A method of bonding monocrystalline silicon and sapphire
A monocrystalline silicon and sapphire technology, which is applied in welding equipment, photoplate process of patterned surface, instruments, etc., can solve problems such as internal stress change, bonding surface cracking, bonding surface is not firm, etc., to solve cracking, high The effect of strength, good strength
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[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.
[0030] A method for bonding monocrystalline silicon and sapphire provided by the invention comprises the following steps:
[0031] In a clean environment, take an appropriate amount of sodium silicate solution adhesive and drop it on the surface of the monocrystalline silicon to be bonded, and then attach the surface of the sapphire to be bonded to the surface of the monocrystalline silicon to b...
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