Functional nanometer heat dissipation coating and preparation method and application thereof

Abstract

The invention discloses a functional nanometer heat dissipation coating and a preparation method and application thereof. The functional nanometer heat dissipation coating is prepared from, by weight,20-60 parts of water soluble resin, 1-12 parts of a water soluble curing agent, 0.1-2 parts of a thickening agent, 40-70 parts of water, 0.1-0.5 part of a defoaming agent, 0.5-5 parts of a flatteningagent, 0.5-30 parts of auxiliaries and 0.5-5 parts of nanometer carbon materials. The heat dissipation coating contains various nanometer raw materials, when the coating is used for coating the surface of a heat dissipation device, the heat dissipation efficiency of the heat dissipation device can be greatly improved, the temperature of an electronic device is lowered, and therefore the service life of the electronic device is prolonged; meanwhile, the coating further has the functions of resisting corrosion, water, acid, soil, insulation and the like, no antiseptic and other treatment needsto be performed on the heat dissipation device, and the coating has the advantages of being environmentally friendly, safe, green and the like; the nanometer heat dissipation coating has the wide application prospect and the practical value in the field of electronic heat dissipation, and meanwhile the coating is simple in preparation technology, low in cost and suitable for large-scale production.

Description

technical field [0001] The invention relates to the technical field of functional materials and electronic devices, in particular to a functional nano heat dissipation coating and its preparation method and application. Background technique [0002] Metal materials are often used as heat transfer media because of their high thermal conductivity and fast heat transfer rate, and are used as heat dissipation structural materials in many electronic and electrical products. However, the heat radiation ability of the metal surface is poor. Without convective heat transfer, the heat on the metal is difficult to dissipate through radiation. However, adding equipment that enhances convective heat transfer will not only increase the cost, but also take up a lot of space, which cannot meet the development needs of today's electronic products towards miniaturization, high power, and high performance. Therefore, improving the heat radiation ability of the metal surface through coating t...

AI Technical Summary

Problems solved by technology

However, the heat radiation ability of the metal surface is poor. In the absence of convective heat transfer, the heat on the metal is difficult to dissipate by radiation.

However, adding equipment that enhances convective heat transfer will not only increase the cost, but also take up a lot of space, which cannot meet the development needs of today's electronic products towards miniaturization, high power, and high performance.

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