A preparation method of SN-based composite solder sheet based on porous Ni/Cu alloy

A hybrid welding and alloy technology, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of low coating adhesion, low welding efficiency, poor toughness, etc., and achieve strong performance adjustment and durability Good oxidation performance and controllable results
CN109848611BActive Publication Date: 2020-09-08无锡继平新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
无锡继平新材料科技有限公司
Publication Date
2020-09-08

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Abstract

The invention relates to a preparation method of a Sn-base composite solder sheet based on a porous Ni / Cu alloy. The preparation method comprises the steps that first of all, a layer of Cu is preparedon the surface of porous Ni metal, and then high-temperature sintering is carried out, so that mutual diffusion between Ni and Cu is facilitated, and bonding of Ni and Cu is further tight; and then the porous Ni / Cu alloy is immersed into the molten Sn-base solder, and finally is rolled into a foil. In the porous Ni / Cu alloy subjected to high-temperature sintering treatment, the bonding strength of Ni and Cu is higher and the oxidation resistance is better through the mutual diffusion between Ni and Cu, and the relatively high strength, good plasticity, high corrosion resistance and high ductility are shown. Along with change of sintering parameters and electroplating parameters, concentration distribution gradients of Ni and Cu in the porous Ni / Cu alloy are different, reaction between theporous Ni / Cu alloy and the Sn-base solder is rapider in the brazing process, and the soldering reliability is high.
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Description

technical field

[0001] The invention relates to the technical field of welding materials, in particular to a method for preparing a porous Ni / Cu alloy-based Sn-based composite solder sheet. Background technique

[0002] With the development of electronic packaging technology, people have higher and higher performance requirements for small size, high power and high frequency power devices. As an important part of interconnect materials, solder has a direct impact on the performance of interconnect joints. Therefore, improving the strength and high-temperature performance of solder has gradually become an important direction for improving the quality of electronic device products.

[0003] Porous metal-reinforced low-melting-point composite solder sheets have the advantages of high strength and good soldering performance, and have broad application prospects in the field of electronic packaging. The inventor team disclosed a metal foam composite solder sheet and its preparat...

Claims

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