Heat-conducting flame-retardant epoxy resin composite material and preparation method thereof

Abstract

The invention belongs to the field of composite materials, and discloses a heat-conducting flame-retardant epoxy resin composite material and a preparation method thereof. The composite material comprises an epoxy resin matrix and molybdenum disulfide coated reduced graphene oxide-silver nanowire aerogel, wherein the molybdenum disulfide coated reduced graphene oxide-silver nanowire aerogel is dispersed in the epoxy resin matrix; and the volume ratio of the epoxy resin matrix material to the molybdenum disulfide coated reduced graphene oxide-silver nanowire aerogel is 100: 1-100: 5. Accordingto the heat-conducting flame-retardant epoxy resin composite material, the molybdenum disulfide coated reduced graphene oxide-silver nanowire aerogel is added into the epoxy resin to serve as a filler, the adding ratio of the filler is controlled, and meanwhile, the overall process flow design and the like of the preparation method of the composite material are improved, so that the technical problems that the thermal conductivity and the flame retardance of an existing electronic packaging material are poor, and the processing performance and the mechanical performance of the epoxy resin matrix are influenced when too much filler is added can be solved.

Description

technical field [0001] The invention belongs to the field of composite materials, and more specifically relates to a heat-conducting and flame-retardant epoxy resin composite material and a preparation method thereof. Background technique [0002] As production and life have higher and higher requirements for computing power and computing speed of computers and other equipment, electronic components are increasingly showing a trend of miniaturization and miniaturization. Due to the high integration of the circuit, the heat generation density increases during operation, and the operating temperature increases. At the same time, due to the increase of its operating frequency, heat is continuously accumulated. The impact of temperature on integrated circuits is very serious, which will directly affect the service life and work sensitivity of integrated circuits, and there are also serious fire hazards. Therefore, flame-retardant packaging materials with high thermal conductiv...

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Problems solved by technology

[0005] In response to the above defects or improvement needs of the prior art, the object of the present invention is to provide a thermally conductive and flame-retardant epoxy resin composite material and its preparation method, wherein by adding a specific reducing molybdenum disulfide coated molybdenum disulfide to the epoxy resin Graphene oxide-silver nanowire airgel is used as a filler, and the addition ratio of the filler is controlled. At the same time, the overall process des

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