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High-frequency resin prepolymer and high-frequency resin combination, prepreg, laminated board and interlayer insulating membrane prepared with same

A resin composition and prepreg technology, applied in synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problems of high water absorption of materials, reduce the packing density, strengthen the self-extinguishing property, and solve the problems of high water absorption. insoluble effect

Active Publication Date: 2019-05-10
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the epoxy resin is cured, the material inevitably contains a large number of hydrophilic groups, resulting in a large water absorption rate of the material.

Method used

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  • High-frequency resin prepolymer and high-frequency resin combination, prepreg, laminated board and interlayer insulating membrane prepared with same
  • High-frequency resin prepolymer and high-frequency resin combination, prepreg, laminated board and interlayer insulating membrane prepared with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] According to the method in the synthesis example, react at 60°C for 120 minutes to prepare 30 g of prepolymers of cage-type silsesquioxane with amino groups: carboxyl polyarylether ketone = 10:50, add appropriate amount of N, N-dimethyl ethyl Amide is dissolved; after the POSS modified polyaryletherketone prepolymer is completely dissolved, add 30g of phosphorus-containing epoxy resin (XZ92530, Dow Chemical), 30g of phenolic curing agent (PF-8011, Shandong Shengquan), 10g of phosphorus-containing Phenolic (XZ92741, Dow Chemical), 0.01 g of 2-ethyl-4 methylimidazole, 40 g of spherical silica, and an appropriate amount of butanone solvent were stirred and mixed evenly to obtain a glue solution with a solid content of 60%.

[0061] The glue solution was dipped and coated on E glass fiber cloth (2116, unit weight 104g / m2), and baked in an oven at 135°C for 5min to obtain a prepreg with a resin content of 50%.

[0062] The prepared prepreg with a resin content of 50% was pla...

Embodiment 2

[0065] According to the method in the synthesis example, react at 60°C for 120 minutes to prepare 30 g of prepolymers of cage-type silsesquioxane with amino groups: phenylcarboxypolyaryletherketone = 10:80, add appropriate amount of N, N-dimethyl Acetamide is dissolved; after the POSS modified polyaryletherketone prepolymer is completely dissolved, add 30g of naphthalene-containing ring-type epoxy resin (NC-7300, Nippon Kayaku), 25g of phenolic curing agent (PF-8011, Shandong Shengquan ), 15g phosphorus-containing phenolic aldehyde (XZ92741, Dow Chemical), 0.01g 2-ethyl-4 methylimidazole, 40g spherical silica, an appropriate amount of methyl ethyl ketone solvent, stir and mix evenly to obtain a glue solution with a solid content of 60%.

[0066] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0067] The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 3

[0069] According to the method in the synthesis example, react at 60°C for 120 minutes to prepare 30 g of a prepolymer of cage silsesquioxane with epoxy groups: carboxyl polyarylether ketone = 10:40, add appropriate amount of N, N-dimethyl Acetamide was dissolved; after the POSS modified polyaryletherketone prepolymer was completely dissolved, 30g of dicyclopentadiene epoxy resin (XD-1000, Nippon Kayaku), 22g of phenolic curing agent (PF-8011, Shandong Holy Spring), 18g phosphorus-containing phenolic aldehyde (XZ92741, Dow Chemical), 0.01g 2-ethyl-4 methylimidazole, 40g spherical silicon dioxide, an appropriate amount of methyl ethyl ketone solvent, stir and mix to obtain a glue with a solid content of 60% liquid.

[0070] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0071] The properties of the obtained copper-clad laminates are shown in Table 1.

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Abstract

The invention discloses a high-frequency resin prepolymer. The high-frequency resin prepolymer is prepared by at least prepolymerizing cage type silsesquioxane and polyaryletherketone at a weight ratio of 100:100-5000. Compared with the prior art, the prepared POSS-modified (polyhedral oligomeric silsesquioxane-modified) polyaryletherketone prepolymer can reduce the dielectric constant of materials and endow a resin combination and a laminated board which are prepared from the POSS-modified polyaryletherketone prepolymer with excellent copper foil release strength and high glass transition temperature, and meanwhile, keep stable the dielectric constant and the low dielectric loss under high-frequency conditions to better meet the requirements of high-frequency, high-speed and high-densityinterconnection.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a high-frequency resin prepolymer and a high-frequency resin composition, a prepreg, a laminate and an interlayer insulating film prepared by using the same. Background technique [0002] With the development of communication and electronic products in the direction of high frequency and high speed, users have higher and higher performance requirements for such products. High frequency and high performance substrate materials have become an important frontier technology for the development of the printed circuit board industry. Many companies have joined the ranks of developing new materials and technologies for copper clad laminates. Traditional resin substrate materials are replaced by high-frequency, high-speed, and high-reliability substrate materials, and the market demand is increasing. The performance of high-frequency microwave circuit substrates directly de...

Claims

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Application Information

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IPC IPC(8): C08L71/10C08L63/00C08L61/00C08K7/18B32B15/08B32B27/18B32B27/20B32B27/06B32B27/28B32B7/06
CPCB32B7/06B32B15/08B32B27/06B32B27/18B32B27/20B32B27/28C08G77/46C08K7/18C08L61/00C08L63/00C08L71/10
Inventor 杨宋李兴敏马建崔春梅陈诚
Owner SHENGYI TECH SUZHOU
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