Low viscosity UV/moisture dual-curing polyurethane hot melt adhesive and preparation method thereof

A polyurethane hot-melt adhesive, dual-curing technology, used in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of volatile, easy to bring pollution, peculiar smell, etc. , Avoid pollution problems and odor problems, improve the effect of final adhesive strength

Active Publication Date: 2019-05-03
重庆中科力泰高分子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, in common UV light curing adhesive formulations, a large amount of reactive diluent is often used
Reactive diluents are usually small molecular monomers with low boiling points, which are volatile and easy to cause pollution or odor

Method used

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  • Low viscosity UV/moisture dual-curing polyurethane hot melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A low-viscosity UV / moisture dual-curing polyurethane hot-melt adhesive, in parts by weight, the hot-melt adhesive comprises the following components: 95.06 parts of UV / moisture dual-curing polyester polyether polyurethane, free radical photoinitiator ( 2,2-dimethoxy-2-phenylacetophenone) 2.5 parts, cationic photoinitiator (diphenyliodonium hexafluorophosphate) 1.5 parts, photosensitizer (2-isopropylthioxanthone ) 0.6 part, polyurethane catalyst (0.12 part of bismorpholine diethyl ether and 0.01 part of dibutyltin dilaurate) 0.13 part, water reducer (benzoyl chloride) 0.01 part, antioxidant (antioxidant 1010) 0.2 part . Prepare as follows:

[0029] In parts by weight, 10 parts of crystalline polyester diol (hexanediol adipate diol) with a molecular weight of 1000, 30 parts of crystalline polyester diol (succinic acid) with a molecular weight of 6000 butylene glycol ester diol), 20 parts of polyether diol (polypropylene glycol diol) with a molecular weight of 2000, 10 p...

Embodiment 2

[0033] A low-viscosity UV / moisture dual-curing polyurethane hot-melt adhesive, by weight, the hot-melt adhesive comprises the following components: 96.71 parts of UV / moisture dual-curing polyester polyether polyurethane, free radical photoinitiator ( 1-hydroxy-cyclohexyl-phenyl ketone) 2 parts, cationic photoinitiator (4-isobutylphenyl-4'-methylphenyliodonium hexafluorophosphate) 0.5 parts, photosensitizer (2, 0.5 parts of 4-diethylthioxanth-9-one), 0.175 parts of polyurethane catalyst (0.16 parts of bismorpholine diethyl ether and 0.015 parts of dibutyltin dilaurate), 0.015 parts of water reducer (heptanoyl chloride), Antioxidant (antioxidant 1076) 0.1 part. Prepare as follows:

[0034] In parts by weight, 25 parts of crystalline polyester diol (butylene adipate diol) with a molecular weight of 3000, 10 parts of polyether diol (bisphenol A polyoxyl) with a molecular weight of 400 Vinyl ether diol), 28 parts of polyether diol (polypropylene glycol diol) with a molecular weig...

Embodiment 3

[0038] A low-viscosity UV / moisture dual-curing polyurethane hot-melt adhesive, in parts by weight, the hot-melt adhesive comprises the following components: 96.16 parts of UV / moisture dual-curing polyester polyether polyurethane, free radical photoinitiator ( 2,4,6-trimethylbenzoyl-diphenylphosphine oxide) 3 parts, cationic photoinitiator (4-tert-butylphenyl-4'-tert-butylphenyliodonium hexafluorophosphate) 0.25 parts, 0.25 parts of photosensitizer (N-vinyl carbazole), 0.27 parts of polyurethane catalyst (0.24 parts of bismorpholine diethyl ether and 0.03 parts of dibutyltin dilaurate), 0.02 parts of water reducer (cyclohexyl chloride) Part, antioxidant (antioxidant 164) 0.05 part. Prepare as follows:

[0039] In parts by weight, 30 parts of crystalline polyester diol (butylene sebacate diol) with a molecular weight of 4000, 5 parts of polyether diol (bisphenol A polyoxyl) with a molecular weight of 500 Propylene ether diol), 10 parts of polyether diol (polypropylene glycol d...

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Abstract

The invention relates to a low viscosity UV/moisture dual-curing polyurethane hot melt adhesive and a preparation method thereof, belonging to the technical field of photocuring adhesives. The low viscosity UV/moisture dual-curing polyurethane hot melt adhesive comprises the following components in parts by weight: 95-97 parts of UV/moisture dual-curing polyester polyether polyurethane, 1-3 partsof free radical photoinitiator, 0.25-2 parts of cationic photoinitiator, 0.25-1 part of photosensitizer, 0.06-0.35 part of polyurethane catalyst, 0.01-0.02 part of water reducing agent, and 0.05-0.2 part of antioxidant. The hot melt adhesive can be used for the bonding of opaque substrates. The viscosity of the adhesive at the sizing temperature 110 DEG C is in the range of 2000-2500 mPa.s, the viscosity is low, the construction is convenient, the initial viscosity is strong, the positioning is fast, the holding time is shortened, even the holding pressure is not needed. The hot melt adhesivedoes not contain small molecular active diluent and is environmentally friendly. The preparation process is simple, easy to operate and suitable for industrial production.

Description

technical field [0001] The invention belongs to the technical field of light-curing adhesives, and in particular relates to a low-viscosity UV / moisture double-curing polyurethane hot-melt adhesive and a preparation method thereof. Background technique [0002] With the development of the consumer electronics industry, touch-screen mobile phones with high screen-to-body ratio and narrow bezels have gradually become mainstream. The frame of the mobile phone screen is attached to the middle frame with adhesive. The popularity of narrow borders puts forward new requirements for the development of corresponding adhesives. On the one hand, the narrow frame makes the bonding area smaller, so the adhesive needs to have higher bonding strength. On the other hand, to apply glue on a narrow frame, it is required that the viscosity of the adhesive at the glue application temperature should not be too high. For traditional hot melt adhesives, under normal circumstances, adhesives with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J11/06C08G18/42C08G18/48C08G18/58C08G18/76C08G18/67C08G18/30
Inventor 张珂何彬李有刚
Owner 重庆中科力泰高分子材料有限公司
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