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A kind of preparation method of nitride ceramics

A technology of nitride ceramics and green bodies, which is applied in the direction of additive processing, etc., and can solve the problems of unfavorable nitride ceramic thermal conductivity, improvement and reduction of nitride ceramic thermal conductivity, etc.

Active Publication Date: 2021-01-26
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since nitride ceramics are prone to hydrolysis in a water-containing environment, additional oxygen elements will be introduced, which will drastically reduce the thermal conductivity of nitride ceramics in the later sintering process
If the existing impregnation and precipitation technology is applied to the preparation of nitride ceramics, more oxygen elements will be introduced into the nitride ceramics, which is not conducive to the improvement of the thermal conductivity of nitride ceramics

Method used

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  • A kind of preparation method of nitride ceramics
  • A kind of preparation method of nitride ceramics

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] The embodiment of the present application provides the first method for preparing nitride ceramics, and the specific steps are as follows:

[0065] 1. Weigh 68 parts by weight of aluminum nitride ceramic powder, 32 parts by weight of hexanediol diacrylate, and 1 part by weight of BYK 9076 dispersant, add 0.068 parts of Darocur 1173 photoinitiator after ball milling for 10 hours, and continue ball milling for 5 minutes to obtain Aluminum nitride ceramic slurry with a solid content of 40vol%.

[0066] 2. Use a light-curing 3D printer to carry out light-curing 3D printing and molding, control the laser wavelength to 250nm, and the exposure to 100mJ / cm 2 , the single-layer curing time is 1s, and the printing layer thickness is 50 μm; 3D printing is carried out according to the preset three-dimensional structure model, and a special-shaped aluminum nitride ceramic green body is obtained.

[0067] 3. Place the aluminum nitride ceramic green body in a vacuum furnace for degre...

Embodiment 2

[0076] The embodiment of the present application provides a second method for preparing nitride ceramics, and the specific steps are as follows:

[0077] 1. Weigh 72 parts by weight of aluminum nitride ceramic powder, 12 parts by weight of polyurethane acrylate, 14.6 parts by weight of n-butyl acrylate, and 1.4 parts by weight of SOLSPERSE 8000 dispersant, add 0.8 parts of Irgacure 184 photoinitiator after ball milling for 24 hours, continue Ball milled for 10 minutes to prepare an aluminum nitride ceramic slurry with a solid content of 44vol%.

[0078] 2. Use a light-curing 3D printer for light-curing 3D printing, control the laser wavelength to 460nm, and the exposure to 4mJ / cm 2 , the single-layer curing time is 15s, and the printing layer thickness is 10 μm; 3D printing is carried out according to the preset three-dimensional structure model, and a special-shaped aluminum nitride ceramic green body is obtained.

[0079] 3. Put the aluminum nitride ceramic green body in a ...

Embodiment 3

[0088] The embodiment of the present application provides a second method for preparing nitride ceramics, and the specific steps are as follows:

[0089] 1. Weigh 70 parts by weight of aluminum nitride ceramic powder, 14 parts by weight of pentaerythritol tetraacrylate, 14.9 parts by weight of hydroxyethyl methacrylate, and 1.1 parts by weight of BYK W9010 dispersant, and add 0.3 parts of TPO photoinitiator after ball milling for 12 hours , and continued ball milling for 8 minutes to obtain an aluminum nitride ceramic slurry with a solid content of 42vol%.

[0090] 2. Use a light-curing 3D printer to carry out light-curing 3D printing and molding, control the laser wavelength to 460nm, and the exposure to 15mJ / cm 2 , the single-layer curing time is 5s, and the printing layer thickness is 20μm; 3D printing is carried out according to the preset three-dimensional structure model, and a special-shaped aluminum nitride ceramic green body is obtained.

[0091] 3. Put the aluminum ...

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Abstract

The invention belongs to the technical field of ceramic material preparation, and in particular relates to a method for preparing nitride ceramics. The invention comprises: sequentially molding and calcining the nitride ceramic mixture; immersing the calcined green body in a non-water-based impregnating agent solution for impregnating treatment, and then immersing it in a precipitating agent solution for in-situ precipitation; The water-based impregnating agent solution includes solute A and solvent A, solute A is rare earth nitrate and alkaline earth nitrate, solvent A is an organic solvent; precipitant solution includes solute B and solvent B, solute B is an amine organic compound, and solvent B is Organic solvent; the impregnated body is dried, calcined and sintered in sequence to obtain nitride ceramics. This application solves the technical problem that the thermal conductivity of the nitride ceramic powder is reduced due to the hydrolysis of the nitride ceramic powder and the additional introduction of oxygen impurities in the traditional impregnation and precipitation technology, and the in-situ precipitation after impregnation makes the dispersion uniformity of the sintering aid good , which is conducive to improving the thermal conductivity and reliability of nitride ceramics.

Description

technical field [0001] The invention belongs to the technical field of preparation of ceramic materials, and in particular relates to a preparation method of nitride ceramics. Background technique [0002] Nitride ceramics are an important class of structural and functional materials with good mechanical, chemical, electrical, thermal and high-temperature physical properties, and are widely used in metallurgy, aviation, chemical, ceramics, electronics, machinery and semiconductor industries. Silicon nitride and aluminum nitride are hot spots in research and application. Among them, aluminum nitride ceramics have high thermal conductivity (theoretical thermal conductivity is 320W m -1 ·K -1 ), excellent electrical insulation performance, similar thermal expansion coefficient to chip materials such as silicon and gallium arsenide, low dielectric constant and dielectric loss, non-toxic and other excellent properties, making it a ceramic in high-energy / high-frequency integrate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/581C04B35/622C04B35/626C04B35/638B33Y10/00B33Y70/10
CPCB33Y10/00B33Y70/00C04B35/581C04B35/622C04B35/62605C04B35/638C04B2235/6026C04B2235/6562C04B2235/6567
Inventor 伍尚华聂光临黎业华
Owner GUANGDONG UNIV OF TECH