Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance

A multiplexer and capacitor technology, applied in capacitors, printed capacitors, circuits, etc., can solve the problems of mobile RF transceiver design complexity and performance bottlenecks

Inactive Publication Date: 2019-04-16
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Design complexity for mobile RF transceivers is complicated by migration to deep sub-micron process nodes due to cost and power considerations
Pitch considerations also affect mobile RF transceiver designs Deep sub-micron process nodes, such as large capacitors, can create performance bottlenecks during design integration of RF multiplexers

Method used

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  • Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance
  • Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance
  • Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance

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Embodiment Construction

[0022] The detailed description set forth below in connection with the accompanying drawings is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details in order to provide a thorough understanding of various concepts. It will be apparent, however, to one skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring the concepts. As used herein, the use of the term "and / or" is intended to mean an "inclusive or", and the use of the term "or" is intended to mean an "exclusive or".

[0023] Mobile RF chip designs including high performance multiplexers (eg, mobile RF transceivers) have migrated to deep sub-micron process nodes due to cost and power consumption considerations. The d...

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PUM

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Abstract

A passive device may include an inductor having interconnected trace segments. The passive device may also include parallel plate capacitors. Each of the plurality of parallel plate capacitors may have a dielectric layer between a pair of conductive plates. The parallel plate capacitors may not overlap more than one of the interconnected trace segments.

Description

technical field [0001] Aspects of the present disclosure relate to semiconductor devices, and more particularly to multi-density metal-insulator-metal (MIM) capacitors for improved passive-on-glass (POG) multiplexer performance. Background technique [0002] One goal driving the wireless communications industry is to provide increased bandwidth to consumers. The use of carrier aggregation in the current generation of communications offers one possible solution to this goal. Carrier aggregation enables wireless carriers with licenses for two frequency bands (eg, 700MHz and 2GHz) to maximize bandwidth in a particular geographic area by using both frequencies simultaneously for a single communication flow. While providing increased data volumes to end users, noise generated at harmonic frequencies complicates carrier aggregation implementation due to the frequencies used for data transmission. For example, a 700MHz transmission may generate harmonics at 2.1GHz, which can inte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/16H01L49/02H03H7/01H03H7/46H05K1/03H03H1/00
CPCH05K1/0306H05K1/162H05K1/165H05K2201/09263H05K2201/09281H03H2001/0085H01L28/10H01L28/40H03H7/0115H03H7/46H03H2001/0078H03H1/0007H03H7/0138
Inventor N·S·穆达卡特D·F·伯迪C·H·芸左丞杰古仕群M·F·维勒兹金钟海
Owner QUALCOMM INC
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