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A filler-free underfill and preparation method thereof

An underfill, filler-free technology, applied in the direction of adhesive, epoxy resin, adhesive type, etc., can solve the problems of unfavorable filling glue storage, low linear expansion coefficient, filler sedimentation, etc., and achieve good room temperature fluidity, The effect of low viscosity and high adhesion

Active Publication Date: 2021-05-07
江苏矽时代材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the above-mentioned component distribution ratio, the above-mentioned invention overcomes the defects of the existing underfill rubber and has the following characteristics: stable storage period; low viscosity, good fluidity, viscosity of 1000-2000 centipoise; low linear expansion coefficient, 20-40ppm / ℃; the shear strength is 15MPa, etc.; but the invention uses a large amount of inorganic filler, which may cause the sedimentation of the filler, which is not conducive to the storage of the filler

Method used

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  • A filler-free underfill and preparation method thereof
  • A filler-free underfill and preparation method thereof
  • A filler-free underfill and preparation method thereof

Examples

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preparation example Construction

[0027] The preparation method of the above-mentioned filler-free underfill glue comprises the following steps: (a) adding the toughened epoxy resin, the epoxy resin containing naphthalene ring and the epoxy resin of cycloaliphatic group into the container, adjusting the vacuum of the container degree and temperature, stir to obtain a resin mixture; (b) mix the oil-soluble black and part of the hexaic anhydride, and stir under heating conditions until the oil-soluble black dissolves; cool to room temperature, and confirm that there are no precipitated particles to obtain a masterbatch Mixture; (c) mixing the remaining formic anhydride, acid anhydride accelerator, defoamer, silane coupling agent and the masterbatch mixture to obtain a mixed cured material; (d) adding the resin mixture and the The mixed solidified material is stirred and mixed and the vacuum degree in the reaction kettle is controlled; it only needs to go through defoaming, filtering, testing, subpackaging and deg...

Embodiment 1

[0030] This embodiment provides a filler-free underfill, which includes the following raw material components in parts by weight: 10 parts of epoxy resin containing naphthalene ring (HP-4700), 28 parts of toughened epoxy resin (epoxy soybean oil ESO ), 12 parts of cycloaliphatic epoxy resin (CYCLOMER M100), 0.30 parts of defoamer (BYK-019), 40 parts of methanelic anhydride, 0.30 parts of silane coupling agent (KH-550), 0.35 parts of anhydride accelerator (PN-23) and 0.8 parts of oil-soluble black;

[0031] The preparation method of the above-mentioned filler-free underfill comprises the following steps:

[0032] Pretreatment: Clean the grinder, reaction kettle, stirring paddle and other equipment with ethanol, drain the cleaning solution, and wipe it with a clean dry cloth; close the reaction kettle, and vacuum for 10 minutes to remove residual ethanol. Before the experiment, dry the toughened epoxy resin and cycloaliphatic epoxy resin in a blast drying oven at 115°C for 2 ho...

Embodiment 2

[0038] This embodiment provides a filler-free underfill, which is basically the same as that in Embodiment 1, except that it includes the following raw material components in parts by weight: 15 parts of epoxy resin containing naphthalene ring, toughened epoxy resin 25 parts of resin, 8 parts of cycloaliphatic epoxy resin, 0.20 part of defoamer, 35 parts of methanelic anhydride, 0.20 part of silane coupling agent, 0.25 part of anhydride accelerator and 0.5 part of oil-soluble black.

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Abstract

The invention relates to a filler-free bottom filler and a preparation method thereof, which comprises the following raw material components in parts by weight: 10-15 parts of epoxy resin containing naphthalene ring; 25-28 parts of toughened epoxy resin; alicyclic 8~12 parts of epoxy resin; 0.20~0.30 parts of defoamer; 35~40 parts of methanelic anhydride; 0.20~0.30 parts of silane coupling agent; 0.25~0.35 parts of acid anhydride accelerator; By using the resin mixture formed by epoxy resin containing naphthalene ring, toughened epoxy resin and alicyclic epoxy resin to mix with other components, it is beneficial to ensure the uniform mixing of each component, so that it can be used without filler It has the advantages of good room temperature fluidity, high cohesive force, low viscosity and high Tg point.

Description

technical field [0001] The invention relates to a filler, in particular to a filler-free bottom filler and a preparation method thereof. Background technique [0002] With the continuous development of science and technology, the integration level of IC chips is getting higher and higher, and the application of flip chip mounting method is becoming more and more extensive; this mounting method is not realized by wire bonding, but by using small and thin solder The bumps connect the chip and the printed substrate. Due to the different thermal expansion coefficients of the chip, the printed substrate and the solder, thermal stress is prone to occur during the thermal shock test. At this time, the solder ball is prone to cracks and the reliability of the circuit performance is greatly reduced. At this time, the underfill can be used. Play the role of protecting the chip circuit surface and solder balls. [0003] The underfill glue is simply a chemical glue for underfilling th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J191/00
CPCC08L2205/025C08L2205/03C08L2205/06C09J163/00C08L63/00C08L91/00
Inventor 张传勇柯明新陈天基
Owner 江苏矽时代材料科技有限公司
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