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Laser machining apparatus laser machining method and computer-readable recording medium storing laser machining program

A laser processing method and laser processing technology, which are applied to lasers, metal processing, laser welding equipment, etc., can solve the problems of not considering the effect of thermal lens and the decline of processing quality, and achieve the effect of suppressing adverse effects

Active Publication Date: 2019-07-16
HITACHI SEIKO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the technology of this patent document 2 is a technology for stabilizing the output energy of a laser oscillator, and the thermal lens effect of the AOM is not considered.
According to paragraph 0046 of this patent document 2, there is the following shortcoming: the pulse width and the repetition frequency of the dummy pulse are changed every time the galvano scanner is driven, so the energy accepted by the AOM is constantly changing, and due to the effect of the thermal lens Variations lead to a decrease in processing quality

Method used

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  • Laser machining apparatus laser machining method and computer-readable recording medium storing laser machining program
  • Laser machining apparatus laser machining method and computer-readable recording medium storing laser machining program
  • Laser machining apparatus laser machining method and computer-readable recording medium storing laser machining program

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Embodiment 1

[0035] Figure 5 It is a block diagram of the laser drilling apparatus which becomes Example 1 of this invention. Concerning the respective components and connecting lines, those considered to be necessary for the description of the present embodiment are mainly shown, and not all of the components and connecting lines necessary for the laser drilling device are necessarily shown. The same applies to the block diagram of the laser drilling device shown below.

[0036] exist Figure 5 Among them, 1 is a printed circuit board to be processed placed on a table not shown in the figure, 2 is a laser oscillator that oscillates a laser pulse L1, and 3 is an AOM that directs the laser pulse L1 output from the laser oscillator 2 in the processing direction. The deflected laser deflection unit 4 is a light that is rotationally driven so as to irradiate the punching position of the printed circuit board 1 according to the processing data by changing the laser irradiation position of th...

Embodiment 2

[0074] Next, Embodiment 2 of the present invention will be described. Figure 7 It is a block diagram of a laser drilling device serving as the second embodiment. for with Figure 5 Add the same number for the same content. This laser drilling device is a so-called 2-axis laser drilling device that achieves high speed by performing processing at two positions in parallel. Figure 8 is for illustration Figure 7 The timing diagram of the oscillation of the laser pulse L1 in the laser drilling device.

[0075] exist Figure 7 Among them, 1-A and 1-B are printed substrates to be processed respectively. Hereinafter, the system for processing the printed circuit board 1 -A is referred to as the A axis, and the system for processing the printed circuit board 1 -B is referred to as the B axis. 12 is a beam splitter that splits the laser pulse oscillated from the laser oscillator 2 in two directions, and 3-A and 3-B respectively deflect the laser pulse output from the beam split...

Embodiment 3

[0086] Next, Embodiment 3 of the present invention will be described. Figure 9 It is a block diagram of the laser drilling apparatus used as Example 3. for with Figure 5 , Figure 7 Add the same number for the same content. This laser drilling device is a so-called 4-axis laser drilling device that achieves high speed by performing processing at four positions in parallel. Figure 10 with Figure 11 is for illustration Figure 9 Timing diagram of the oscillation of the laser pulse in the laser drilling device.

[0087] exist Figure 9 Among them, 1-C to 1-F are printed circuit boards to be processed respectively. Hereinafter, the systems for processing the printed circuit boards 1 -C to 1 -F are respectively referred to as C axis to F axis. 3-CD and 3-EF are AOMs that respectively deflect the laser pulses output from the beam splitter 12 from the non-processing direction to the processing direction, and the laser deflection parts 3-CD and 3-EF can simultaneously defl...

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Abstract

The invention discloses a laser processing apparatus, a laser processing method, and a recording medium on which a program for the same is recorded. In laser processing that causes the laser oscillator to oscillate out of the laser pulse in synchronization with the completion of the positioning operation by the optical scanner for changing the position of the laser irradiation, the light incidentfrom the laser pulse from the laser oscillator is suppressed from being incident on the light Adverse effects of variations in the thermal lens action on the optical elements in the path of the scanner. When the positioning operation in the optical scanner is completed, the time T at the time when the positioning operation is predicted is n*T0)T)(n-1)*T0 (T0 is a predetermined time, and n is 2 ormore. In the case of the integer), the first laser pulse n-1 having the same pulse width as the laser pulse for processing is oscillated every time a predetermined time T0 is oscillated from the oscillation time point to the time when the positioning operation is completed. Next, the second laser pulse having a pulse width shorter than the laser pulse for processing is oscillated once as a dummy pulse.

Description

technical field [0001] The present invention relates to a laser processing device, a laser processing method, and a recording medium for recording a program therefor, for drilling holes in, for example, a printed substrate using a laser. Background technique [0002] Conventionally, there is known a technique for synchronizing with the completion of a positioning operation by a galvano scanner for changing a laser irradiation position in a laser processing apparatus using a laser oscillator such as a carbon dioxide gas laser oscillator. The laser oscillator is made to oscillate the laser pulse, and the laser pulse output from the laser oscillator is deflected from the non-processing direction to the processing direction by using the laser deflection part of the acousto-optic element (hereinafter referred to as AOM), and the acousto-optic element is used so that Crystals such as germanium that generate diffraction gratings due to ultrasonic waves. [0003] In the case of usi...

Claims

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Application Information

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IPC IPC(8): B23K26/382B23K26/70H05K3/00
CPCB23K26/382B23K26/70B23K26/702H05K3/00B23K26/0622B23K26/064H01S3/10046B23K2101/42
Inventor 武川裕亮福岛智松本和也
Owner HITACHI SEIKO LTD
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