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Preparation method of low-melting-point copolyamide hot melt adhesive

A technology of copolyamide and hot-melt adhesive, which is applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc. It can solve the problems of unsuitable bonding of high-grade fabrics, poor washing resistance, and low bonding strength. , to achieve rapid and effective response, good bonding effect and low melting point

Inactive Publication Date: 2019-08-30
SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such as CN10283616A discloses a kind of preparation method of low-melting point copolyamide hot-melt adhesive, it mainly selects the dibasic acid of carbon number 3-8 and the dibasic amine of carbon number 3-8 as main material, adopts high boiling point Monoamine is used as a molecular weight regulator to prepare copolyamide hot melt adhesives with a melting point of 100°C~120°C, but its main chain is all composed of short carbon chains, and only long chains are present at the ends, so its washing resistance is not very good. ; CN102924712A discloses a low-melting polyamide hot-melt adhesive with strong weather resistance and its preparation method, which mainly introduces an appropriate amount of long-chain dimer acid into the traditional polyamide to obtain a copolyamide hot-melt adhesive Its melting point is between 96°C and 128°C, and its melting point is low, but the introduction of dimer acid during polymerization will cause the product to turn yellow, which is not suitable for bonding high-grade fabrics; CN104559909B discloses a low melting point copolyamide hot melt adhesive and its preparation method, which mainly introduces long carbon chain nylon salt (nylon 1012 salt or nylon 1212 salt) into nylon 6 and 66, and the melting point of the obtained copolyamide is 95 ° C ~ 145 ° C, the melting point range is too large, and its adhesion Relatively low strength

Method used

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  • Preparation method of low-melting-point copolyamide hot melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A preparation method of low melting point copolyamide hot melt adhesive, the steps are as follows:

[0024] (1) Mix 98 g caprolactam, 116.91 g adipic acid, 70.79 g sebacic acid, 103.64 g dodecanedioic acid, 94.8 g hexamethylenediamine, 77.54 g decanediamine, 90.16 g dodecanediamine, 0.65 g Stearic acid, 1.96 g of antioxidant and 13 g of water were added to the reaction kettle, and nitrogen was replaced 3 times at first; then the temperature was slowly raised to 120°C, stirring was started, the temperature was continued to rise to 230°C, and the pressure was kept rising, at a pressure of 1.3MPa Reaction for 1.5h at ~1.5MPa, temperature 230℃~250℃;

[0025] (2) Reduce to normal pressure, add 1.3g of talc powder, react for 2 hours at a temperature of 230°C~250°C, and then pressurize and discharge to obtain the product.

[0026] The sample obtained in Example 1 is designated as N1.

Embodiment 2

[0028] A preparation method of low melting point copolyamide hot melt adhesive, the steps are as follows:

[0029] (1) 196 g caprolactam, 120.57 g adipic acid, 59.47 g undecanedioic acid, 67.19 g tridecanedioic acid, 80.19 g 2-methyl-1,5-pentanediamine, 54.11 g decanedidiamine, 75.34 g of dodecanediamine, 3.26 g of stearic acid, 0.33 g of antioxidant and 10 g of water were added to the reaction kettle, and the nitrogen was replaced 3 times at first; the temperature was slowly raised to 120°C, the stirring was started, and the temperature was continued to rise to 230°C. Keep the pressure rising continuously, and react for 1.5h under the conditions of pressure 1.3MPa~1.5MPa and temperature 230℃~250℃;

[0030] (2) Decrease to normal pressure, add 3.26 g of fumed silica, react at a temperature of 230°C to 250°C for 2 hours, and then pressurize and discharge.

[0031] The sample obtained in Example 2 is designated as N2.

Embodiment 3

[0033] A preparation method of low melting point copolyamide hot melt adhesive, the steps are as follows:

[0034] (1) 105 g caprolactam, 131.53 g adipic acid, 68.97 g sebacic acid, 105.67 g tetradecanedioic acid, 99.3 g hexamethylenediamine, 88.4 g decanediamine, 102.8 g dodecanediamine, 3.51 g Add stearic acid, 0.35 g antioxidant and 14 g water into the reaction kettle, and replace with nitrogen three times at first; slowly raise the temperature to 120°C, start stirring, continue to raise the temperature to 230°C, and keep the pressure rising continuously, at a pressure of 1.3MPa~ Reaction for 1.5h under the conditions of 1.5MPa and temperature 230℃~250℃;

[0035] (2) Reduce to normal pressure, add 3.51g of nano-calcium carbonate, react at a temperature of 230°C to 250°C for 2 hours, and then pressurize and discharge.

[0036] The sample obtained in Example 3 is designated as N3.

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Abstract

The invention discloses a preparation method of a low-melting-point copolyamide hot melt adhesive, which includes the steps of adding binary acid consisting of lactam and a mixture of adipic acid andlong carbon chain binary acid having 10 to 14 carbon atoms, diamine consisting of a mixture of short carbon chain diamine having 6 to 8 carbon atoms and long carbon chain diamine having 10 to 14 carbon atoms, a molecular weight modifier, an antioxidant and water to a kettle; first performing nitrogen replacement; then raising the temperature to 120 DEG C and starting to stir; continuing to raise the temperature to 230 DEG C, keeping the pressure rising continuously, and performing reaction at the pressure of 1.3 MPa to 1.5 MPa and temperature of 230 DEG C to 250 DEG C for 1.5 h; reducing the pressure to atmospheric pressure, adding inorganic filler, performing reaction for another 2 hours, and then pressurizing and discharging a material. The obtained copolyamide hot melt adhesive preparedby the preparation method of the invention has the advantages of low melting point, stability, short opening time, appropriate melt index, good bonding effect, and excellent water washing resistanceand dry cleaning resistance.

Description

technical field [0001] The invention relates to a preparation method of a low-melting-point copolyamide hot-melt adhesive, in particular to a preparation method of a low-melting-point copolyamide hot-melt adhesive suitable for clothing bonding. Background technique [0002] Copolyamide hot-melt adhesive mainly refers to a hot-melt adhesive prepared by melt polycondensation of aliphatic dibasic acid and dibasic amine. In terms of molecular structure, copolyamide hot-melt adhesives have strong intermolecular forces and interface electrostatic attraction, and have good affinity and strong adhesion to various materials; at the same time, copolyamide hot-melt adhesives are also It has the advantages of fast curing speed, environmental protection and pollution-free, stable physical and chemical properties, etc. It is widely used in bonding with fabrics, metals, plastics, leather and other materials. [0003] Garment fusible interlining is an important application field of copolya...

Claims

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Application Information

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IPC IPC(8): C09J177/00C09J11/04C08G69/36C08G69/04
CPCC08G69/04C08G69/36C08K2003/265C08K2201/011C09J11/04C09J177/00C08K3/34C08K3/36C08K3/26C08K7/14
Inventor 俞凯健林一流郑仁峰
Owner SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD
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