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UV curing heat reducing adhesive, preparation method and application thereof

A curing heat and adhesive technology, applied in the direction of adhesives, adhesive types, ester copolymer adhesives, etc., can solve problems such as unfavorable processing technology, unfavorable operation, hidden dangers and other problems, and achieve a large adjustable range of adhesive thickness, Fast viscosity reduction and low VOC effect

Active Publication Date: 2019-05-14
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional glass edge sweeping process: the high-viscosity silicone protective film is attached to the glass edge, and the tear film needs to be peeled off manually, and the efficiency is low; while the solvent-based thermal adhesive tape, the temperature of the adhesive is too high (generally 80-100°C ), there are certain risks and hidden dangers to the on-site operation, which is not conducive to operation; at the same time, the heat-adhesive adhesive tape in the prior art still has a certain residual glue phenomenon during the peeling process, which is not conducive to the subsequent processing technology.

Method used

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  • UV curing heat reducing adhesive, preparation method and application thereof
  • UV curing heat reducing adhesive, preparation method and application thereof
  • UV curing heat reducing adhesive, preparation method and application thereof

Examples

Experimental program
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Embodiment 1

[0033] This embodiment provides a UV-curable heat-relieving adhesive and a UV-curable heat-reducing adhesive tape prepared therefrom. The preparation method specifically includes the following steps:

[0034] S1: Preparation of prepolymer resin:

[0035] Add successively the compound shown in the isooctyl acrylate of 90g, the methacrylate of 10g, and the formula (I) of 0.05g to be placed in the compounding barrel, and polymerize while stirring under the protection of nitrogen to prepare the prepolymer. The viscosity is about 1950cps±50cps;

[0036] S2: Preparation of UV-cured heat-viscosity-reducing adhesive:

[0037] Add 80g of prepolymerized resin prepared in step (S1), 15g of Sanki Chemical Industry 6501, 0.1g of 1,6-hexanediol diacrylate, and 0.05g of 2,2 dimethoxy 2-phenylacetophenone 1. 3g of heat-expandable microspheres are placed in a glue mixing bucket, stirred and dispersed to obtain a UV-curable heat-viscosity-reducing adhesive.

[0038] S3: Preparation of UV-cur...

Embodiment 2

[0041] This embodiment provides a UV-curable heat-relieving adhesive and a UV-curable heat-reducing adhesive tape prepared therefrom. The preparation method specifically includes the following steps:

[0042] S1: Preparation of prepolymer resin:

[0043] Add successively the compound shown in the isooctyl acrylate of 90g, the methacrylate of 10g, and the formula (I) of 0.05g to be placed in the compounding barrel, and polymerize while stirring under the protection of nitrogen to prepare the prepolymer. The viscosity is about 2000cps±50cps;

[0044] S2: Preparation of UV-cured heat-viscosity-reducing adhesive:

[0045] Add 80g of prepolymerized resin prepared in step (S1), 15g of Sanki Chemical Industry 6501, 0.1g of 1,6-hexanediol diacrylate, and 0.05g of 2,2 dimethoxy 2-phenylacetophenone 1. 8g of heat-expandable microspheres were placed in a glue mixing bucket, stirred and dispersed to obtain a UV-curable heat-viscosity-reducing adhesive.

[0046] S3: Preparation of UV-cu...

Embodiment 3

[0049] This embodiment provides a UV-curable heat-relieving adhesive and a UV-curable heat-reducing adhesive tape prepared therefrom. The preparation method specifically includes the following steps:

[0050] S1: Preparation of prepolymer resin:

[0051] Add successively the compound shown in the isooctyl acrylate of 90g, the methacrylate of 10g, and the formula (I) of 0.05g to be placed in the compounding barrel, and polymerize while stirring under the protection of nitrogen to prepare the prepolymer. The viscosity is about 2100cps±30cps;

[0052] S2: Preparation of UV-cured heat-viscosity-reducing adhesive:

[0053] Add 80g of prepolymerized resin prepared in step (S1), 15g of Sartomer CN704, 0.1g of 1,6-hexanediol diacrylate, 0.05g of 2,2 dimethoxy 2-phenyl styrene The ketone and 12g of heat-expandable microspheres were placed in the glue mixing bucket, stirred and dispersed to obtain a UV-curable heat-viscosity-reducing adhesive.

[0054] S3: Preparation of UV-cured hea...

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Abstract

The invention discloses a UV curing heat reducing adhesive, a preparation method and an application thereof. Adhesive raw materials comprise prepolymer resin, polyurethane acrylate, a reactive diluent, a photoinitiator and thermal expansion microspheres. According to the mass percentage, the raw materials of the prepolymer resin comprise 60-94.5% of 2-ethylhexyl acrylate, 5-39.5% of (meth) acrylate and 0.01-1% of the compound shown in a formula (I), and the prepolymer resin are prepared by reacting the three raw materials. The preparation method includes, firstly, preparing the prepolymer resin, and then mixing the prepolymer resin with other raw materials of the adhesive to prepare the prepolymer resin. The invention discloses the application of a UV curing heat reducing adhesive tape made of the adhesive and the adhesive tape in the 2.5D and 3D glass edge sweeping processes. The adhesive has the advantages of excellent initial adhesive force, low initial temperature of thermal viscosity reduction and high viscosity reduction speed, and the heat reducing adhesive tape prepared from the adhesive does not have the phenomena of powder crumbs and residual glue in the use process, andthe adhesive has the advantages of low VOC, high coating production speed and the like.

Description

technical field [0001] The invention belongs to the technical field of glass edge sweeping, and in particular relates to a UV-cured heat-viscosity-reducing adhesive and a preparation method and application thereof. Background technique [0002] Traditional glass edge sweeping process: the high-viscosity silicone protective film is attached to the glass edge, and the tear film needs to be peeled off manually, and the efficiency is low; while the solvent-based thermal adhesive tape, the temperature of the adhesive is too high (generally 80-100°C ), there are certain hidden dangers to on-site operations, which is unfavorable for operation; at the same time, the heat-adhesive adhesive tape in the prior art also has a certain residual glue phenomenon during the peeling process, which is unfavorable for the subsequent processing. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art, and pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J175/14C09J11/00C09J7/25
Inventor 李阜阳周琪权杨溢芋野昌三陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC
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