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On-chip antenna and an antenna array

An on-chip antenna and patch antenna technology, which is applied in the direction of antenna, antenna grounding device, antenna grounding switch structure connection, etc., can solve the problems of difficult setting of antenna unit and CMOS structure, and achieve good engineering realization and high feeding efficiency Effect

Active Publication Date: 2019-07-05
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The size parameters of traditional millimeter-wave antennas are at the millimeter level, and the size and dimensions of the CMOS structure are at the micron level. The structure of the on-chip antenna needs to directly interconnect the antenna unit and the CMOS structure. There will be an order of magnitude difference, and the structural setting between the antenna unit and the CMOS structure is difficult

Method used

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  • On-chip antenna and an antenna array
  • On-chip antenna and an antenna array

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Effect test

Embodiment 1

[0022] like figure 1 shown, figure 1 It is a schematic diagram of the three-dimensional structure of the on-chip antenna of the present invention; the on-chip antenna of the present invention includes an antenna substrate 2, a patch antenna unit 1 disposed on the upper surface of the antenna substrate 2, and a CMOS unit disposed on the lower surface of the antenna substrate 2. , the CMOS unit includes a quasi-coaxial feeding structure 5 and a coplanar waveguide feeding structure 4 , and the patch antenna unit 1 is provided with a feeding probe 3 . The feeding probe 3 can be set as a probe metal column 7 distributed in a vertical bundle.

[0023] like figure 2 shown, figure 2 It is a partial cross-sectional view of the on-chip antenna of the present invention; the quasi-coaxial feed structure 5 includes a feed metal column 9 and a fence metal column 11 annularly distributed around the feed metal column 9; the feed metal column 9. The vertical cluster distribution constitu...

Embodiment 2

[0028] The antenna substrate 2 is set as a single-layer dielectric plate; correspondingly, the antenna substrate 2 is a double-sided copper clad laminate. The patch antenna unit 1 in the shape of "chuan" or "mountain" has a circular feed channel etched or etched on the lower surface of the antenna substrate 2, that is, a circular feed channel is provided inside the circular feed channel. Shaped probe metal patch 8 , the probe metal post 7 is connected to the upper surface of the probe metal patch 8 , and the outer copper-clad portion of the annular feed channel serves as the antenna reflection ground 6 .

[0029] The feeding probe 3 can be simply set as a probe metal column 7 at the corresponding position, and the end of the probe metal column 7 corresponds to the connection position with the patch antenna unit 1; When the diameters of the positive electrodes of the electrical probe 3 and the quasi-coaxial feeding structure 5 are relatively large, a plurality of the probe meta...

Embodiment 3

[0031] If the working bandwidth of the antenna is very wide, the antenna substrate 2 can be configured as a dielectric board formed by stacking multiple dielectric layers. Copper clad laminate on the upper surface of the uppermost dielectric layer and etched or etched the patch antenna unit 1 in the shape of "chuan" or "mountain" of the required size, and copper clad laminate on the lower surface of the lowermost dielectric layer The annular feed channel is etched or etched, and other copper-clad areas are used as antenna reflection grounds 6 .

[0032] A number of vertically clustered metal pillar through holes are arranged in the dielectric layer, and the metal pillar through holes are used to install the probe metal pillars 7 , or the metal pillar through holes are filled by a growth process to form the probe metal pillar through holes. At the same time, it is worth noting that the inner wall of the metal column through hole can also be metallized to form a through hole str...

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Abstract

The invention discloses an on-chip antenna and an antenna array. The on-chip antenna comprises an antenna substrate, a patch antenna unit disposed on the upper surface of the antenna substrate, and aCMOS unit disposed on the lower surface of the antenna substrate, wherein the CMOS unit comprises a quasi-coaxial feed structure and a coplanar waveguide feed structure; the patch antenna unit is provided with a feed probe; the quasi-coaxial feed structure is connected to the feed probe; and the coplanar waveguide feed structure is connected to the quasi-coaxial feed structure. The structure of the on-chip antenna has good engineering realization under current processing and process conditions. By means of the quasi-coaxial feed structure and the coplanar waveguide feed structure, the on-chipantenna has high feed efficiency, and has a multichannel feed capability and a coupling correction function.

Description

technical field [0001] The present invention relates to the technical field of antennas, in particular to an on-chip antenna and an antenna array. Background technique [0002] With the development of millimeter-wave technology, there are more and more applications of millimeter-wave antennas and radars. With the improvement of processing and preparation technology, the integration of products is higher and the volume is smaller. On-chip antennas are antennas designed on wafers, integrated circuits, and chips. They have the characteristics of high integration, compact structure, and finesse, breaking through the traditional mode of independent design and reintegration of active circuits and components. For the CMOS (Complementary Metal Oxide Semiconductor) structure, it is a layered structure in which multiple layers of metal and oxide are alternately stacked, and is generally attached to a substrate such as silicon, germanium, and gallium arsenide. The size parameters of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H01Q1/48H01Q1/50H01Q19/10
CPCH01Q1/38H01Q1/48H01Q1/50H01Q19/104
Inventor 陈谦万应禄张小林金谋平马强戴跃飞
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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