=800, y=2, 12 parts, c...

Embodiment 2

[0039] (1) Base material preparation: at room temperature, 30 parts of vinyl-terminated silicone oil with a viscosity of 100000mPa.s, 30 parts of vinyl-terminated silicone oil with a viscosity of 60000mPa.s, 12 parts of fumed silica R974, and a structural control agent Add 4.6 parts of hexamethyldisilazane into the kneader one by one at a speed of 50-200 rpm, mix at 150°C for 1-4 hours, and vacuumize to obtain the base material;

[0040] (2) Preparation of heat-conducting sealant: at room temperature, add 55 parts of base material to a double planetary mixer, and the structure of methyl hydrogen-containing polysiloxane is as in formula (1), wherein R=-H, M=3, N=4 , 12 parts, 0.2 parts of inhibitor 2-methyl-3-butyn-2-ol, 0.05 parts of acetylene cyclohexanol, after mixing evenly, add 38 parts of vinyl-terminated silicone oil with a reactive diluent viscosity of 60000mPa.s, Adhesive such as structural formula (2), wherein m=3, n=1, 8 parts, toughening agent such as structural for...

Embodiment 3

[0042] (1) Preparation of base material: at room temperature, 40 parts of vinyl-terminated silicone oil with a viscosity of 100000mPa.s, 20 parts of vinyl-terminated silicone oil with a viscosity of 20000mPa.s, 15 parts of fumed silica DM-20s, the structure Add 3 parts of hexamethyldisilazane, a chemical control agent, into the kneader in turn at a speed of 50-200rpm, mix at 150°C for 1-4 hours, and vacuumize to obtain the base material. (2) Preparation of heat-conducting sealant: At room temperature, add 68 parts of the base material to the double planetary mixer, the structure of methylhydrogen polysiloxane is as in formula (1), where R=-CH 3, M=3, N=8, 10 parts, inhibitor 3-methyl-1-pentyn-3-ol 0.35 parts, after mixing evenly, add 49 parts of vinyl-terminated silicone oil with reactive diluent viscosity of 20000mPa.s , adhesive such as structural formula (2), wherein m=3, n=2, 6 parts, toughening agent such as structural formula (3), wherein x=1000, y=2, 10 parts, catalyst ...

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Abstract

The invention relates to a high-strength organic silicon heat-conducting sealant which is prepared from the following raw materials in parts by weight: 42-75 parts of base material, 5-20 parts of methyl hydrogenated polysiloxane, 15.2-56.7 parts of reactive diluent, 2-10 parts of adhesive, 0.1-1 part of catalyst, 0.01-1 part of inhibitor, 5-15 parts of flexibilizer, 10-40 parts of solvent and 100-300 parts of heat-conductive filler. The heat-conducting sealant prepared according to the invention is an additive single-component high-temperature fast curing sealant, with convenience in use, environment-friendly property, high heat conductivity, high strength of main body, excellent adhesion to base material, capability of reducing residue of sealant in parts while repairing and benefit in protecting corresponding parts of electron components.

Description

technical field [0001] The invention relates to a high-strength heat-conducting sealant, which belongs to the field of heat-conduction sealants. technical background [0002] Silicone sealants have excellent weather resistance, excellent high and low temperature resistance, good viscosity and hydrophobicity, excellent electrical properties and chemical corrosion resistance due to their unique Si-O bond network molecular structure. , is widely used in construction, automobiles, and electronic components, and plays the role of sealing, dustproof, shock-absorbing and fixing. Although silicone sealant can provide effective protection and fixation for bonding related components, the thermal conductivity of ordinary silicone cannot meet the heat conduction requirements of heating components. Seriously affect the stability and service life of the performance of the corresponding components. In order to broaden the application range of sealants, we improve the thermal conductivity...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06C09J11/08C09K3/10C09K5/14
CPCC08L2203/20C08L2205/025C09J11/04C09J11/06C09J11/08C09J183/04C09K3/10C09K5/14C08L83/04C08K3/36C08K5/54C08K5/05C08K7/18C08K13/04
Inventor 代振楠陈维陈田安
Owner YANTAI DARBOND TECH
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