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Layered structure and light-sensitive dry film used in same

A structure and photosensitivity technology, which is applied in the direction of photosensitive materials, optics, and optomechanical equipment used in optomechanical equipment, can solve the problem that it is difficult to ensure the initial adhesion of the laminate on the substrate when dealing with cracks, and achieve adhesion Improvement, high reliability, and the effect of no reduction in resolution

Active Publication Date: 2012-10-31
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, there is also a problem that handling cracks are likely to occur when forming a photosensitive dry film, and it is difficult to ensure initial adhesion when laminating on a substrate.

Method used

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  • Layered structure and light-sensitive dry film used in same
  • Layered structure and light-sensitive dry film used in same
  • Layered structure and light-sensitive dry film used in same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0182] The present invention will be specifically described below by giving Examples and Comparative Examples, but the present invention is not limited to the following Examples. Wherein, the following "parts" and "%" all refer to the mass basis unless otherwise specified.

Synthetic example 1

[0184] In an autoclave equipped with a thermometer, a nitrogen gas introduction device, an alkylene oxide introduction device, and a stirring device, 119.4 parts of novolak-type cresol resin (trade name "Shonol CRG951", manufactured by Showa Polymer Co., Ltd., OH equivalent: 119.4 ), 1.19 parts of potassium hydroxide and 119.4 parts of toluene, nitrogen replacement was carried out in the system while stirring, and the temperature was raised. Then, slowly add 63.8 parts of propylene oxide dropwise, at 125~132℃, at 0~4.8kg / cm 2 React for 16 hours. Then, it was cooled to room temperature, and 1.56 parts of 89% phosphoric acid was added and mixed in the reaction solution to neutralize potassium hydroxide to obtain a non-volatile component of 62.1%, a hydroxyl value of 182.2g / eq. Propane reaction solution. This is what added 1.08 mol of alkylene oxides on average with respect to 1 equivalent of phenolic hydroxyl groups.

[0185] 293.0 parts of the alkylene oxide reaction solutio...

Embodiment 1~12

[0219] Using the above-mentioned photocurable thermosetting resin composition examples 1 to 12, according to the combinations shown in the following table 2, in examples 1 to 7, the first photosensitive resin layer in contact with the substrate was formed with a film thickness of 15 μm (2L1), form a second photosensitive resin layer (2L2) in contact with the first photosensitive resin layer (2L1) with a film thickness of 5 μm, and make a photosensitive resin layer with a two-layer structure capable of forming a pattern. dry film. In Examples 8 to 12, the first photosensitive resin layer (3L1) in contact with the substrate was formed with a film thickness of 5 μm, and the second photosensitive resin layer (3L1) in contact with the first photosensitive resin layer (3L1) was formed with a film thickness of 10 μm. Resin layer (3L2), on the second photosensitive resin layer (3L2), further form a third photosensitive resin layer (3L3) with a film thickness of 5 μm, and make a photos...

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Abstract

Provided is a layered structure that has, at least, a substrate (1) and a light-sensitive resin layer or cured coating layer (2), containing an inorganic filler (3), formed on top of the substrate. In the light-sensitive resin layer or cured coating layer, the proportion of the inorganic filler is lower in a surface region opposite the substrate than in other regions, making it possible to keep the coefficient of linear thermal expansion of the entire light-sensitive resin layer or cured coating layer as low as possible while also avoiding losses in resolution and achieving excellent adhesion to an underfill resin section or a molded resin section. Preferably, the light-sensitive resin layer or cured coating layer comprises at least two layers having different inorganic filler proportions, and the surface-side light-sensitive resin layer or cured coating layer opposite the substrate has a lower inorganic filler proportion than the other layer(s). A light-sensitive dry film containing the abovementioned light-sensitive resin layer is suitable for use as an interlayer resin insulation layer or a solder resist in a printed circuit board.

Description

technical field [0001] The present invention relates to a laminated structure such as a printed wiring board, and a photosensitive dry film used as a solder resist layer or an interlaminar resin insulating layer thereof. Background technique [0002] In recent years, solder resists are also required to be improved in workability and performance in response to the increase in density of printed wiring boards accompanying the reduction in weight, weight, and size of electronic equipment. In addition, recently, along with miniaturization, weight reduction, and higher performance of electronic equipment, miniaturization and multi-pin semiconductor packages are being put into practical use and mass-produced. In response to such high density, instead of IC packages called QFP (Quad Flat Package), SOP (Small Outline Package), etc., BGA (Ball Grid Array Package), CSP (Chip Scale Package) appeared. and other IC packages. Various photosensitive resin compositions have been proposed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/095H05K3/28
CPCH05K3/287G03F7/095H05K3/3452H05K2201/0269H05K2201/0195G03F7/0047H05K2201/0209G03F7/0045H01L21/0271H05K3/281
Inventor 吉田贵大峰岸昌司有马圣夫
Owner TAIYO HLDG CO LTD
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