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Heat dissipating material and preparation method thereof

A technology of heat-dissipating material and heat-conducting filler, applied in the field of heat-dissipating material and its preparation, can solve the problems of easy damage and shorten the service life of computers, and achieve the effects of high thermal conductivity, excellent heat dissipation effect and easy processing

Active Publication Date: 2019-04-02
GUANGDONG GERUI NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the electronic information age, computers have become indispensable electronic products for people's daily life and work. Due to the needs of people's work or study, they often need to use computers continuously for a long time, but in the process of using computers continuously for a long time , The electronic components inside the computer will generate heat. If the internal heat is not discharged in time, excessive heat accumulation will easily damage the electronic components inside the computer and shorten the service life of the computer.

Method used

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  • Heat dissipating material and preparation method thereof
  • Heat dissipating material and preparation method thereof
  • Heat dissipating material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0043] A heat dissipation material, comprising the following raw materials in parts by weight:

[0044]

[0045] Wherein, the thermally conductive filler is a mixture of flake graphite and aluminum nitride in a weight ratio of 2:3; the mesh number of the flake graphite is 300 mesh, and the mesh number of aluminum nitride is 800 mesh.

[0046] Among them, the impact modifier is a mixture of vinyl acetate and EPDM rubber in a weight ratio of 3:1; the coupling agent is isopropyl tris (dioctyl pyrophosphate acyloxy) titanate coupling The coupling agent, the organic solvent is ethanol, the compatibilizer is hydrogenated styrene-butadiene-styrene copolymer grafted with glycidyl methacrylate, and the antioxidant is antioxidant DLTP.

[0047] The preparation method of the above heat dissipation material comprises the following steps:

[0048] (1) Mix the coupling agent and organic solvent uniformly by weight to obtain a dispersion, then add the thermally conductive filler into the...

Embodiment 2

[0055] A heat dissipation material, comprising the following raw materials in parts by weight:

[0056]

[0057]

[0058] Wherein, the thermally conductive filler is a mixture of flake graphite and aluminum nitride in a weight ratio of 3.5:3, the mesh number of the flake graphite is 450 mesh, and the mesh number of aluminum nitride is 900 mesh.

[0059] The antioxidant is a mixture of p-hydroxyanisole and antioxidant DLTP in a weight ratio of 4:2.5, and the impact modifier is a mixture of vinyl acetate and EPDM rubber in a weight ratio of 4:2.5 .

[0060] The coupling agent is isopropyl dioleic acid acyloxy (dioctyl pyrophosphate acyloxy) titanate coupling agent, the organic solvent is methanol, and the compatibilizer is ethylene-acrylic acid-methyl ester grafted methacrylic acid glycidyl esters.

[0061] The preparation method of the above-mentioned heat dissipation material comprises the following steps:

[0062] (1) Mix the coupling agent and the organic solvent un...

Embodiment 3

[0069] A heat dissipation material, comprising the following raw materials in parts by weight:

[0070]

[0071] Wherein, the thermally conductive filler is a mixture of flake graphite and aluminum nitride in a weight ratio of 5:3, the mesh number of the flake graphite is 600 mesh, and the mesh number of aluminum nitride is 1000 mesh.

[0072] The impact modifier is a mixture of vinyl acetate and EPDM rubber in a weight ratio of 5:4.

[0073] The coupling agent is a monoalkoxy unsaturated fatty acid titanate coupling agent, the organic solvent is toluene, the compatibilizer is styrene-acrylonitrile copolymer grafted with glycidyl methacrylate, and the antioxidant is terephthalate phenol.

[0074] The preparation method of the above-mentioned heat dissipation material comprises the following steps:

[0075] (1) Mix the coupling agent and the organic solvent uniformly by weight to obtain a dispersion, then add the thermally conductive filler into the dispersion, raise the t...

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Abstract

The invention relates to the technical field of heat dissipating materials, particularly to a heat dissipating material and a preparation method thereof, wherein the heat dissipating material comprises the following raw materials by weight: 50-80 parts of a polyamide resin, 30-35 parts of a HDPE resin, 20-35 parts of an epoxy resin, 10-15 parts of a thermal conduction filler, 8-12 parts of an anti-impact modifier, 2-6 parts of a coupling agent, 40-50 parts of an organic solvent, 5-10 parts of a compatibilizer, and 7-10 parts of an antioxidant, and the thermal conduction filler is a mixture offlake graphite and aluminum nitride according to a weight ratio of 2-5:3. The heat dissipating material of the present invention has a thermal conductivity coefficient of more than 3.78 W / (m.k), and has advantages of excellent thermal conductivity, good mechanical property and high impact strength.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials, in particular to a heat dissipation material and a preparation method thereof. Background technique [0002] With the rapid development of the electronic information age, computers have become indispensable electronic products for people's daily life and work. Due to the needs of people's work or study, they often need to use computers continuously for a long time, but in the process of using computers continuously for a long time , The electronic components inside the computer will generate heat. If the internal heat is not discharged in time, excessive heat accumulation will easily damage the electronic components inside the computer and shorten the service life of the computer. Contents of the invention [0003] In order to overcome the shortcomings and deficiencies in the prior art, the first purpose of the present invention is to provide a heat dissipation material with ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/02C08L23/06C08L63/00C08L51/00C08L23/16C08K13/04C08K7/00C08K3/28C08K5/372C09K5/14
CPCC08K2003/285C08L77/02C08L2201/08C08L2203/20C08L2205/035C08L2207/062C09K5/14C08L23/06C08L63/00C08L51/006C08L23/16C08K7/00C08K3/28C08K5/372C08L51/003C08K13/04C08K5/13
Inventor 郑宇航
Owner GUANGDONG GERUI NEW MATERIALS CO LTD