Method for preparing high-purity titanium sputtering target material through sputtering method

Abstract

The invention discloses a method for preparing a high-purity titanium sputtering target material through a sputtering method. The method comprises the steps that a titanium alloy which has the purityof 99.9% or above and is produced through the sputtering method is taken as a raw material, and a high-purity titanium blank (with the purity of 99.98% or above) is obtained by conducting smelting through an electron beam cold bed furnace; face milling is conducted on the titanium blank, ends of the titanium square blank are cut after fine grinding is finished, the titanium blank is cut to have the size required by a forging blank, flaw detection is conducted on the forging blank, the qualified forging blank is heated to 980-1,020 DEG C, the forging blank is forged through three times of upsetting and three times of drawing, a forging piece is made into a bar with the needed specification in a die forging mode, oxide skin on the surface of the bar is turned after the forging piece is annealed, and after forging caps at the two ends are removed, the bar is sawn into a small columnar block with the needed specification; the two sawn end faces of the small columnar block are turned to besmooth, turn milling is conducted on the interior of the bottom, the edge is reserved, the reserved edge is chamfered, and wire opening is conducted on the other end; and after further cleaning is conducted, the cylindrical titanium sputtering target material is obtained. According to the target material produced through the method, the purity is no less than 99.98%, the grain size is controlled to be 100 micrometers or below, and the technological requirement of the sputtering target material can be met.

Description

Technical field [0001] The invention relates to a method for preparing a high-purity titanium sputtering target material by applying a sputtering method. Background technique [0002] Sputtering is one of the main techniques for preparing thin film materials, and the raw material for sputtering deposited thin films is the target material. The film deposited by sputtering with the target material has high density and good adhesion. Since the 1990s, new devices and new materials in the microelectronics industry have developed rapidly. Electronics, magnetics, optics, optoelectronics, and superconducting thin films have been widely used in high-tech and industrial fields, prompting the sputtering target market to expand. Nowadays, target materials have flourished into a specialized industry. [0003] Pure titanium sputtering targets are developed in the emerging decorative coatings, tooling coatings, glass coatings, semiconductor device coatings, electronic device coatings, flat disp...

AI Technical Summary

Problems solved by technology

Although some domestic research institutes and manufacturers have developed and trial-produced targets, high-quality targets are still in the stage of theoretical research and trial production, and the quality of targets actually produced is relatively low, and a large number of high-quality targets still need import