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A kind of sensitization solution and its sensitization process for electroless copper plating of non-metallic materials

A non-metallic material, chemical copper plating technology, applied in metal material coating process, liquid chemical plating, coating and other directions, can solve the problems of complex operation and high cost, achieve simple operation, reduce damage, good stability Effect

Active Publication Date: 2020-09-18
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods are complicated to operate and require the use of large-scale equipment and high cost

Method used

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  • A kind of sensitization solution and its sensitization process for electroless copper plating of non-metallic materials
  • A kind of sensitization solution and its sensitization process for electroless copper plating of non-metallic materials
  • A kind of sensitization solution and its sensitization process for electroless copper plating of non-metallic materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Prepare 5 grams of α-amylase and 1 liter of phosphate acid buffer solution with pH=6.8, fully dissolve the prepared α-amylase in the phosphate acid buffer to prepare α-amylase solution; prepare another After chemically roughening and degreasing the ABS plastic substrate, the ABS plastic substrate is immersed in the obtained α-amylase solution for reaction, and the reaction time is 10 minutes. The chemical roughening process is to prepare a roughening solution with 20% hydrogen peroxide solution and 80% concentrated sulfuric acid, and let the roughening solution stand until its temperature drops to 50°C, then put the original ABS plastic substrate into the roughening solution In the process, the surface of the original ABS plastic substrate is fully carbonized and roughened. The degreasing process is to put the roughened ABS plastic substrate into a composition containing 25g / L sodium hydroxide, 15g / L sodium bicarbonate and 20g / L trisodium phosphate. Degreasing in a wate...

Embodiment 2

[0033] Prepare 5 grams of 5-benzotriazole formic acid and 1 liter of pure water, fully dissolve the prepared 5-benzotriazole formic acid in pure water to prepare a 5-benzotriazole formic acid solution; prepare another chemically After roughening and degreasing the ABS plastic substrate, the ABS plastic is immersed in the obtained 5-benzotriazole formic acid solution for reaction, and the reaction time is 10 minutes. The chemical roughening process is to prepare a roughening solution with 20% hydrogen peroxide solution and 80% concentrated sulfuric acid, and let the roughening solution stand until its temperature drops to 50°C, then put the original ABS plastic substrate into the roughening solution In the process, the surface of the original ABS plastic substrate is fully carbonized and roughened. The degreasing process is to put the roughened ABS plastic substrate into a composition containing 25g / L sodium hydroxide, 15g / L sodium bicarbonate and 20g / L trisodium phosphate. Deg...

Embodiment 3

[0038]Prepare 5 grams of 5-benzotriazole formic acid and 1 liter of pure water, fully dissolve the prepared 5-benzotriazole formic acid in pure water to prepare a 5-benzotriazole formic acid solution; prepare another chemically After roughening and degreasing the glass substrate, the glass substrate was immersed in the obtained 5-benzotriazole formic acid solution to react, and the reaction time was 30 minutes. The chemical roughening process is to use 100ml / L of concentrated sulfuric acid and 100ml / L of hydrofluoric acid to prepare a roughening solution, put the original glass substrate into the roughening solution and react for 5 minutes, and the degreasing process is to roughen the Put the finished glass substrate into a degreasing solution containing 25g / L sodium hydroxide, 15g / L sodium bicarbonate and 20g / L trisodium phosphate, and degrease in a water bath at 40°C for 20min.

[0039] The reacted glass substrate was taken out, put into an oven for drying, the temperature o...

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Abstract

The invention discloses a sensitizing solution for chemical copper plating of a non-metallic material and a sensitizing technology thereof. The sensitizing technology has the principle that the adopted sensitizing solution is a protein aqueous solution with a certain concentration or a 5-benzotriazole formic acid aqueous solution with a certain concentration, a non-metallic material substrate obtained after chemical roughening is immersed into the sensitizing solution to react, the substrate is put into a drying box to be dried after being taken out, groups capable of adsorbing activated ionsare formed on the surface of the material after the substrate is dried in the drying box, and a large quantity of active ions can exist on the surface of the material through reduction of a reductionsolution to catalyze subsequent chemical copper plating. According to the sensitizing solution for chemical copper plating of the non-metallic material and the sensitizing technology thereof, the adopted sensitizing solution has the good stability and can be used for sensitizing for multiple times after being prepared at a time; meanwhile, compared with a traditional sensitizing solution and sensitizing technology, waste of precious metal can be reduced, and harm of a copper plating technology on a human body is reduced; and in addition, the technology is easy to operate, expensive and large instruments and equipment do not need to be used, and the technology cost is low.

Description

technical field [0001] The invention belongs to the technical field of material surface metallization, and in particular relates to a sensitizing solution and a sensitizing process for electroless copper plating of non-metallic materials. Background technique [0002] Due to their excellent chemical stability and mechanical properties, non-metallic materials such as glass, ceramics, and plastics are widely used in the electronics industry and automobile manufacturing. In order to further expand the application fields of these non-metallic materials, it is necessary to metallize their surfaces. Material surface metallization processes mainly include: brushing method, spraying process, chemical plating, vacuum sputtering, vapor deposition, etc. Electroless plating refers to the process in which metal ions undergo a reduction reaction and deposit on the surface of the material under the action of self-catalysis on the surface of the material through the reducing agent in the e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/28C23C18/40
CPCC23C18/1893C23C18/2086C23C18/40
Inventor 唐建成韦朝龙叶楠余方新赵玉超
Owner NANCHANG UNIV