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Environment-friendly insulating material

An insulating material and environmentally friendly technology, applied in the field of insulating materials, can solve problems such as uneven properties, large thermal conductivity, and unstable dimensions, and achieve the effect of avoiding uneven properties and reducing sedimentation rate

Inactive Publication Date: 2019-06-14
DONGGUAN YUMAO NANO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Silica powder is widely used in insulating materials. It has the characteristics of high hardness, large thermal conductivity, and good insulation performance. Filling epoxy resin can improve the hardness, heat resistance, wear resistance and mechanical strength of the composite material, and reduce the cured product. Internal stress, preventing cracking and deformation of the upper product. If the particle size distribution of silicon micropowder in the epoxy resin mixture is improper, sedimentation will easily occur, resulting in uneven properties of each part. The resin-rich area formed by the high sedimentation rate has a large shrinkage rate. The size of the product is unstable, resulting in large internal stress and easy to crack

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] An environmentally friendly insulating material, which comprises the following components in parts by weight:

[0022]

[0023] The particle size of the active silica powder is 2 μm.

[0024] A production process of an environmentally friendly insulating material, the process comprises the following steps:

[0025] S1: Dry the active silica powder with a dryer to control its moisture content to less than 0.4%;

[0026] S2: Prepare two components in the following order:

[0027] Component A: epoxy resin, accelerator DMP-30, methyltetrahydrophthalic anhydride, fumed silica, antimony trioxide and silicon micropowder;

[0028] B component: curing agent, dibromophenyl glycidyl ether, methyl tetrahydrophthalic anhydride, fumed silica and silicon micropowder;

[0029] S3: Heating component A to 85°C, degassing and stirring under vacuum conditions, stirring speed 200r / min, time 20min, heating component B to 40°C, degassing and stirring under vacuum conditions, stirring S...

Embodiment 2

[0035] An environmentally friendly insulating material, which comprises the following components in parts by weight:

[0036]

[0037] The particle size of the active silica powder is 61 μm.

[0038] A production process of an environmentally friendly insulating material, the process comprises the following steps:

[0039] S1: Dry the active silica powder with a dryer to control its moisture content to less than 0.4%;

[0040] S2: Prepare two components in the following order:

[0041] Component A: epoxy resin, accelerator DMP-30, methyltetrahydrophthalic anhydride, fumed silica, antimony trioxide and silicon micropowder;

[0042] B component: curing agent, dibromophenyl glycidyl ether, methyl tetrahydrophthalic anhydride, fumed silica and silicon micropowder;

[0043] S3: Heating component A to 90°C, degassing and stirring under vacuum conditions, stirring speed 250r / min, time 30min, heating component B to 50°C, degassing and stirring under vacuum conditions, stirring ...

Embodiment 3

[0049] An environmentally friendly insulating material, which comprises the following components in parts by weight:

[0050]

[0051]

[0052] The particle size of the active silica powder is 120 μm.

[0053] A production process of an environmentally friendly insulating material, the process comprises the following steps:

[0054] S1: Dry the active silica powder with a dryer to control its moisture content to less than 0.4%;

[0055] S2: Prepare two components in the following order:

[0056] Component A: epoxy resin, accelerator DMP-30, methyltetrahydrophthalic anhydride, fumed silica, antimony trioxide and silicon micropowder;

[0057] B component: curing agent, dibromophenyl glycidyl ether, methyl tetrahydrophthalic anhydride, fumed silica and silicon micropowder;

[0058] S3: Heating component A to 95°C, degassing and stirring under vacuum conditions, stirring speed 300r / min, time 40min, heating component B to 60°C, degassing and stirring under vacuum condition...

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Abstract

The invention discloses an environment-friendly insulating material. The insulating material comprises the following components in parts by weight: 80-120 parts of epoxy resin E-44, 10-30 parts of dibromophenyl glycidyl ether, 5-15 parts of antimonous oxide, 200-400 parts of active silica micropowder, 90-100 parts of a curing agent, 1-2 parts of an accelerant DMP-30, 20-30 parts of methyl tetrahydrophthalic anhydride and 40-60 parts of fumed silica. According to the invention, epoxy resin E-44, dibromophenyl glycidyl ether, antimonous oxide, active silica micropowder, the curing agent, the accelerant DMP-30 and methyltetrahydrophthalic anhydride are mixed for processing according to a specific ratio, thus the insulating material has a high-voltage insulating function, meanwhile, by addingfumed silica, the moderate viscosity of a system is guaranteed, the settling rate of silicon micropowder can be greatly reduced, and the situation that the insulating material is uneven in property, generates large internal stress and cracks is avoided.

Description

technical field [0001] The invention relates to the technical field of insulating materials, in particular to an environment-friendly insulating material. Background technique [0002] Silica powder is widely used in insulating materials. It has the characteristics of high hardness, large thermal conductivity, and good insulation performance. Filling epoxy resin can improve the hardness, heat resistance, wear resistance and mechanical strength of the composite material, and reduce the cured product. Internal stress, preventing cracking and deformation of the upper product. If the particle size distribution of silicon micropowder in the epoxy resin mixture is improper, sedimentation will easily occur, resulting in uneven properties of each part. The resin-rich area formed by the high sedimentation rate has a large shrinkage rate. The size of the product is unstable, resulting in large internal stress and easy to crack. Contents of the invention [0003] The object of the p...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/22C08K3/36
Inventor 朱政权
Owner DONGGUAN YUMAO NANO TECH
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